JP6184886B2 - 記憶装置 - Google Patents
記憶装置 Download PDFInfo
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- JP6184886B2 JP6184886B2 JP2014029940A JP2014029940A JP6184886B2 JP 6184886 B2 JP6184886 B2 JP 6184886B2 JP 2014029940 A JP2014029940 A JP 2014029940A JP 2014029940 A JP2014029940 A JP 2014029940A JP 6184886 B2 JP6184886 B2 JP 6184886B2
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- 238000011084 recovery Methods 0.000 claims description 72
- 230000008859 change Effects 0.000 claims description 35
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 107
- 239000010408 film Substances 0.000 description 54
- 238000010586 diagram Methods 0.000 description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 28
- 229910052710 silicon Inorganic materials 0.000 description 28
- 239000010703 silicon Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 24
- 238000012545 processing Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000000969 carrier Substances 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 230000005684 electric field Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 210000001520 comb Anatomy 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101001139126 Homo sapiens Krueppel-like factor 6 Proteins 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- -1 ZnMn 2 O 4 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0097—Erasing, e.g. resetting, circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
- H10B63/34—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors of the vertical channel field-effect transistor type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/84—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
- H10B63/845—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays the switching components being connected to a common vertical conductor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/71—Three dimensional array
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
Landscapes
- Semiconductor Memories (AREA)
Description
図1は、メモリセルアレイの一例を示している。
図4は、記憶装置の全体構成を示すブロック図の一例である。
上述の記憶装置の動作を説明する。
次に、メモリセルに情報を記憶する書き込み動作を説明する。
次に、メモリセルに保持された情報の消去動作について、引き続き、図7及び図8を用いて説明する。
次に、メモリセルからの情報の読み出し動作について、引き続き、図7及び図8を用いて説明する。
選択素子SSの経時変化について説明する。
図9は、第一の実施例に係わる選択素子の回復動作を示すフローチャートの一例である。図10は、図9のループでSET動作を行ったときの各ノードの電圧の時間依存の一例を示し、図11は、図9のループでRESET動作を行ったときの各ノードの電圧の時間依存の一例を示している。
図12は、第二の実施例に係わる選択素子の回復動作を示すフローチャートの一例である。図13は、図12のループでSET動作を行ったときの各ノードの電圧の時間依存の一例を示し、図14は、図12のループでRESET動作を行ったときの各ノードの電圧の時間依存の一例を示している。
図15は、第三の実施例に係わる選択素子の回復動作を示すフローチャートの一例である。図16は、図15のループでSET動作を行ったときの各ノードの電圧の時間依存の一例を示し、図17は、図15のループでRESET動作を行ったときの各ノードの電圧の時間依存の一例を示している。
図18は、第四の実施例に係わる選択素子の回復動作を示すフローチャートの一例である。図37は、図18のループでSET動作を行ったときの各ノードの電圧の時間依存の一例を示す。図38は、図18のループでRESET動作を行ったときの各ノードの電圧の時間依存の一例を示す。
次に、上述の実施例に係わる記憶装置の製造方法を説明する。
本実施例によれば、製造が容易で、高集積化の可能な三次元記憶装置において、選択トランジスタの閾値シフトを抑え、高性能化を図ることができる。
Claims (9)
- 第一の方向に延びる第一の導電線と、
前記第一の方向と交差する第二の方向に延びる複数の第二の導電線と、
前記第一及び第二の方向と交差する第三の方向に延びる第三の導電線と、
