JP6202020B2 - 半導体モジュール、半導体装置、及び、半導体装置の製造方法 - Google Patents
半導体モジュール、半導体装置、及び、半導体装置の製造方法 Download PDFInfo
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- General Engineering & Computer Science (AREA)
Description
出力端子OT3が請求項の第1端子の一例であり、ダミー端子DT3が請求項の第2端子の一例であり、高電位端子HT3が請求項の第3端子の一例であり、出力端子OT4が請求項の第4端子の一例であり、低電位端子LT4が請求項の第5端子の一例であり、ダミー端子DT4が請求項の第6端子の一例である。
本明細書または図面に説明した技術要素は、単独あるいは各種の組み合わせによって技術有用性を発揮するものであり、出願時請求項記載の組み合わせに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの1つの目的を達成すること自体で技術有用性を持つものである。
20−26:半導体装置
34、36:出力配線
37 :高電位バスバー
38 :低電位バスバー
40 :半導体チップ(IGBT)
42 :半導体チップ(ダイオード)
44 :封止樹脂
46、48:アンカー部
50 :冷却板
52 :連結管
70 :成形型
74 :キャビティ
76a :高電位端子受入溝
76b :低電位端子受入溝
76c :入出力端子受入溝
80 :電圧コンバータ
82、84:インバータ
90 :電源
91 :電源配線
92 :リアクトル
94 :モータ
96 :モータ
DT :ダミー端子
HT :高電位端子
LT :低電位端子
IT :入力端子
OT :出力端子
Claims (4)
- 半導体モジュールであって、
複数の第1半導体装置と、
複数の第2半導体装置と、
第1配線と、
第2配線、
を有し、
前記各第1半導体装置が、
第1封止樹脂と、
前記第1封止樹脂の内部から外部に突出する第1端子、第2端子及び第3端子と、
前記第1封止樹脂の内部に配置されているとともに少なくとも前記第1端子と前記第3端子に接続されている第1半導体チップ、
を有し、
前記各第2半導体装置が、
第2封止樹脂と、
前記第2封止樹脂の内部から外部に突出する第4端子、第5端子及び第6端子と、
前記第2封止樹脂の内部に配置されており、前記第4端子と前記第5端子に接続されており、前記第6端子に接続されていない第2半導体チップ、
を有し、
前記複数の第1半導体装置と前記複数の第2半導体装置が積層されており、
前記第1端子と前記第4端子が前記積層方向に沿って一列に配列されており、
前記第2端子と前記第5端子が前記積層方向に沿って一列に配列されており、
前記第3端子と前記第6端子が前記積層方向に沿って一列に配列されており、
前記第1配線が、前記第2端子と前記第5端子の列に沿って伸びており、前記第5端子に接続されており、
前記第2配線が、前記第3端子と前記第6端子の列に沿って伸びており、前記第3端子に接続されている、
半導体モジュール。 - 前記第6端子の前記第2封止樹脂の内部の部分が、前記第6端子が前記第2封止樹脂の内部から外部に向かって引っ張られたときに前記第2封止樹脂と当接するアンカー部を有する請求項1の半導体モジュール。
- 前記第2配線が、前記第6端子に接続されている請求項1または2の半導体モジュール。
- 前記第2配線が、前記第6端子に接続されていない請求項1または2の半導体モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015035491A JP6202020B2 (ja) | 2015-02-25 | 2015-02-25 | 半導体モジュール、半導体装置、及び、半導体装置の製造方法 |
US14/988,180 US10043735B2 (en) | 2015-02-25 | 2016-01-05 | Semiconductor module, semiconductor device, and method for manufacturing semiconductor devices |
DE102016102305.1A DE102016102305B4 (de) | 2015-02-25 | 2016-02-10 | Halbleitermodul |
CN201610101930.5A CN105914203B (zh) | 2015-02-25 | 2016-02-24 | 半导体模块、半导体装置以及半导体装置的制造方法 |
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JP2015035491A JP6202020B2 (ja) | 2015-02-25 | 2015-02-25 | 半導体モジュール、半導体装置、及び、半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2016157850A JP2016157850A (ja) | 2016-09-01 |
JP6202020B2 true JP6202020B2 (ja) | 2017-09-27 |
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JP2015035491A Expired - Fee Related JP6202020B2 (ja) | 2015-02-25 | 2015-02-25 | 半導体モジュール、半導体装置、及び、半導体装置の製造方法 |
Country Status (4)
Country | Link |
