JP6158023B2 - プローブカード用ファインピッチインターフェース - Google Patents

プローブカード用ファインピッチインターフェース Download PDF

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Publication number
JP6158023B2
JP6158023B2 JP2013207093A JP2013207093A JP6158023B2 JP 6158023 B2 JP6158023 B2 JP 6158023B2 JP 2013207093 A JP2013207093 A JP 2013207093A JP 2013207093 A JP2013207093 A JP 2013207093A JP 6158023 B2 JP6158023 B2 JP 6158023B2
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Japan
Prior art keywords
power
ground
conductive
fine pitch
probe head
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JP2013207093A
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English (en)
Japanese (ja)
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JP2014074716A (ja
JP2014074716A5 (enExample
Inventor
カ・ガ・チュイ
Original Assignee
コラド・テクノロジー・インコーポレーテッド
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Publication date
Priority claimed from US13/644,162 external-priority patent/US20140091818A1/en
Priority claimed from US13/707,966 external-priority patent/US9151799B2/en
Application filed by コラド・テクノロジー・インコーポレーテッド filed Critical コラド・テクノロジー・インコーポレーテッド
Publication of JP2014074716A publication Critical patent/JP2014074716A/ja
Publication of JP2014074716A5 publication Critical patent/JP2014074716A5/ja
Application granted granted Critical
Publication of JP6158023B2 publication Critical patent/JP6158023B2/ja
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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013207093A 2012-10-03 2013-10-02 プローブカード用ファインピッチインターフェース Active JP6158023B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US13/644,162 2012-10-03
US13/644,162 US20140091818A1 (en) 2012-10-03 2012-10-03 Fine pitch interface for probe card
US13/707,966 US9151799B2 (en) 2012-10-03 2012-12-07 Fine pitch interface for probe card
US13/707,966 2012-12-07
US13/935,112 2013-07-03
US13/935,112 US20140091826A1 (en) 2012-10-03 2013-07-03 Fine pitch interface for probe card

Publications (3)

Publication Number Publication Date
JP2014074716A JP2014074716A (ja) 2014-04-24
JP2014074716A5 JP2014074716A5 (enExample) 2016-11-17
JP6158023B2 true JP6158023B2 (ja) 2017-07-05

Family

ID=50384565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013207093A Active JP6158023B2 (ja) 2012-10-03 2013-10-02 プローブカード用ファインピッチインターフェース

Country Status (3)

Country Link
US (1) US20140091826A1 (enExample)
JP (1) JP6158023B2 (enExample)
TW (1) TW201415037A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101918277B1 (ko) 2016-05-12 2018-11-13 싱크-테크 시스템 코포레이션 프로브 카드 모듈
US10633560B2 (en) 2010-12-28 2020-04-28 Bostik Sa Cross-linking method and associated device

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101136534B1 (ko) * 2010-09-07 2012-04-17 한국기계연구원 프로브 카드 및 이의 제조 방법
US9817029B2 (en) * 2011-12-07 2017-11-14 Taiwan Semiconductor Manufacturing Co., Ltd. Test probing structure
US11481596B2 (en) * 2013-01-18 2022-10-25 Amatech Group Limited Smart cards with metal layer(s) and methods of manufacture
TWI617811B (zh) * 2016-04-22 2018-03-11 新特系統股份有限公司 探針卡
US20190271721A1 (en) * 2016-09-30 2019-09-05 Dae-woo Kim Self aligned sort probe card for si bridge wafer
IT201600127581A1 (it) * 2016-12-16 2018-06-16 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio
TWI713807B (zh) 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
TWI613636B (zh) 2016-12-28 2018-02-01 財團法人工業技術研究院 驅動裝置以及驅動方法
TWI626453B (zh) * 2017-09-29 2018-06-11 中華精測科技股份有限公司 探針組件及其空間轉換介面板
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
TWI714172B (zh) * 2019-07-17 2020-12-21 中華精測科技股份有限公司 晶圓探針卡改良結構
TWI732326B (zh) * 2019-10-29 2021-07-01 華邦電子股份有限公司 短路探針卡、晶圓測試系統以及晶圓測試系統的故障原因檢測方法
TWI810885B (zh) * 2021-04-16 2023-08-01 旺矽科技股份有限公司 用於半導體測試之電路板
US12235315B2 (en) * 2022-03-31 2025-02-25 Advantest Test Solutions, Inc. Test system support component exchange system and method
IT202200026184A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Scheda di misura per un’apparecchiatura di test di dispositivi elettronici
IT202200026178A1 (it) * 2022-12-21 2024-06-21 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici
TWI866029B (zh) * 2023-01-13 2024-12-11 旺矽科技股份有限公司 探針卡及探針卡的待測物側模組
WO2025238766A1 (ja) * 2024-05-15 2025-11-20 日本電子材料株式会社 プローブカード
WO2025238765A1 (ja) * 2024-05-15 2025-11-20 日本電子材料株式会社 プローブカード

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60118765U (ja) * 1984-01-20 1985-08-10 日本電子材料株式会社 プロ−ブカ−ド
KR100196195B1 (ko) * 1991-11-18 1999-06-15 이노우에 쥰이치 프로우브 카드
US6667631B2 (en) * 2001-12-27 2003-12-23 Stmicroelectronics, Inc. High temperature probe card
US6897666B2 (en) * 2002-12-31 2005-05-24 Intel Corporation Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
JP2005010052A (ja) * 2003-06-19 2005-01-13 Japan Electronic Materials Corp プローブカード
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
US7252514B2 (en) * 2004-09-02 2007-08-07 International Business Machines Corporation High density space transformer and method of fabricating same
KR100640632B1 (ko) * 2005-01-29 2006-10-31 삼성전자주식회사 프로브 카드 및 그 제조방법
US7279911B2 (en) * 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure
KR101025895B1 (ko) * 2006-06-08 2011-03-30 니혼 하츠쵸 가부시키가이샤 프로브 카드
JP4981525B2 (ja) * 2007-06-04 2012-07-25 日本電子材料株式会社 半導体検査装置
JP5588851B2 (ja) * 2010-12-14 2014-09-10 株式会社日本マイクロニクス 電気的接続装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10633560B2 (en) 2010-12-28 2020-04-28 Bostik Sa Cross-linking method and associated device
KR101918277B1 (ko) 2016-05-12 2018-11-13 싱크-테크 시스템 코포레이션 프로브 카드 모듈

Also Published As

Publication number Publication date
JP2014074716A (ja) 2014-04-24
TW201415037A (zh) 2014-04-16
US20140091826A1 (en) 2014-04-03

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