JP6158023B2 - プローブカード用ファインピッチインターフェース - Google Patents
プローブカード用ファインピッチインターフェース Download PDFInfo
- Publication number
- JP6158023B2 JP6158023B2 JP2013207093A JP2013207093A JP6158023B2 JP 6158023 B2 JP6158023 B2 JP 6158023B2 JP 2013207093 A JP2013207093 A JP 2013207093A JP 2013207093 A JP2013207093 A JP 2013207093A JP 6158023 B2 JP6158023 B2 JP 6158023B2
- Authority
- JP
- Japan
- Prior art keywords
- power
- ground
- conductive
- fine pitch
- probe head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/644,162 | 2012-10-03 | ||
| US13/644,162 US20140091818A1 (en) | 2012-10-03 | 2012-10-03 | Fine pitch interface for probe card |
| US13/707,966 US9151799B2 (en) | 2012-10-03 | 2012-12-07 | Fine pitch interface for probe card |
| US13/707,966 | 2012-12-07 | ||
| US13/935,112 | 2013-07-03 | ||
| US13/935,112 US20140091826A1 (en) | 2012-10-03 | 2013-07-03 | Fine pitch interface for probe card |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014074716A JP2014074716A (ja) | 2014-04-24 |
| JP2014074716A5 JP2014074716A5 (enExample) | 2016-11-17 |
| JP6158023B2 true JP6158023B2 (ja) | 2017-07-05 |
Family
ID=50384565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013207093A Active JP6158023B2 (ja) | 2012-10-03 | 2013-10-02 | プローブカード用ファインピッチインターフェース |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20140091826A1 (enExample) |
| JP (1) | JP6158023B2 (enExample) |
| TW (1) | TW201415037A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101918277B1 (ko) | 2016-05-12 | 2018-11-13 | 싱크-테크 시스템 코포레이션 | 프로브 카드 모듈 |
| US10633560B2 (en) | 2010-12-28 | 2020-04-28 | Bostik Sa | Cross-linking method and associated device |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101136534B1 (ko) * | 2010-09-07 | 2012-04-17 | 한국기계연구원 | 프로브 카드 및 이의 제조 방법 |
| US9817029B2 (en) * | 2011-12-07 | 2017-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Test probing structure |
| US11481596B2 (en) * | 2013-01-18 | 2022-10-25 | Amatech Group Limited | Smart cards with metal layer(s) and methods of manufacture |
| TWI617811B (zh) * | 2016-04-22 | 2018-03-11 | 新特系統股份有限公司 | 探針卡 |
| US20190271721A1 (en) * | 2016-09-30 | 2019-09-05 | Dae-woo Kim | Self aligned sort probe card for si bridge wafer |
| IT201600127581A1 (it) * | 2016-12-16 | 2018-06-16 | Technoprobe Spa | Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio |
| TWI713807B (zh) | 2016-12-16 | 2020-12-21 | 義大利商探針科技公司 | 具有增進的頻率性質的測試頭 |
| TWI613636B (zh) | 2016-12-28 | 2018-02-01 | 財團法人工業技術研究院 | 驅動裝置以及驅動方法 |
| TWI626453B (zh) * | 2017-09-29 | 2018-06-11 | 中華精測科技股份有限公司 | 探針組件及其空間轉換介面板 |
| TWI692644B (zh) * | 2019-06-18 | 2020-05-01 | 旺矽科技股份有限公司 | 電子元件針測裝置 |
| TWI714172B (zh) * | 2019-07-17 | 2020-12-21 | 中華精測科技股份有限公司 | 晶圓探針卡改良結構 |
| TWI732326B (zh) * | 2019-10-29 | 2021-07-01 | 華邦電子股份有限公司 | 短路探針卡、晶圓測試系統以及晶圓測試系統的故障原因檢測方法 |
| TWI810885B (zh) * | 2021-04-16 | 2023-08-01 | 旺矽科技股份有限公司 | 用於半導體測試之電路板 |
| US12235315B2 (en) * | 2022-03-31 | 2025-02-25 | Advantest Test Solutions, Inc. | Test system support component exchange system and method |
| IT202200026184A1 (it) * | 2022-12-21 | 2024-06-21 | Technoprobe Spa | Scheda di misura per un’apparecchiatura di test di dispositivi elettronici |
| IT202200026178A1 (it) * | 2022-12-21 | 2024-06-21 | Technoprobe Spa | Testa di misura per un’apparecchiatura di test di dispositivi elettronici |
| TWI866029B (zh) * | 2023-01-13 | 2024-12-11 | 旺矽科技股份有限公司 | 探針卡及探針卡的待測物側模組 |
| WO2025238766A1 (ja) * | 2024-05-15 | 2025-11-20 | 日本電子材料株式会社 | プローブカード |
| WO2025238765A1 (ja) * | 2024-05-15 | 2025-11-20 | 日本電子材料株式会社 | プローブカード |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60118765U (ja) * | 1984-01-20 | 1985-08-10 | 日本電子材料株式会社 | プロ−ブカ−ド |
| KR100196195B1 (ko) * | 1991-11-18 | 1999-06-15 | 이노우에 쥰이치 | 프로우브 카드 |
| US6667631B2 (en) * | 2001-12-27 | 2003-12-23 | Stmicroelectronics, Inc. | High temperature probe card |
| US6897666B2 (en) * | 2002-12-31 | 2005-05-24 | Intel Corporation | Embedded voltage regulator and active transient control device in probe head for improved power delivery and method |
| JP2005010052A (ja) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | プローブカード |
| US6859054B1 (en) * | 2003-08-13 | 2005-02-22 | Advantest Corp. | Probe contact system using flexible printed circuit board |
| US7252514B2 (en) * | 2004-09-02 | 2007-08-07 | International Business Machines Corporation | High density space transformer and method of fabricating same |
| KR100640632B1 (ko) * | 2005-01-29 | 2006-10-31 | 삼성전자주식회사 | 프로브 카드 및 그 제조방법 |
| US7279911B2 (en) * | 2005-05-03 | 2007-10-09 | Sv Probe Pte Ltd. | Probe card assembly with dielectric structure |
| KR101025895B1 (ko) * | 2006-06-08 | 2011-03-30 | 니혼 하츠쵸 가부시키가이샤 | 프로브 카드 |
| JP4981525B2 (ja) * | 2007-06-04 | 2012-07-25 | 日本電子材料株式会社 | 半導体検査装置 |
| JP5588851B2 (ja) * | 2010-12-14 | 2014-09-10 | 株式会社日本マイクロニクス | 電気的接続装置及びその製造方法 |
-
2013
- 2013-07-03 US US13/935,112 patent/US20140091826A1/en not_active Abandoned
- 2013-10-02 TW TW102135746A patent/TW201415037A/zh unknown
- 2013-10-02 JP JP2013207093A patent/JP6158023B2/ja active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10633560B2 (en) | 2010-12-28 | 2020-04-28 | Bostik Sa | Cross-linking method and associated device |
| KR101918277B1 (ko) | 2016-05-12 | 2018-11-13 | 싱크-테크 시스템 코포레이션 | 프로브 카드 모듈 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014074716A (ja) | 2014-04-24 |
| TW201415037A (zh) | 2014-04-16 |
| US20140091826A1 (en) | 2014-04-03 |
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