JP6105638B2 - 発光装置の製造方法及び発光装置 - Google Patents
発光装置の製造方法及び発光装置 Download PDFInfo
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- JP6105638B2 JP6105638B2 JP2014559515A JP2014559515A JP6105638B2 JP 6105638 B2 JP6105638 B2 JP 6105638B2 JP 2014559515 A JP2014559515 A JP 2014559515A JP 2014559515 A JP2014559515 A JP 2014559515A JP 6105638 B2 JP6105638 B2 JP 6105638B2
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- light emitting
- emitting element
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- light
- emitting device
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- 238000004519 manufacturing process Methods 0.000 title description 34
- 239000000758 substrate Substances 0.000 claims description 47
- 239000003566 sealing material Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 description 27
- 239000004065 semiconductor Substances 0.000 description 10
- 238000000605 extraction Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H—ELECTRICITY
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Wire Bonding (AREA)
Description
2 枠体
2a 絶縁部
2b 上縁
3 窪み
4 装置基板
5 端子部
6a ワイヤ
7 封止材
7a 光取り出し面
20 発光素子
26 p電極
27 n電極
32 バンプ
Claims (2)
- 発光素子が搭載される装置基板、前記装置基板に対して離隔して前記発光素子と電気的に接続される端子部及び前記装置基板と前記端子部とが内底部に配置されて上面が開口をなす窪みを有する枠体と、
前記端子部と電気的に接続される前記発光素子の電極に形成されたバンプと、
前記発光素子と電気的に接続されて全体が前記枠体の上縁よりも低くなるよう配置された2本のワイヤと、
前記枠体の上縁まで前記窪みを満たすように前記窪みに充填されて前記発光素子、前記端子部、前記バンプ及び前記ワイヤ各々の全体を覆って封止した封止材と、
を備え、
前記端子部が、前記発光素子が搭載された前記装置基板の搭載面よりも高い位置に配置され、
前記2本のワイヤのうち、一方の前記ワイヤは一端が前記端子部に接合されて他端が前記バンプに接合され、他方の前記ワイヤは前記バンプに接合された前記ワイヤよりも長さが短く、一端が前記発光素子の前記バンプとは異なる他の電極に、他端が前記発光素子の近傍において前記装置基板に、電気的に接合され、
前記端子部に接続される前記ワイヤの前記端子部における接続面から前記枠体の上縁までの高さが前記発光素子の上面から前記枠体の上縁までの高さより低いことを特徴とする発光装置。 - 前記バンプが前記発光素子のn電極に形成されることを特徴とする請求項1記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013016554 | 2013-01-31 | ||
JP2013016554 | 2013-01-31 | ||
PCT/JP2013/083430 WO2014119146A1 (ja) | 2013-01-31 | 2013-12-13 | 発光装置の製造方法及び発光装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2014119146A1 JPWO2014119146A1 (ja) | 2017-01-26 |
JP6105638B2 true JP6105638B2 (ja) | 2017-03-29 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2014559515A Expired - Fee Related JP6105638B2 (ja) | 2013-01-31 | 2013-12-13 | 発光装置の製造方法及び発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150357527A1 (ja) |
JP (1) | JP6105638B2 (ja) |
CN (1) | CN104904025B (ja) |
WO (1) | WO2014119146A1 (ja) |
Families Citing this family (1)
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CN114335298A (zh) * | 2021-11-27 | 2022-04-12 | 江西晶众腾光电科技有限公司 | 一种6050led封装支架及led灯珠 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3762475B2 (ja) * | 1995-04-10 | 2006-04-05 | 富士通株式会社 | ワイヤボンディング方法及び半導体装置 |
JP2001015542A (ja) * | 1999-07-02 | 2001-01-19 | Sanken Electric Co Ltd | 半導体装置及びその製造方法 |
JP2001284370A (ja) * | 2000-03-30 | 2001-10-12 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
MY149573A (en) * | 2002-10-16 | 2013-09-13 | Nichia Corp | Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor |
CN101089119B (zh) * | 2002-10-16 | 2011-01-26 | 日亚化学工业株式会社 | 氧氮化物荧光体及其制造方法以及使用该氧氮化物荧光体的发光装置 |
JP4359195B2 (ja) * | 2004-06-11 | 2009-11-04 | 株式会社東芝 | 半導体発光装置及びその製造方法並びに半導体発光ユニット |
JP2006012868A (ja) * | 2004-06-22 | 2006-01-12 | Toshiba Corp | 半導体発光素子用パッケージおよびそれを用いた半導体発光装置 |
KR100723247B1 (ko) * | 2006-01-10 | 2007-05-29 | 삼성전기주식회사 | 칩코팅형 led 패키지 및 그 제조방법 |
JP2008300573A (ja) * | 2007-05-30 | 2008-12-11 | Toshiba Corp | 発光装置 |
JP2009206222A (ja) * | 2008-02-27 | 2009-09-10 | Stanley Electric Co Ltd | 半導体発光装置 |
US8258526B2 (en) * | 2008-07-03 | 2012-09-04 | Samsung Led Co., Ltd. | Light emitting diode package including a lead frame with a cavity |
KR101007131B1 (ko) * | 2008-11-25 | 2011-01-10 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
TW201133944A (en) * | 2010-03-30 | 2011-10-01 | Orbit Semicon Ltd | Light-emitting diode chip and package structure thereof |
JP5864851B2 (ja) * | 2010-12-09 | 2016-02-17 | シャープ株式会社 | 発光装置 |
JP2012234955A (ja) * | 2011-04-28 | 2012-11-29 | Toshiba Corp | Ledパッケージ及びその製造方法 |
JP5817297B2 (ja) * | 2011-06-03 | 2015-11-18 | 東芝ライテック株式会社 | 発光装置及び照明装置 |
-
2013
- 2013-12-13 WO PCT/JP2013/083430 patent/WO2014119146A1/ja active Application Filing
- 2013-12-13 JP JP2014559515A patent/JP6105638B2/ja not_active Expired - Fee Related
- 2013-12-13 CN CN201380069511.2A patent/CN104904025B/zh not_active Expired - Fee Related
- 2013-12-13 US US14/653,351 patent/US20150357527A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2014119146A1 (ja) | 2014-08-07 |
CN104904025B (zh) | 2018-04-03 |
US20150357527A1 (en) | 2015-12-10 |
JPWO2014119146A1 (ja) | 2017-01-26 |
CN104904025A (zh) | 2015-09-09 |
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