JP6095958B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6095958B2
JP6095958B2 JP2012257836A JP2012257836A JP6095958B2 JP 6095958 B2 JP6095958 B2 JP 6095958B2 JP 2012257836 A JP2012257836 A JP 2012257836A JP 2012257836 A JP2012257836 A JP 2012257836A JP 6095958 B2 JP6095958 B2 JP 6095958B2
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JP
Japan
Prior art keywords
substrate
light emitting
emitting element
emitting device
light
Prior art date
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Application number
JP2012257836A
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English (en)
Japanese (ja)
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JP2013153138A (ja
JP2013153138A5 (enExample
Inventor
理絵 新井
理絵 新井
白石　晶紀
晶紀 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012257836A priority Critical patent/JP6095958B2/ja
Priority to US13/723,845 priority patent/US8772822B2/en
Publication of JP2013153138A publication Critical patent/JP2013153138A/ja
Publication of JP2013153138A5 publication Critical patent/JP2013153138A5/ja
Application granted granted Critical
Publication of JP6095958B2 publication Critical patent/JP6095958B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H01S5/02492—CuW heat spreaders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4018—Lasers electrically in series
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
JP2012257836A 2011-12-27 2012-11-26 発光装置 Active JP6095958B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012257836A JP6095958B2 (ja) 2011-12-27 2012-11-26 発光装置
US13/723,845 US8772822B2 (en) 2011-12-27 2012-12-21 Light emitting device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011286756 2011-12-27
JP2011286756 2011-12-27
JP2012257836A JP6095958B2 (ja) 2011-12-27 2012-11-26 発光装置

Publications (3)

Publication Number Publication Date
JP2013153138A JP2013153138A (ja) 2013-08-08
JP2013153138A5 JP2013153138A5 (enExample) 2015-12-17
JP6095958B2 true JP6095958B2 (ja) 2017-03-15

Family

ID=48654524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012257836A Active JP6095958B2 (ja) 2011-12-27 2012-11-26 発光装置

Country Status (2)

Country Link
US (1) US8772822B2 (enExample)
JP (1) JP6095958B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10892296B2 (en) * 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
WO2020014154A1 (en) * 2018-07-08 2020-01-16 Artilux Inc. Light emission apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281781A (ja) * 1989-04-24 1990-11-19 Matsushita Electric Ind Co Ltd 半導体レーザアレイ装置
US5309457A (en) * 1992-12-22 1994-05-03 Minch Richard B Micro-heatpipe cooled laser diode array
US5305344A (en) * 1993-04-29 1994-04-19 Opto Power Corporation Laser diode array
JP3840367B2 (ja) 2000-05-29 2006-11-01 大日本スクリーン製造株式会社 光源
US7255451B2 (en) * 2002-09-20 2007-08-14 Donnelly Corporation Electro-optic mirror cell
JP2002232064A (ja) * 2001-02-05 2002-08-16 Hamamatsu Photonics Kk 半導体レーザ装置、及び、半導体レーザ装置のレンズ位置固定方法
JP4075815B2 (ja) * 2004-02-13 2008-04-16 トヨタ自動車株式会社 積層パワーモジュールおよびその位置決め方法
JP2006080193A (ja) * 2004-09-08 2006-03-23 Sharp Corp 半導体レーザ装置およびそれを備えた光ピックアップ装置
EP1811617A1 (de) 2006-01-18 2007-07-25 JENOPTIK Laserdiode GmbH Träger für eine vertikale Anordnung von Laserdiodenbarren mit Anschlag
JP4313401B2 (ja) * 2007-04-24 2009-08-12 東京エレクトロン株式会社 縦型熱処理装置及び被処理基板移載方法
US7900579B2 (en) * 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
US20110244396A1 (en) * 2010-04-01 2011-10-06 Nikon Corporation Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
JP5765619B2 (ja) * 2010-04-19 2015-08-19 東芝ライテック株式会社 発光装置
US9449862B2 (en) * 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
CN104272438B (zh) * 2012-03-28 2018-01-12 诺发系统公司 用于清洁电镀衬底保持器的方法和装置

Also Published As

Publication number Publication date
US20130163632A1 (en) 2013-06-27
JP2013153138A (ja) 2013-08-08
US8772822B2 (en) 2014-07-08

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