JP6152223B2 - 熱硬化性樹脂組成物及びその用途 - Google Patents
熱硬化性樹脂組成物及びその用途 Download PDFInfo
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- JP6152223B2 JP6152223B2 JP2016526402A JP2016526402A JP6152223B2 JP 6152223 B2 JP6152223 B2 JP 6152223B2 JP 2016526402 A JP2016526402 A JP 2016526402A JP 2016526402 A JP2016526402 A JP 2016526402A JP 6152223 B2 JP6152223 B2 JP 6152223B2
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- Prior art keywords
- resin composition
- thermosetting resin
- powder
- total mass
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000843 powder Substances 0.000 claims description 73
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- 150000002752 molybdenum compounds Chemical class 0.000 claims description 40
- 229920001296 polysiloxane Polymers 0.000 claims description 38
- 229910052750 molybdenum Inorganic materials 0.000 claims description 35
- 239000011733 molybdenum Substances 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 34
- 239000011256 inorganic filler Substances 0.000 claims description 30
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 21
- 239000011521 glass Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 12
- 229910001593 boehmite Inorganic materials 0.000 claims description 11
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 11
- -1 methyl hydrogen Chemical compound 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
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- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
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- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
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- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
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- 229910052618 mica group Inorganic materials 0.000 claims description 4
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
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- 229910052582 BN Inorganic materials 0.000 claims description 3
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- 239000007788 liquid Substances 0.000 claims description 3
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 claims description 3
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- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
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- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
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- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 238000011156 evaluation Methods 0.000 description 19
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- 229910052802 copper Inorganic materials 0.000 description 15
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- 239000000853 adhesive Substances 0.000 description 13
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- 238000000034 method Methods 0.000 description 9
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- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
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- 239000000126 substance Substances 0.000 description 4
