JP6126212B2 - 集積回路における双方向ｅｓｄ保護のための装置及び方法 - Google Patents

集積回路における双方向ｅｓｄ保護のための装置及び方法 Download PDF

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JP6126212B2
JP6126212B2 JP2015515170A JP2015515170A JP6126212B2 JP 6126212 B2 JP6126212 B2 JP 6126212B2 JP 2015515170 A JP2015515170 A JP 2015515170A JP 2015515170 A JP2015515170 A JP 2015515170A JP 6126212 B2 JP6126212 B2 JP 6126212B2
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current
terminal
coupled
node
switch
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JP2015524169A (ja
JP2015524169A5 (enExample
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エイ サルマン アクラム
エイ サルマン アクラム
ファルビズ ファルザン
ファルビズ ファルザン
マーガレット コンカノン アン
マーガレット コンカノン アン
ボセッリ ジャンルカ
ボセッリ ジャンルカ
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日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
    • H10D89/713—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements including a PNP transistor and a NPN transistor, wherein each of said transistors has its base region coupled to the collector region of the other transistor, e.g. silicon controlled rectifier [SCR] devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/045—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
    • H02H9/046—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Bipolar Integrated Circuits (AREA)
JP2015515170A 2012-05-30 2013-05-30 集積回路における双方向ｅｓｄ保護のための装置及び方法 Active JP6126212B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261653225P 2012-05-30 2012-05-30
US61/653,225 2012-05-30
US13/901,772 2013-05-24
US13/901,772 US9224724B2 (en) 2012-05-30 2013-05-24 Mutual ballasting multi-finger bidirectional ESD device
PCT/US2013/043244 WO2013181328A1 (en) 2012-05-30 2013-05-30 Apparatus and methods for bidirectional esd protection in integrated circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017075742A Division JP6518712B2 (ja) 2012-05-30 2017-04-06 集積回路における双方向ｅｓｄ保護のための装置及び方法

Publications (3)

Publication Number Publication Date
JP2015524169A JP2015524169A (ja) 2015-08-20
JP2015524169A5 JP2015524169A5 (enExample) 2016-06-16
JP6126212B2 true JP6126212B2 (ja) 2017-05-10

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JP2015515170A Active JP6126212B2 (ja) 2012-05-30 2013-05-30 集積回路における双方向ｅｓｄ保護のための装置及び方法
JP2017075742A Active JP6518712B2 (ja) 2012-05-30 2017-04-06 集積回路における双方向ｅｓｄ保護のための装置及び方法

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JP2017075742A Active JP6518712B2 (ja) 2012-05-30 2017-04-06 集積回路における双方向ｅｓｄ保護のための装置及び方法

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Country Link
US (2) US9224724B2 (enExample)
JP (2) JP6126212B2 (enExample)
CN (1) CN104335348B (enExample)
WO (1) WO2013181328A1 (enExample)

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US9153569B1 (en) 2014-03-21 2015-10-06 Texas Instruments Incorporated Segmented NPN vertical bipolar transistor
US9231403B2 (en) 2014-03-24 2016-01-05 Texas Instruments Incorporated ESD protection circuit with plural avalanche diodes
US10269898B2 (en) 2014-05-22 2019-04-23 Texas Instruments Incorporated Surrounded emitter bipolar device
US9653447B2 (en) * 2014-09-24 2017-05-16 Nxp B.V. Local interconnect layer enhanced ESD in a bipolar-CMOS-DMOS
US10396550B2 (en) 2016-09-30 2019-08-27 Texas Instruments Incorporated ESD protection charge pump active clamp for low-leakage applications
US10749336B2 (en) 2016-11-28 2020-08-18 Texas Instruments Incorporated ESD protection circuit with passive trigger voltage controlled shut-off
US10373944B2 (en) 2017-02-28 2019-08-06 Texas Instruments Incorporated ESD protection circuit with integral deep trench trigger diodes
US10340357B2 (en) 2017-09-25 2019-07-02 Taiwan Semiconductor Manufacturing Co., Ltd. Dishing prevention dummy structures for semiconductor devices
US10510685B2 (en) 2017-09-29 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Dishing prevention columns for bipolar junction transistors
US10608431B2 (en) 2017-10-26 2020-03-31 Analog Devices, Inc. Silicon controlled rectifier dynamic triggering and shutdown via control signal amplification
US10700055B2 (en) 2017-12-12 2020-06-30 Texas Instruments Incorporated Back ballasted vertical NPN transistor
US10249607B1 (en) 2017-12-15 2019-04-02 Texas Instruments Incorporated Internally stacked NPN with segmented collector
US11196248B2 (en) * 2018-11-02 2021-12-07 Texas Instruments Incorporated Bidirectional flat clamp device with shared voltage sensor circuit
CN109686663A (zh) * 2018-12-27 2019-04-26 上海华力微电子有限公司 一种半导体结构及其制造方法
US10978443B2 (en) * 2019-06-06 2021-04-13 Texas Instruments Incorporated Zener-triggered transistor with vertically integrated Zener diode
CN110556387B (zh) * 2019-09-07 2022-02-08 电子科技大学 基于soi的双向恒流器件
JP7584325B2 (ja) 2021-02-26 2024-11-15 株式会社東海理化電機製作所 静電保護素子

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Also Published As

Publication number Publication date
JP2015524169A (ja) 2015-08-20
CN104335348A (zh) 2015-02-04
CN104335348B (zh) 2019-06-04
US9633991B2 (en) 2017-04-25
JP2017152719A (ja) 2017-08-31
WO2013181328A1 (en) 2013-12-05
JP6518712B2 (ja) 2019-05-22
US20160086936A1 (en) 2016-03-24
US20130320396A1 (en) 2013-12-05
US9224724B2 (en) 2015-12-29

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