JP6098230B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6098230B2
JP6098230B2 JP2013039378A JP2013039378A JP6098230B2 JP 6098230 B2 JP6098230 B2 JP 6098230B2 JP 2013039378 A JP2013039378 A JP 2013039378A JP 2013039378 A JP2013039378 A JP 2013039378A JP 6098230 B2 JP6098230 B2 JP 6098230B2
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Prior art keywords
wiring electrode
esd protection
connection conductor
interlayer connection
electrodes
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JP2013039378A
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Japanese (ja)
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JP2014167988A (ja
JP2014167988A5 (enExample
Inventor
俊幸 中磯
俊幸 中磯
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2013039378A priority Critical patent/JP6098230B2/ja
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Publication of JP2014167988A5 publication Critical patent/JP2014167988A5/ja
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JP2013039378A 2013-02-28 2013-02-28 半導体装置 Active JP6098230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013039378A JP6098230B2 (ja) 2013-02-28 2013-02-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013039378A JP6098230B2 (ja) 2013-02-28 2013-02-28 半導体装置

Publications (3)

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JP2014167988A JP2014167988A (ja) 2014-09-11
JP2014167988A5 JP2014167988A5 (enExample) 2015-07-09
JP6098230B2 true JP6098230B2 (ja) 2017-03-22

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ID=51617551

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JP2013039378A Active JP6098230B2 (ja) 2013-02-28 2013-02-28 半導体装置

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JP (1) JP6098230B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209015904U (zh) 2016-12-28 2019-06-21 株式会社村田制作所 薄膜器件
CN114551410B (zh) * 2022-02-23 2025-12-05 深圳市时代速信科技有限公司 半导体器件及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3416545B2 (ja) * 1998-12-10 2003-06-16 三洋電機株式会社 チップサイズパッケージ及びその製造方法
JP4004196B2 (ja) * 1999-11-16 2007-11-07 イビデン株式会社 半導体チップ
CN203536403U (zh) * 2010-08-18 2014-04-09 株式会社村田制作所 Esd保护器件

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Publication number Publication date
JP2014167988A (ja) 2014-09-11

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