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- 239000006087 Silane Coupling Agent Substances 0.000 description 3
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
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- 239000002270 dispersing agent Substances 0.000 description 3
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- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
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- 239000008096 xylene Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
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- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
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- YSWHTEMMPZXPOC-UHFFFAOYSA-N [Mo].SC=1N=C(SC1)S Chemical compound [Mo].SC=1N=C(SC1)S YSWHTEMMPZXPOC-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Inorganic materials [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 1
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- 238000007689 inspection Methods 0.000 description 1
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- 150000002576 ketones Chemical class 0.000 description 1
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- 238000010907 mechanical stirring Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical class [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5398—Phosphorus bound to sulfur
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- Reinforced Plastic Materials (AREA)
Description
臭素化ビスフェノールAエポキシ樹脂(ダウ・ケミカル製、エポキシ当量435、臭素含有量19%、商品名DER530)、ジシアンジアミド、2−メチルイミダゾール、有機モリブデン化合物、シリコーンパウダー、無機フィラーを、有機溶媒に溶解させ、機械的撹拌し、乳化させて65wt%の接着剤を調製し、次にガラス繊維布を含浸させ、加熱して乾燥させるとプリプレグ(prepreg)を形成し、両面に銅箔を載せ、加圧・加熱して銅箔基板を得る。
A−1 ジアルキルジチオカルバミン酸モリブデン、D50=10μm、太平洋連合(北京)石油化学工業有限公司製
A−2 ジアルキルジチオリン酸硫化オキシモリブデン、自作
A−3 有機モリブデン酸エステル、自作
B−1 溶融球状マイクロシリカ、電気化学工業株式会社製、SFP30M、平均粒子径0.5μm
B−2 溶融不規則シリカ、Sibelco Asia社製、525、平均粒子径2μm
B−3 複合マイクロシリカ、Sibelco Asia社製、G2C、平均粒子径2μm
B−4 ベーマイト、Nabaltec製、AOH30
B−5 ベーマイト、Nabaltec製、AOH60
C−1 シリコーンゴムパウダー、KMP−594、信越化学工業社製、平均粒子径5μm
C−2 シリコーン樹脂で表面を被覆したシリコーンゴムパウダー、KMP−605、信越化学工業社製、平均粒子径2μm
C−3 シリコーン樹脂パウダー、Tospearl 120、Momentive Performance Materials製
シリコーンパウダーを配合しない以外に、実施例1と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表1に示す。
有機モリブデン化合物とシリコーンパウダーをモリブデン酸亜鉛(モリブデン酸亜鉛、Kemgard、911B)に変更する以外に、実施例1と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表2に示す。
有機モリブデン化合物とシリコーンパウダーをモリブデン酸カルシウム(モリブデン酸カルシウム、Kemgard、911A)に変更する以外に、実施例3と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表2に示す。
有機モリブデン化合物を配合しない以外に、実施例1と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表2に示す。
シリコーンパウダーと有機モリブデン化合物を配合しない以外に、実施例1と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表2に示す。
6軸ボール盤の二つの効果の近いドリル軸を用いて孔を開け、一枚の基板に対して6つの新しいカッターを使用し、各カッターで基板において6000個の孔を開けた後、検査顕微鏡でドリル刃部を観察し、刃先の摩損後退量を測定し更に垂直線と中軸線との交点と摩損上縁との距離を測定してドリルカッターの寸法とし、下式に基づきドリルカッターの摩損率を計算してドリル加工性を評価する。
エッチング液で銅張積層板の銅箔を除去した後、5mm×5mm角のサイズの試験片に切り出す。TMA試験装置を用いて10℃/minの加熱速度で、30〜260℃での該試験片のZ軸方向(ガラス布に垂直な方向)における平均線熱膨張係数を測定する。熱膨張率が小さいほど、効果が高い。
エッチング液で銅張積層板の銅箔を除去した後、100mm×3mmの試験片に切り出す。剥離強度試験装置を用いて、50.8mm/minの速度で積層板を剥離して分層させ、積層板の層間剥離強度を測定し、値が大きいほど、樹脂の層間接着力が高くなる。
積層板を剥離した後に5mm角のサイズに切り、導電性接着剤に載せて、金をスプレー塗装し、観察用試験片を製造する。走査電子顕微鏡を用いて、フィラーと樹脂との界面を観察して、評価する。
