JP6193951B2 - 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 - Google Patents

樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 Download PDF

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JP6193951B2
JP6193951B2 JP2015205325A JP2015205325A JP6193951B2 JP 6193951 B2 JP6193951 B2 JP 6193951B2 JP 2015205325 A JP2015205325 A JP 2015205325A JP 2015205325 A JP2015205325 A JP 2015205325A JP 6193951 B2 JP6193951 B2 JP 6193951B2
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resin
electronic component
plate
mold
release film
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JP2016015522A (ja
JP2016015522A5 (enExample
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浦上　浩
浩 浦上
敬太 水間
敬太 水間
一太郎 岡本
一太郎 岡本
直毅 高田
直毅 高田
中村　守
守 中村
信介 安田
信介 安田
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Towa Corp
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2015205325A 2015-10-19 2015-10-19 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 Active JP6193951B2 (ja)

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JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

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* Cited by examiner, † Cited by third party
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JP3190702B2 (ja) * 1990-10-08 2001-07-23 株式会社東芝 半導体装置の製造方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5128363B2 (ja) * 2008-05-02 2013-01-23 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法及び金型
JP2011187877A (ja) * 2010-03-11 2011-09-22 Panasonic Corp 半導体装置及びその製造方法
US8012799B1 (en) * 2010-06-08 2011-09-06 Freescale Semiconductor, Inc. Method of assembling semiconductor device with heat spreader
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置

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