JP6102842B2 - デスミア処理方法およびデスミア処理装置 - Google Patents

デスミア処理方法およびデスミア処理装置 Download PDF

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Publication number
JP6102842B2
JP6102842B2 JP2014133924A JP2014133924A JP6102842B2 JP 6102842 B2 JP6102842 B2 JP 6102842B2 JP 2014133924 A JP2014133924 A JP 2014133924A JP 2014133924 A JP2014133924 A JP 2014133924A JP 6102842 B2 JP6102842 B2 JP 6102842B2
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JP
Japan
Prior art keywords
processing
gas
processing gas
desmear
light transmission
Prior art date
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Active
Application number
JP2014133924A
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English (en)
Japanese (ja)
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JP2016012678A5 (enExample
JP2016012678A (ja
Inventor
大輝 堀部
大輝 堀部
智行 羽生
智行 羽生
丸山　俊
俊 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP2014133924A priority Critical patent/JP6102842B2/ja
Priority to US15/321,163 priority patent/US20170156217A1/en
Priority to PCT/JP2015/058190 priority patent/WO2016002266A1/ja
Publication of JP2016012678A publication Critical patent/JP2016012678A/ja
Publication of JP2016012678A5 publication Critical patent/JP2016012678A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2014133924A 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置 Active JP6102842B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014133924A JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置
US15/321,163 US20170156217A1 (en) 2014-06-30 2015-03-19 Desmear treatment device and desmear treatment method
PCT/JP2015/058190 WO2016002266A1 (ja) 2014-06-30 2015-03-19 デスミア処理装置およびデスミア処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014133924A JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置

Publications (3)

Publication Number Publication Date
JP2016012678A JP2016012678A (ja) 2016-01-21
JP2016012678A5 JP2016012678A5 (enExample) 2016-12-08
JP6102842B2 true JP6102842B2 (ja) 2017-03-29

Family

ID=55018826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014133924A Active JP6102842B2 (ja) 2014-06-30 2014-06-30 デスミア処理方法およびデスミア処理装置

Country Status (3)

Country Link
US (1) US20170156217A1 (enExample)
JP (1) JP6102842B2 (enExample)
WO (1) WO2016002266A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113518510B (zh) * 2020-04-10 2022-10-11 南通深南电路有限公司 一种pcb板除胶装置和方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
JPS6320833A (ja) * 1986-07-14 1988-01-28 Toshiba Corp アツシング装置
JPH05109674A (ja) * 1991-10-18 1993-04-30 Ushio Inc レジスト膜の灰化方法と灰化装置
JPH08180757A (ja) * 1994-12-21 1996-07-12 Nitto Denko Corp 接点部の形成方法
JPH10280151A (ja) * 1997-04-08 1998-10-20 Fujitsu Ltd Ｃｖｄ装置のクリーニング方法
US7566664B2 (en) * 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
JP2010027702A (ja) * 2008-07-16 2010-02-04 Hitachi Kokusai Electric Inc 基板処理装置及び薄膜生成方法

Also Published As

Publication number Publication date
WO2016002266A1 (ja) 2016-01-07
US20170156217A1 (en) 2017-06-01
JP2016012678A (ja) 2016-01-21

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