積層板を5mm角のサイズに切り、樹脂を用いて注型し、導電性接着剤に載せ、金をスプレー塗装し、観察用試験片を製造する。走査電子顕微鏡を用いて、フィラーの樹脂における分散状況を観察し、更に評価する。
100mlの樹脂組成物を100mlの栓付きメスシリンダー内に投入し、25℃の室温で静置し、沈殿物が沈降管の底部に沈降するまでの時間を測定し、安定性を評価する。
100重量部の臭素化ビスフェノールAエポキシ樹脂(ダウ・ケミカル製、エポキシ当量435、臭素含有量19%、商品名DER530)、24重量部のノボラック樹脂(日本群栄製、ヒドロキシ当量105、商品名TD2090)、0.05重量部の2−メチルイミダゾール、有機モリブデン化合物、シリコーンパウダー及び無機フィラーを、有機溶媒に溶解させ、機械的撹拌して乳化させて65wt%の接着剤を調製し、次にガラス繊維布を含浸させ、加熱乾燥後にプリプレグ(prepreg)を形成し、両面に銅箔を載せ、加圧・加熱して銅箔基板を得る。
シリコーンパウダーを配合しない以外に、実施例8と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表3に示す。
有機モリブデン化合物をモリブデン酸亜鉛(モリブデン酸亜鉛、Kemgard、911B)に変更する以外に、実施例8と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表4に示す。
有機モリブデン化合物をモリブデン酸カルシウム(モリブデン酸カルシウム、Kemgard、911A)に変更する以外に、実施例10と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表4に示す。
有機モリブデン化合物を配合しない以外に、実施例8と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表4に示す。
シリコーンパウダーと有機モリブデン化合物を配合しない以外に、実施例8と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表4に示す。
臭素化ビスフェノールAエポキシ樹脂(ダウ・ケミカル製、エポキシ当量435、臭素含有量19%、商品名DER530)、ジシアンジアミド、2−メチルイミダゾール、有機モリブデン化合物、シリコーンパウダー、無機フィラーを、有機溶媒に溶解させ、機械的撹拌し、乳化させて65wt%の接着液を調製し、次にガラス繊維布を含浸させ、加熱乾燥後にプリプレグ(prepreg)を形成し、両面に銅箔を載せ、加圧・加熱して銅箔基板を得る。
オクタモリブデン酸アンモニウムの平均粒子径を0.5μmにする以外に、実施例15と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表5に示す。
オクタモリブデン酸アンモニウムの平均粒子径を20μm、オクタモリブデン酸アンモニウムの添加量を45質量部にする以外に、実施例15と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表5に示す。
シリコーンパウダーの添加量が異なる以外に、実施例15と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表5に示す。
シリコーンパウダーと有機モリブデン化合物の添加量が異なる以外に、実施例15と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表5に示す。
シリコーンパウダーと有機モリブデン化合物の添加量が異なる以外に、実施例15と同様な方法で、樹脂組成物を用いた銅張積層板を製造する。測定結果、評価結果を表5に示す。
Claims (13)
- 熱硬化性樹脂、無機フィラー及び有機モリブデン化合物を含む熱硬化性樹脂組成物であって、
前記熱硬化性樹脂はエポキシ樹脂であり、前記熱硬化性樹脂は熱硬化性樹脂組成物の全質量の20〜70wt%を占め、
前記無機フィラーは、シリカ、ベーマイト、アルミナ、タルク、雲母、カオリン、水酸化アルミニウム、水酸化マグネシウム、ホウ酸亜鉛、錫酸亜鉛、酸化亜鉛、酸化チタン、窒化ホウ素、炭酸カルシウム、硫酸バリウム、チタン酸バリウム、ホウ酸アルミニウム、チタン酸カリウム、Eガラスパウダー、Sガラスパウダー、Dガラスパウダー、NEガラスパウダー又は中空微粉末から選ばれる任意の1種又は少なくとも2種の混合物であり、前記無機フィラーの含有量は、熱硬化性樹脂組成物の全質量に対して10〜80wt%であり、
前記有機モリブデン化合物は、ジアルキルジチオリン酸硫化オキシモリブデン、ジアルキルジチオリン酸オキシモリブデン、ジアルキルジチオカルバミン酸モリブデン、モリブデンアミン錯体、ナフテン酸モリブデン、アルキルサリチル酸モリブデン、ジメルカプトチアゾールモリブデン、アルキルアミンモリブデン、有機モリブデン酸エステル又はオクタン酸モリブデンから選ばれる任意の1種又は少なくとも2種の混合物であり、前記有機モリブデン化合物の含有量は、熱硬化性樹脂組成物の全質量に対して0.01〜20wt%である、
ことを特徴とする熱硬化性樹脂組成物。 - シリコーンパウダーを更に含み、
前記シリコーンパウダーの含有量は、熱硬化性樹脂組成物の全質量に対して0.1〜30wt%であり、
前記有機モリブデン化合物の含有量は、熱硬化性樹脂組成物の全質量に対して0.5〜18.5wt%である、ことを特徴とする請求項1に記載の熱硬化性樹脂組成物。 - 前記有機モリブデン化合物の含有量は、熱硬化性樹脂組成物の全質量に対して1〜17wt%である、ことを特徴とする請求項2に記載の熱硬化性樹脂組成物。
- 前記有機モリブデン化合物は、粉末状であり、その平均粒子径が0.1〜50μmである、ことを特徴とする請求項1−3のいずれか一項に記載の熱硬化性樹脂組成物。
- 前記有機モリブデン化合物は、粉末状であり、その平均粒子径が0.5〜20μmである、ことを特徴とする請求項4に記載の熱硬化性樹脂組成物。
- 前記有機モリブデン化合物は、液体状である、ことを特徴とする請求項1−3のいずれか一項に記載の熱硬化性樹脂組成物。
- 前記シリコーンパウダーの含有量は、熱硬化性樹脂組成物の全質量に対して5〜20wt%であり、
前記シリコーンパウダーは、ポリメチルシルセスキオキサンの微細粉末、メチルハイドロジェンポリシロキサンとビニル基含有ジメチルポリシロキサンとの付加重合体で形成される微粉末、ポリメチルシルセスキオキサンでメチルハイドロジェンポリシロキサンとビニル基含有ジメチルポリシロキサンとの付加重合体の微細粉末の表面を塗布して得たパウダー又はポリメチルシルセスキオキサンで無機担体の表面を塗布して得たパウダーから選ばれる任意の1種又は少なくとも2種の混合物であり、
前記無機フィラーの含有量は、熱硬化性樹脂組成物の全質量に対して20〜60wt%であり、
前記無機フィラーは、粉末状であり、その平均粒子径が0.1〜100μmであり、
前記熱硬化性樹脂は熱硬化性樹脂組成物の全質量の25〜65wt%を占め、
前記熱硬化性樹脂組成物は、更に硬化剤を含み、前記硬化剤は熱硬化性樹脂組成物の全質量の1〜30wt%を占め、
