JP6181511B2 - 半導体パッケージ用ステム及び半導体パッケージ - Google Patents

半導体パッケージ用ステム及び半導体パッケージ Download PDF

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JP6181511B2
JP6181511B2 JP2013220438A JP2013220438A JP6181511B2 JP 6181511 B2 JP6181511 B2 JP 6181511B2 JP 2013220438 A JP2013220438 A JP 2013220438A JP 2013220438 A JP2013220438 A JP 2013220438A JP 6181511 B2 JP6181511 B2 JP 6181511B2
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element mounting
emitting element
light emitting
mounting portion
semiconductor package
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JP2015082609A (ja
JP2015082609A5 (enExample
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顕久 渡辺
顕久 渡辺
渉 片山
渉 片山
小島　哲也
哲也 小島
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2013220438A 2013-10-23 2013-10-23 半導体パッケージ用ステム及び半導体パッケージ Active JP6181511B2 (ja)

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JP2015082609A JP2015082609A (ja) 2015-04-27
JP2015082609A5 JP2015082609A5 (enExample) 2016-09-15
JP6181511B2 true JP6181511B2 (ja) 2017-08-16

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053548A (ja) * 2019-01-31 2022-04-06 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び電子部品搭載用パッケージの基体
JP2022116383A (ja) * 2019-06-28 2022-08-10 京セラ株式会社 電子素子搭載用パッケージ及び電子装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02174179A (ja) * 1988-12-26 1990-07-05 Hitachi Ltd 光電子装置およびその製造方法
JP2005019973A (ja) * 2003-05-30 2005-01-20 Shinko Electric Ind Co Ltd 光半導体素子用ステムの製造方法
JP4926458B2 (ja) * 2005-11-17 2012-05-09 新光電気工業株式会社 光半導体素子用ステムの製造方法

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