前記複数の第二の導電線と前記第三の導電線との間にそれぞれ接続される複数の抵抗変化素子と、
前記第三の導電線の一端と前記第一の導電線との間に接続される半導体層と、
前記半導体層をチャネルとして使用し、選択ゲート電極を有する選択FETと、
前記複数の抵抗変化素子のうちの少なくとも1つのセット/リセット動作を実行し、前記セット/リセット動作後に、前記第一の導電線を第一の電位にし、前記選択ゲート電極を第二の電位にし、1つの第三の導電線に抵抗変化素子を介して接続される前記複数の第二の導電線の全てを第三の電位にし、前記第一の電位と前記第三の電位の少なくとも一方を前記第二の電位よりも高くすることにより、前記選択FETのしきい値電圧変動を調整する回復動作を実行する制御回路と、
を具備し、
前記回復動作時に前記選択FETに流れる電流の向きは、前記セット/リセット動作時に前記選択FETに流れる電流の向きと同じである記憶装置。 - 前記第一及び第三の電位は互いに異なる請求項1に記載の記憶装置。
- 前記第一及び第三の電位は互いに等しい請求項1に記載の記憶装置。
- 前記第一及び第三の電位の電位差は、前記セット/リセット動作時の、前記第一の導電線の電位と前記複数の第二の導電線のうち非選択の複数の導電線の各々の電位との電位差よりも大きい請求項1または2に記載の記憶装置。
- 前記第一の電位は、前記セット/リセット動作時の前記第一の導電線の電位に等しい請求項1乃至4のいずれかに記載の記憶装置。
- 前記第二の電位は、前記セット/リセット動作時の前記選択ゲート電極の電位よりも小さい請求項1乃至5のいずれかに記載の記憶装置。
- 前記第二の電位は接地電位である請求項6に記載の記憶装置。
- 前記第三の電位は、前記セット/リセット動作時の、前記複数の第二の導電線のうち選択された導電線及び非選択の複数の導電線の各々の電位とはそれぞれ異なる請求項1乃至7のいずれかに記載の記憶装置。
- 前記第一の導電線に接続される電流検出回路をさらに具備し、
前記制御回路は、前記電流検出回路の出力値に基づいて前記回復動作の条件を変更する請求項1乃至8のいずれかに記載の記憶装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361823026P | 2013-05-14 | 2013-05-14 | |
US61/823,026 | 2013-05-14 | ||
US14/025,146 US8971093B2 (en) | 2013-05-14 | 2013-09-12 | Memory device and method of controlling memory device |
US14/025,146 | 2013-09-12 |
Publications (2)
Publication Number | Publication Date |
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JP2014225314A JP2014225314A (ja) | 2014-12-04 |
JP6184886B2 true JP6184886B2 (ja) | 2017-08-23 |
Family
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JP2014029940A Active JP6184886B2 (ja) | 2013-05-14 | 2014-02-19 | 記憶装置 |
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US (2) | US8971093B2 (ja) |
JP (1) | JP6184886B2 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8891277B2 (en) | 2011-12-07 | 2014-11-18 | Kabushiki Kaisha Toshiba | Memory device |
US9673389B2 (en) | 2012-01-24 | 2017-06-06 | Kabushiki Kaisha Toshiba | Memory device |
US8963115B2 (en) | 2013-04-12 | 2015-02-24 | Kabushiki Kaisha Toshiba | Memory device and method of manufacturing memory device |
US8971093B2 (en) * | 2013-05-14 | 2015-03-03 | Kabushiki Kaisha Toshiba | Memory device and method of controlling memory device |
US9129677B2 (en) | 2013-11-26 | 2015-09-08 | Kabushiki Kaisha Toshiba | Memory device and method of controlling memory device |
US20150213884A1 (en) * | 2014-01-30 | 2015-07-30 | University Of Dayton | Partitioned resistive memory array |
US9455257B2 (en) | 2014-09-04 | 2016-09-27 | Kabushiki Kaisha Toshiba | Semiconductor memory device and method of manufacturing the same |
US9349446B2 (en) | 2014-09-04 | 2016-05-24 | Kabushiki Kaisha Toshiba | Semiconductor memory device and method of controlling the same |
JP2016063026A (ja) * | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 再構成可能な回路 |
US9418737B2 (en) * | 2014-12-31 | 2016-08-16 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and method of controlling the same |
US9508430B2 (en) | 2015-03-10 | 2016-11-29 | Kabushiki Kaisha Toshiba | Three dimensional memory device including memory cells with resistance change layers |