前記熱硬化性樹脂組成物は、更に促進剤を含み、前記促進剤は熱硬化性樹脂組成物の全質量の0(0を除く)〜10wt%を占める、ことを特徴とする請求項2に記載の熱硬化性樹脂組成物。 - 前記無機フィラーの平均粒子径は0.5〜20μmであり、
前記熱硬化性樹脂は熱硬化性樹脂組成物の全質量の30〜60wt%を占め、
前記硬化剤は熱硬化性樹脂組成物の全質量の4〜25wt%を占め、
前記促進剤は熱硬化性樹脂組成物の全質量の1〜10wt%を占める、ことを特徴とする請求項7に記載の熱硬化性樹脂組成物。 - 前記硬化剤は熱硬化性樹脂組成物の全質量の10〜20wt%を占め、
前記促進剤は熱硬化性樹脂組成物の全質量の2〜8wt%を占める、ことを特徴とする請求項8に記載の熱硬化性樹脂組成物。 - 請求項1−9のいずれか一項に記載の熱硬化性樹脂組成物を溶媒に溶解又は分散させて得る、ことを特徴とする樹脂溶液。
- 強化材と、浸漬乾燥後にそれに付着された請求項1−9のいずれか一項に記載の熱硬化性樹脂組成物とを含む、ことを特徴とするプリプレグ。
- 少なくとも請求項11に記載のプリプレグを一枚含む、ことを特徴とする積層板。
- 少なくとも請求項11に記載のプリプレグを一枚含む、ことを特徴とするプリント回路基板。
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US9775239B2 (en) * | 2014-04-08 | 2017-09-26 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board |
BR112019013057B1 (pt) | 2016-12-23 | 2023-10-17 | Saint-Gobain Abrasives, Inc. | Abrasivos revestidos apresentando uma composição de melhoria de desempenho |
KR20200139293A (ko) * | 2019-06-03 | 2020-12-14 | 현대자동차주식회사 | 표면 평활성 및 기계적 물성이 우수한 열경화성 복합 수지 조성물 및 이를 이용한 자동차 외판의 제조방법 |
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Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6051712A (ja) * | 1983-08-30 | 1985-03-23 | Toyota Central Res & Dev Lab Inc | エポキシ樹脂組成物 |
JPS6058426A (ja) * | 1983-09-09 | 1985-04-04 | Toyota Central Res & Dev Lab Inc | エポキシ樹脂組成物 |
GB0229810D0 (en) | 2002-12-20 | 2003-01-29 | Vantico Ag | Flame retardant polymer compositions |
KR100569759B1 (ko) * | 2004-01-16 | 2006-04-11 | 주식회사 엘지화학 | 비할로겐계 난연성 수지 조성물, 이를 이용한 프리프레그및 적층판 |
JP4389687B2 (ja) * | 2004-06-14 | 2009-12-24 | ダイソー株式会社 | 加硫用ゴム組成物、および同組成物を用いた加硫ゴム材料 |
JP5024205B2 (ja) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
KR100962936B1 (ko) | 2007-12-20 | 2010-06-09 | 제일모직주식회사 | 반도체 조립용 접착 필름 조성물 및 접착 필름 |
KR102142753B1 (ko) * | 2009-03-27 | 2020-09-14 | 히타치가세이가부시끼가이샤 | 열경화성 수지 조성물, 및 이를 이용한 프리프레그, 지지체 부착 절연 필름, 적층판 및 인쇄 배선판 |
JP5614048B2 (ja) * | 2010-02-02 | 2014-10-29 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
KR20120123031A (ko) | 2009-12-25 | 2012-11-07 | 히다찌 가세이 고오교 가부시끼가이샤 | 열경화성 수지 조성물, 수지 조성물 바니시의 제조 방법, 프리프레그 및 적층판 |
CN101845200A (zh) * | 2010-05-18 | 2010-09-29 | 苏州生益科技有限公司 | 无卤热固性树脂组合物及由其制得的预浸料和层压板 |
CN105860436B (zh) * | 2010-08-31 | 2019-01-18 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料及层叠板 |
KR101921366B1 (ko) | 2011-09-26 | 2018-11-22 | 미츠비시 가스 가가쿠 가부시키가이샤 | 몰리브덴 화합물 분체, 프리프레그 및 적층판 |
JP5970780B2 (ja) | 2011-11-07 | 2016-08-17 | 日立化成株式会社 | 潜在性硬化剤及びその製造方法 |
CN102660102B (zh) | 2012-05-02 | 2013-06-19 | 江苏亚邦新材料科技有限公司 | 一种耐高温绝缘树脂的制备方法及其应用 |
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JP6058426B2 (ja) | 2013-02-27 | 2017-01-11 | フクダ電子株式会社 | 生体情報モニタおよびそのキャリア |
CN103497488B (zh) * | 2013-10-11 | 2016-05-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
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EP3056539A4 (en) | 2017-06-28 |
US10208188B2 (en) | 2019-02-19 |
KR20160030273A (ko) | 2016-03-16 |
EP3056539A1 (en) | 2016-08-17 |
KR101760629B1 (ko) | 2017-07-21 |
US20160229990A1 (en) | 2016-08-11 |
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JP2016525596A (ja) | 2016-08-25 |
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