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US (1) | US10043735B2 (ja) |
JP (1) | JP6202020B2 (ja) |
CN (1) | CN105914203B (ja) |
DE (1) | DE102016102305B4 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6610568B2 (ja) * | 2017-01-16 | 2019-11-27 | 株式会社デンソー | 半導体装置 |
WO2018220214A1 (de) | 2017-06-02 | 2018-12-06 | Bombardier Transportation Gmbh | Leistungsphasenmodul eines umrichters, umrichter, und fahrzeug |
JP6836201B2 (ja) | 2017-12-19 | 2021-02-24 | 株式会社デンソー | 電力変換装置 |
DE102018219880B4 (de) * | 2018-11-20 | 2023-11-16 | Danfoss Silicon Power Gmbh | Leistungselektrikanordnung |
JP7137516B2 (ja) * | 2019-04-12 | 2022-09-14 | 株式会社日立製作所 | 半導体装置および電力変換装置 |
JP7111079B2 (ja) | 2019-09-10 | 2022-08-02 | 株式会社デンソー | 電力変換装置 |
JP7156319B2 (ja) * | 2020-01-22 | 2022-10-19 | 株式会社デンソー | 電力変換装置 |
CN113114061B (zh) * | 2021-03-26 | 2022-06-24 | 台达电子企业管理(上海)有限公司 | 变换器及抑制变换器的环流干扰的方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04284656A (ja) * | 1991-03-14 | 1992-10-09 | Fuji Electric Co Ltd | 樹脂封止形半導体装置およびリードフレーム |
US7009291B2 (en) | 2002-12-25 | 2006-03-07 | Denso Corporation | Semiconductor module and semiconductor device |
JP4123098B2 (ja) | 2003-07-25 | 2008-07-23 | 株式会社デンソー | 端子接続構造 |
JP2005311321A (ja) * | 2004-03-22 | 2005-11-04 | Sharp Corp | 半導体装置およびその製造方法、並びに、該半導体装置を備えた液晶モジュールおよび半導体モジュール |
JP4506848B2 (ja) | 2008-02-08 | 2010-07-21 | 株式会社デンソー | 半導体モジュール |
JP2010118712A (ja) * | 2010-03-04 | 2010-05-27 | Renesas Technology Corp | Qfnパッケージの製造方法 |
JP5947537B2 (ja) | 2011-04-19 | 2016-07-06 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
US8823041B2 (en) * | 2011-10-27 | 2014-09-02 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting module comprising the same |
WO2015001648A1 (ja) * | 2013-07-04 | 2015-01-08 | 三菱電機株式会社 | 半導体装置の製造方法、半導体装置 |
-
2015
- 2015-02-25 JP JP2015035491A patent/JP6202020B2/ja not_active Expired - Fee Related
-
2016
- 2016-01-05 US US14/988,180 patent/US10043735B2/en active Active
- 2016-02-10 DE DE102016102305.1A patent/DE102016102305B4/de active Active
- 2016-02-24 CN CN201610101930.5A patent/CN105914203B/zh active Active
Also Published As
Publication number | Publication date |
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US20160247793A1 (en) | 2016-08-25 |
DE102016102305B4 (de) | 2020-01-23 |
US10043735B2 (en) | 2018-08-07 |
CN105914203B (zh) | 2018-06-22 |
DE102016102305A1 (de) | 2016-08-25 |
JP2016157850A (ja) | 2016-09-01 |
CN105914203A (zh) | 2016-08-31 |
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