JP2015082609A5 - - Google Patents

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Publication number
JP2015082609A5
JP2015082609A5 JP2013220438A JP2013220438A JP2015082609A5 JP 2015082609 A5 JP2015082609 A5 JP 2015082609A5 JP 2013220438 A JP2013220438 A JP 2013220438A JP 2013220438 A JP2013220438 A JP 2013220438A JP 2015082609 A5 JP2015082609 A5 JP 2015082609A5
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JP
Japan
Prior art keywords
mounting portion
element mounting
emitting element
light emitting
stem
Prior art date
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Application number
JP2013220438A
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English (en)
Japanese (ja)
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JP2015082609A (ja
JP6181511B2 (ja
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Priority to JP2013220438A priority Critical patent/JP6181511B2/ja
Priority claimed from JP2013220438A external-priority patent/JP6181511B2/ja
Publication of JP2015082609A publication Critical patent/JP2015082609A/ja
Publication of JP2015082609A5 publication Critical patent/JP2015082609A5/ja
Application granted granted Critical
Publication of JP6181511B2 publication Critical patent/JP6181511B2/ja
Active legal-status Critical Current
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JP2013220438A 2013-10-23 2013-10-23 半導体パッケージ用ステム及び半導体パッケージ Active JP6181511B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013220438A JP6181511B2 (ja) 2013-10-23 2013-10-23 半導体パッケージ用ステム及び半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013220438A JP6181511B2 (ja) 2013-10-23 2013-10-23 半導体パッケージ用ステム及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2015082609A JP2015082609A (ja) 2015-04-27
JP2015082609A5 true JP2015082609A5 (enExample) 2016-09-15
JP6181511B2 JP6181511B2 (ja) 2017-08-16

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ID=53013049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013220438A Active JP6181511B2 (ja) 2013-10-23 2013-10-23 半導体パッケージ用ステム及び半導体パッケージ

Country Status (1)

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JP (1) JP6181511B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022053548A (ja) * 2019-01-31 2022-04-06 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び電子部品搭載用パッケージの基体
JP2022116383A (ja) * 2019-06-28 2022-08-10 京セラ株式会社 電子素子搭載用パッケージ及び電子装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02174179A (ja) * 1988-12-26 1990-07-05 Hitachi Ltd 光電子装置およびその製造方法
JP2005019973A (ja) * 2003-05-30 2005-01-20 Shinko Electric Ind Co Ltd 光半導体素子用ステムの製造方法
JP4926458B2 (ja) * 2005-11-17 2012-05-09 新光電気工業株式会社 光半導体素子用ステムの製造方法

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