JP6164722B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6164722B2
JP6164722B2 JP2012273958A JP2012273958A JP6164722B2 JP 6164722 B2 JP6164722 B2 JP 6164722B2 JP 2012273958 A JP2012273958 A JP 2012273958A JP 2012273958 A JP2012273958 A JP 2012273958A JP 6164722 B2 JP6164722 B2 JP 6164722B2
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JP
Japan
Prior art keywords
semiconductor device
semiconductor chip
output terminal
output
bonding wire
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JP2012273958A
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English (en)
Japanese (ja)
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JP2014120582A5 (https=
JP2014120582A (ja
Inventor
真吾 井上
真吾 井上
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Sumitomo Electric Device Innovations Inc
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Sumitomo Electric Device Innovations Inc
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Priority to JP2012273958A priority Critical patent/JP6164722B2/ja
Publication of JP2014120582A publication Critical patent/JP2014120582A/ja
Publication of JP2014120582A5 publication Critical patent/JP2014120582A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Semiconductor Integrated Circuits (AREA)
  • Amplifiers (AREA)
JP2012273958A 2012-12-14 2012-12-14 半導体装置 Active JP6164722B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012273958A JP6164722B2 (ja) 2012-12-14 2012-12-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012273958A JP6164722B2 (ja) 2012-12-14 2012-12-14 半導体装置

Publications (3)

Publication Number Publication Date
JP2014120582A JP2014120582A (ja) 2014-06-30
JP2014120582A5 JP2014120582A5 (https=) 2016-02-04
JP6164722B2 true JP6164722B2 (ja) 2017-07-19

Family

ID=51175184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012273958A Active JP6164722B2 (ja) 2012-12-14 2012-12-14 半導体装置

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JP (1) JP6164722B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569417B2 (ja) * 2015-09-16 2019-09-04 三菱電機株式会社 増幅器
JP2019102908A (ja) 2017-11-30 2019-06-24 ソニーセミコンダクタソリューションズ株式会社 高周波増幅器、電子機器および通信機器
CN111788680B (zh) * 2018-01-18 2024-12-06 维尔塞特公司 模块化功率放大器设备和架构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124745A (ja) * 1982-12-30 1984-07-18 Fujitsu Ltd 半導体装置
JPS6173352A (ja) * 1984-09-18 1986-04-15 Toshiba Corp マイクロ波ｆｅｔ増幅器
JPH01296702A (ja) * 1988-05-25 1989-11-30 Hitachi Ltd 半導体パッケージ
JP2589344B2 (ja) * 1988-06-10 1997-03-12 山形日本電気株式会社 高周波半導体装置
JP3728393B2 (ja) * 2000-02-16 2005-12-21 三菱電機株式会社 半導体装置

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JP2014120582A (ja) 2014-06-30

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