JP6127047B2 - 相互嵌合型電極形成 - Google Patents
相互嵌合型電極形成 Download PDFInfo
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- JP6127047B2 JP6127047B2 JP2014523312A JP2014523312A JP6127047B2 JP 6127047 B2 JP6127047 B2 JP 6127047B2 JP 2014523312 A JP2014523312 A JP 2014523312A JP 2014523312 A JP2014523312 A JP 2014523312A JP 6127047 B2 JP6127047 B2 JP 6127047B2
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- 230000015572 biosynthetic process Effects 0.000 title description 2
- 238000000034 method Methods 0.000 claims description 77
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 45
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000000608 laser ablation Methods 0.000 claims description 22
- 238000002955 isolation Methods 0.000 claims description 21
- 238000000059 patterning Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 9
- 230000008719 thickening Effects 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 4
- 229910017107 AlOx Inorganic materials 0.000 claims description 3
- 229910004205 SiNX Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 230000008901 benefit Effects 0.000 description 14
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
- H01L31/022458—Electrode arrangements specially adapted for back-contact solar cells for emitter wrap-through [EWT] type solar cells, e.g. interdigitated emitter-base back-contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Photovoltaic Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
各図において、同一又は同様の構成部分については同じ符号を付している。
Claims (15)
- 半導体基板(10)に第1電極及び第2電極を形成する方法であって、ここで第1電極及び第2電極は組み合わされており、この方法は、
半導体基板の表面に誘電体層(15)を設けること、
誘電体層に金属シード層(16)を設けること、
レーザアブレーションによって金属シード層をパターニングすること、これにより、間に分離領域(17)を有する第1シード層(161)及び第2シード層(162)に金属シード層を分離し、ここで第1シード層及び第2シード層は組み合わされ互いから電気的に分離されている、
めっきによって第1シード層及び第2シード層を厚くすること、これにより第1電極(181)及び第2電極(182)を形成する、
を備え、
第1シード層及び第2シード層を厚くする前に、ウェットエッチングによって誘電体層が分離領域において部分的に除去される、
方法。 - 分離領域における誘電体層の部分的な除去は、HFを備えるエッチング溶液において行われる、請求項1に記載の方法。
- 分離領域における誘電体層の部分的な除去は、誘電体層から10nmから50nm厚の層を除去することを備える、請求項1又は2に記載の方法。
- めっきによって第1シード層及び第2シード層を厚くすることは、Cuの電気めっきを含む、請求項1から3のいずれかに記載の方法。
- 誘電体層(15)は、80nmと1000nmとの間の厚さで設けられる、請求項1から4のいずれかに記載の方法。
- 下層の半導体基板に電気コンタクトを形成する必要がある場所で誘電体層を除去するように、金属シード層を設ける前に誘電体層をパターニングすることをさらに備える、請求項1から5のいずれかに記載の方法。
- 第1電極と半導体基板の第1領域との間の電気コンタクトを形成する必要のある場所、及び第2電極と半導体基板の第2領域との間の電気コンタクトを形成する必要のある場所で、誘電体層は除去される、請求項6に記載の方法。
- 第1領域は光起電力電池のエミッタ領域(14)であり、第2領域は光起電力電池の裏面電界領域(12)である、請求項7に記載の方法。
- 誘電体層は、SiOx層、SiNx層あるいはAlOx層、又はSiOx層、SiNx層及び/又はAlOx層を備える誘電体層スタックである、請求項1から8のいずれかに記載の方法。
- 金属シード層は金属層のスタックを備える、請求項1から9のいずれかに記載の方法。
- 金属層のスタックは、コンタクト金属層、拡散バリア金属層、及び伝導金属層を含む、請求項10に記載の方法。
- コンタクト金属層及び拡散バリア金属層は20nmと50nmとの間の厚さを有し、伝導金属層は100nmと300nmとの間の厚さを有する、請求項11に記載の方法。
- 第1シード層と第2シード層との間の分離領域は、20マイクロメーターと300マイクロメーターとの間の横サイズを有する、請求項1から12のいずれかに記載の方法。
- 相互嵌合型バックコンタクト光起電力電池を製造するための、請求項1から13のいずれかに記載の方法の使用。
- 半導体基板、並びに裏面に第1及び第2の相互嵌合型電極(181,182)を有する相互嵌合型バックコンタクト光起電力電池であって、
半導体基板の裏面における誘電体層(15)と、
誘電体層における金属シード層(16)と、この金属シード層は間に分離領域(17)を有する第1シード層(161)及び第2シード層(162)にパターン化され、第1シード層及び第2シード層は組み合わされ、互いから電気的に分離されている、
第1シード層及び第2シード層におけるめっきであり、第1電極(181)及び第2電極(182)を形成するめっきと、
を備え、
2つのシード層間のショートの可能性を減じるように、上記誘電体層は2つのシード層間の分離領域において部分的に除去された構造を有する、
相互嵌合型バックコンタクト光起電力電池。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161515253P | 2011-08-04 | 2011-08-04 | |
US61/515,253 | 2011-08-04 | ||
PCT/EP2012/065009 WO2013017616A1 (en) | 2011-08-04 | 2012-08-01 | Interdigitated electrode formation |
Publications (2)
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JP2014527296A JP2014527296A (ja) | 2014-10-09 |
JP6127047B2 true JP6127047B2 (ja) | 2017-05-10 |
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JP2014523312A Active JP6127047B2 (ja) | 2011-08-04 | 2012-08-01 | 相互嵌合型電極形成 |
