JP6126436B2 - 基材レスシリコーン両面テープ - Google Patents

基材レスシリコーン両面テープ Download PDF

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Publication number
JP6126436B2
JP6126436B2 JP2013074804A JP2013074804A JP6126436B2 JP 6126436 B2 JP6126436 B2 JP 6126436B2 JP 2013074804 A JP2013074804 A JP 2013074804A JP 2013074804 A JP2013074804 A JP 2013074804A JP 6126436 B2 JP6126436 B2 JP 6126436B2
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Japan
Prior art keywords
adhesive layer
pressure
sensitive adhesive
silicone
release sheet
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Active
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JP2013074804A
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English (en)
Japanese (ja)
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JP2014198787A (ja
Inventor
剛史 安齋
剛史 安齋
仁 大橋
仁 大橋
雄一 倉田
雄一 倉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Priority to JP2013074804A priority Critical patent/JP6126436B2/ja
Priority to TW103107371A priority patent/TWI609939B/zh
Publication of JP2014198787A publication Critical patent/JP2014198787A/ja
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Publication of JP6126436B2 publication Critical patent/JP6126436B2/ja
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  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2013074804A 2013-03-29 2013-03-29 基材レスシリコーン両面テープ Active JP6126436B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013074804A JP6126436B2 (ja) 2013-03-29 2013-03-29 基材レスシリコーン両面テープ
TW103107371A TWI609939B (zh) 2013-03-29 2014-03-05 無基材雙面矽膠

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013074804A JP6126436B2 (ja) 2013-03-29 2013-03-29 基材レスシリコーン両面テープ

Publications (2)

Publication Number Publication Date
JP2014198787A JP2014198787A (ja) 2014-10-23
JP6126436B2 true JP6126436B2 (ja) 2017-05-10

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ID=52355910

Family Applications (1)

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JP2013074804A Active JP6126436B2 (ja) 2013-03-29 2013-03-29 基材レスシリコーン両面テープ

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JP (1) JP6126436B2 (zh)
TW (1) TWI609939B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11680194B2 (en) 2017-04-20 2023-06-20 Dow Toray Co., Ltd. Method for producing silicone-based adhesive
JP7264645B2 (ja) * 2019-01-11 2023-04-25 株式会社巴川製紙所 両面粘着シート
JP7529473B2 (ja) 2020-08-05 2024-08-06 アイカ工業株式会社 シリコーン粘着剤組成物およびこれを用いた粘着テープ
CN112080249A (zh) * 2020-08-21 2020-12-15 南京清尚新材料科技有限公司 可滑移填充型粘合剂及其功能层的制备方法和粘合胶带
JP7370549B1 (ja) 2022-11-24 2023-10-30 株式会社エイム 半田配置方法
CN115991961A (zh) * 2022-12-15 2023-04-21 太湖金张科技股份有限公司 一种双面粘性不同的有机硅光学胶

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006035B2 (ja) * 1996-03-08 2007-11-14 リンテック株式会社 熱硬化型シリコーン粘接着剤
JP2003020453A (ja) * 2001-07-05 2003-01-24 Nitto Denko Corp シリコーン系基材レス両面テープ及びその使用方法
JP2004224991A (ja) * 2003-01-27 2004-08-12 Nitto Denko Corp 粘着剤組成物および有機ｅｌ表示装置
JP2005029712A (ja) * 2003-07-08 2005-02-03 Nitto Denko Corp シリコーン系基材レス両面粘着シート
JP5010668B2 (ja) * 2009-12-03 2012-08-29 信越化学工業株式会社 積層型半導体集積装置の製造方法
JP2012144701A (ja) * 2010-12-25 2012-08-02 Nitto Denko Corp 粘着テープ、粘着テープで被覆された平角電線、およびそれを用いた電気機器
JP2012224805A (ja) * 2011-04-22 2012-11-15 Nitto Denko Corp 表面保護フィルム

Also Published As

Publication number Publication date
JP2014198787A (ja) 2014-10-23
TWI609939B (zh) 2018-01-01
TW201443185A (zh) 2014-11-16

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