US9653681B2 (en) | 2015-03-12 | 2017-05-16 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
US20180137927A1 (en) * | 2016-04-16 | 2018-05-17 | Chengdu Haicun Ip Technology Llc | Three-Dimensional Vertical One-Time-Programmable Memory Comprising No Separate Diode Layer |
JP6373466B1 (ja) * | 2017-09-19 | 2018-08-15 | 株式会社東芝 | 不揮発性記憶装置 |
CN108962309B (zh) * | 2018-06-29 | 2021-12-28 | 西安交通大学 | 一种高能量利用率低功耗的堆叠sram阵列结构 |
JP2020047824A (ja) | 2018-09-20 | 2020-03-26 | キオクシア株式会社 | 抵抗変化型メモリ |
JP2020149746A (ja) | 2019-03-14 | 2020-09-17 | キオクシア株式会社 | 半導体記憶装置 |
KR102626726B1 (ko) * | 2019-11-15 | 2024-01-17 | 김준성 | 칼코겐 화합물을 포함하는 메모리 셀을 위한 조성물, 구조, 제조 방법 및 작동 방법 |
Family Cites Families (14)
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JP4335659B2 (ja) | 2003-12-19 | 2009-09-30 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置 |
KR100624463B1 (ko) | 2005-03-12 | 2006-09-19 | 삼성전자주식회사 | 노어 구조의 하이브리드 멀티비트 비휘발성 메모리 소자 및그 동작 방법 |
JP2007193862A (ja) * | 2006-01-17 | 2007-08-02 | Toshiba Corp | 不揮発性半導体記憶装置 |
KR100741466B1 (ko) * | 2006-05-22 | 2007-07-20 | 삼성전자주식회사 | 비휘발성 기억 장치의 동작 방법 |
JP5082130B2 (ja) * | 2008-02-19 | 2012-11-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8300448B2 (en) | 2008-03-25 | 2012-10-30 | Nec Corporation | Semiconductor storage device, memory cell array, and a fabrication method and drive method of a semiconductor storage device |
JP2010170591A (ja) | 2009-01-20 | 2010-08-05 | Toshiba Corp | 不揮発性半導体記憶装置及びその駆動方法 |
JP5204825B2 (ja) * | 2010-09-17 | 2013-06-05 | シャープ株式会社 | 半導体記憶装置 |
EP2731109B1 (en) | 2010-12-14 | 2016-09-07 | SanDisk Technologies LLC | Architecture for three dimensional non-volatile storage with vertical bit lines |
US8824183B2 (en) | 2010-12-14 | 2014-09-02 | Sandisk 3D Llc | Non-volatile memory having 3D array of read/write elements with vertical bit lines and select devices and methods thereof |
US8891277B2 (en) * | 2011-12-07 | 2014-11-18 | Kabushiki Kaisha Toshiba | Memory device |
US9673389B2 (en) | 2012-01-24 | 2017-06-06 | Kabushiki Kaisha Toshiba | Memory device |
US8963115B2 (en) | 2013-04-12 | 2015-02-24 | Kabushiki Kaisha Toshiba | Memory device and method of manufacturing memory device |
US8971093B2 (en) * | 2013-05-14 | 2015-03-03 | Kabushiki Kaisha Toshiba | Memory device and method of controlling memory device |
-
2013
- 2013-09-12 US US14/025,146 patent/US8971093B2/en active Active
-
2014
- 2014-02-19 JP JP2014029940A patent/JP6184886B2/ja active Active
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2015
- 2015-02-04 US US14/613,837 patent/US9472283B2/en active Active
Also Published As
Publication number | Publication date |
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US20140340956A1 (en) | 2014-11-20 |
US8971093B2 (en) | 2015-03-03 |
JP2014225314A (ja) | 2014-12-04 |
US20150162082A1 (en) | 2015-06-11 |
US9472283B2 (en) | 2016-10-18 |
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