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US (1) | US9419154B2 (ja) |
EP (1) | EP2740157B1 (ja) |
JP (1) | JP6127047B2 (ja) |
TW (1) | TWI532196B (ja) |
WO (1) | WO2013017616A1 (ja) |
Families Citing this family (14)
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EP2740157B1 (en) | 2011-08-04 | 2015-04-29 | Imec | Interdigitated electrode formation |
TWI643351B (zh) * | 2013-01-31 | 2018-12-01 | 澳洲商新南創新有限公司 | 太陽能電池金屬化及互連方法 |
US8901010B2 (en) * | 2013-03-15 | 2014-12-02 | Sunpower Corporation | Methods for improving solar cell lifetime and efficiency |
US9666739B2 (en) * | 2013-06-28 | 2017-05-30 | Sunpower Corporation | Photovoltaic cell and laminate metallization |
US20150072515A1 (en) * | 2013-09-09 | 2015-03-12 | Rajendra C. Dias | Laser ablation method and recipe for sacrificial material patterning and removal |
TWI496299B (zh) * | 2013-10-30 | 2015-08-11 | Inventec Solar Energy Corp | 電極結構與使用電極結構的太陽能電池 |
TWI513026B (zh) * | 2014-07-30 | 2015-12-11 | Inventec Solar Energy Corp | 太陽能電池 |
WO2017008120A1 (en) * | 2015-07-14 | 2017-01-19 | Newsouth Innovations Pty Limited | A method for forming a contacting structure to a back contact solar cell |
KR20170019597A (ko) * | 2015-08-12 | 2017-02-22 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
US11049988B2 (en) * | 2016-10-25 | 2021-06-29 | Shin-Etsu Chemical Co., Ltd. | High photoelectric conversion efficiency solar cell and method for manufacturing high photoelectric conversion efficiency solar cell |
KR20190082743A (ko) | 2016-11-15 | 2019-07-10 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 고광전변환효율 태양전지, 그 제조 방법, 태양전지 모듈 및 태양광 발전 시스템 |
CN110702753B (zh) * | 2019-10-29 | 2020-09-08 | 华中科技大学 | 桥接式微纳结构传感单元的阵列传感器的制备方法及产品 |
CN111211199B (zh) * | 2020-01-17 | 2022-02-08 | 上海瀛庆新材料中心 | 一种高效ibc电池的制备方法 |
CN115913159B (zh) * | 2023-02-13 | 2023-05-12 | 深圳新声半导体有限公司 | 用于制作声表面波滤波器的方法、声表面波滤波器 |
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US6544865B1 (en) | 1998-04-09 | 2003-04-08 | Pacific Solar Pty. Limited | Metal film interrupting process |
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JP2003115598A (ja) * | 2001-10-02 | 2003-04-18 | Sanyo Electric Co Ltd | 光起電力装置及びその製造方法 |
US7388147B2 (en) * | 2003-04-10 | 2008-06-17 | Sunpower Corporation | Metal contact structure for solar cell and method of manufacture |
DE102004050269A1 (de) | 2004-10-14 | 2006-04-20 | Institut Für Solarenergieforschung Gmbh | Verfahren zur Kontakttrennung elektrisch leitfähiger Schichten auf rückkontaktierten Solarzellen und Solarzelle |
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JP2010205839A (ja) * | 2009-03-02 | 2010-09-16 | Sharp Corp | 半導体装置の製造方法 |
JP2011061020A (ja) * | 2009-09-10 | 2011-03-24 | Sharp Corp | 裏面コンタクト型太陽電池素子およびその製造方法 |
EP2395554A3 (en) * | 2010-06-14 | 2015-03-11 | Imec | Fabrication method for interdigitated back contact photovoltaic cells |
EP2740157B1 (en) | 2011-08-04 | 2015-04-29 | Imec | Interdigitated electrode formation |
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- 2012-08-01 EP EP20120740998 patent/EP2740157B1/en active Active
- 2012-08-01 WO PCT/EP2012/065009 patent/WO2013017616A1/en unknown
- 2012-08-01 JP JP2014523312A patent/JP6127047B2/ja active Active
- 2012-08-01 TW TW101127862A patent/TWI532196B/zh not_active IP Right Cessation
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Publication number | Publication date |
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JP2014527296A (ja) | 2014-10-09 |
TW201310664A (zh) | 2013-03-01 |
EP2740157B1 (en) | 2015-04-29 |
WO2013017616A1 (en) | 2013-02-07 |
US9419154B2 (en) | 2016-08-16 |
TWI532196B (zh) | 2016-05-01 |
US20140174526A1 (en) | 2014-06-26 |
EP2740157A1 (en) | 2014-06-11 |
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