JP2014167988A5 - - Google Patents
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- Publication number
- JP2014167988A5 JP2014167988A5 JP2013039378A JP2013039378A JP2014167988A5 JP 2014167988 A5 JP2014167988 A5 JP 2014167988A5 JP 2013039378 A JP2013039378 A JP 2013039378A JP 2013039378 A JP2013039378 A JP 2013039378A JP 2014167988 A5 JP2014167988 A5 JP 2014167988A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring electrode
- connection conductor
- interlayer connection
- metal film
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 7
- 239000011229 interlayer Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013039378A JP6098230B2 (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013039378A JP6098230B2 (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014167988A JP2014167988A (ja) | 2014-09-11 |
| JP2014167988A5 true JP2014167988A5 (enExample) | 2015-07-09 |
| JP6098230B2 JP6098230B2 (ja) | 2017-03-22 |
Family
ID=51617551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013039378A Active JP6098230B2 (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6098230B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209015904U (zh) | 2016-12-28 | 2019-06-21 | 株式会社村田制作所 | 薄膜器件 |
| CN114551410B (zh) * | 2022-02-23 | 2025-12-05 | 深圳市时代速信科技有限公司 | 半导体器件及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3416545B2 (ja) * | 1998-12-10 | 2003-06-16 | 三洋電機株式会社 | チップサイズパッケージ及びその製造方法 |
| JP4004196B2 (ja) * | 1999-11-16 | 2007-11-07 | イビデン株式会社 | 半導体チップ |
| CN203536403U (zh) * | 2010-08-18 | 2014-04-09 | 株式会社村田制作所 | Esd保护器件 |
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2013
- 2013-02-28 JP JP2013039378A patent/JP6098230B2/ja active Active