JP6207539B2 - 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品 - Google Patents

銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品 Download PDF

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Publication number
JP6207539B2
JP6207539B2 JP2015020701A JP2015020701A JP6207539B2 JP 6207539 B2 JP6207539 B2 JP 6207539B2 JP 2015020701 A JP2015020701 A JP 2015020701A JP 2015020701 A JP2015020701 A JP 2015020701A JP 6207539 B2 JP6207539 B2 JP 6207539B2
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JP
Japan
Prior art keywords
copper alloy
alloy strip
strength
aging
tensile strength
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Active
Application number
JP2015020701A
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English (en)
Japanese (ja)
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JP2016141878A (ja
Inventor
明宏 柿谷
明宏 柿谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2015020701A priority Critical patent/JP6207539B2/ja
Priority to TW105100143A priority patent/TWI589715B/zh
Priority to CN201610081111.9A priority patent/CN105838915B/zh
Priority to KR1020160014029A priority patent/KR101822374B1/ko
Publication of JP2016141878A publication Critical patent/JP2016141878A/ja
Application granted granted Critical
Publication of JP6207539B2 publication Critical patent/JP6207539B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/02Alloys based on copper with tin as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/05Alloys based on copper with manganese as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2015020701A 2015-02-04 2015-02-04 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品 Active JP6207539B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015020701A JP6207539B2 (ja) 2015-02-04 2015-02-04 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品
TW105100143A TWI589715B (zh) 2015-02-04 2016-01-05 Copper alloy strip and with its high-current electronic components and cooling electronic components
CN201610081111.9A CN105838915B (zh) 2015-02-04 2016-02-04 铜合金条、具备该铜合金条的大电流用电子元件以及散热用电子元件
KR1020160014029A KR101822374B1 (ko) 2015-02-04 2016-02-04 구리 합금조 및 그것을 구비하는 대전류용 전자 부품 및 방열용 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015020701A JP6207539B2 (ja) 2015-02-04 2015-02-04 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品

Publications (2)

Publication Number Publication Date
JP2016141878A JP2016141878A (ja) 2016-08-08
JP6207539B2 true JP6207539B2 (ja) 2017-10-04

Family

ID=56569932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015020701A Active JP6207539B2 (ja) 2015-02-04 2015-02-04 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品

Country Status (4)

Country Link
JP (1) JP6207539B2 (zh)
KR (1) KR101822374B1 (zh)
CN (1) CN105838915B (zh)
TW (1) TWI589715B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102226988B1 (ko) * 2016-10-05 2021-03-11 가부시키가이샤 고베 세이코쇼 방열 부품용 구리 합금판, 방열 부품, 및 방열 부품의 제조 방법
KR102259380B1 (ko) 2018-04-20 2021-06-01 주식회사 엘지에너지솔루션 버스바를 구비한 배터리 모듈 및 배터리 팩
TWI674326B (zh) * 2018-11-19 2019-10-11 財團法人工業技術研究院 銅鋯合金散熱元件及銅鋯合金殼體的製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05170916A (ja) 1991-12-20 1993-07-09 Tonen Corp ポリアリ−レンサルファイドとポリエステルとのグラフト共重合体の製法
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
JP3351023B2 (ja) * 1993-04-28 2002-11-25 三菱マテリアル株式会社 吊架線
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
JP2010013691A (ja) * 2008-07-03 2010-01-21 Kanazawa Univ 高強度及び高導電性銅合金板材
KR101521408B1 (ko) * 2009-01-26 2015-05-18 후루카와 덴키 고교 가부시키가이샤 배선용 전선 도체, 배선용 전선 도체의 제조방법, 배선용 전선 및 구리합금 소선
JP5320541B2 (ja) 2009-04-07 2013-10-23 株式会社Shカッパープロダクツ 電気・電子部品用銅合金材
JP5320642B2 (ja) 2009-04-17 2013-10-23 株式会社Shカッパープロダクツ 銅合金の製造方法及び銅合金
JP5060625B2 (ja) 2011-02-18 2012-10-31 三菱伸銅株式会社 Cu−Zr系銅合金板及びその製造方法
JP5525101B2 (ja) * 2012-10-22 2014-06-18 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP5380621B1 (ja) * 2013-03-25 2014-01-08 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP6301734B2 (ja) * 2014-05-26 2018-03-28 古河電気工業株式会社 銅合金材及びその製造方法

Also Published As

Publication number Publication date
CN105838915A (zh) 2016-08-10
TW201632634A (zh) 2016-09-16
CN105838915B (zh) 2018-05-08
TWI589715B (zh) 2017-07-01
KR20160096041A (ko) 2016-08-12
JP2016141878A (ja) 2016-08-08
KR101822374B1 (ko) 2018-01-29

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