JP6092161B2 - 表面保護フィルム - Google Patents

表面保護フィルム Download PDF

Info

Publication number
JP6092161B2
JP6092161B2 JP2014137994A JP2014137994A JP6092161B2 JP 6092161 B2 JP6092161 B2 JP 6092161B2 JP 2014137994 A JP2014137994 A JP 2014137994A JP 2014137994 A JP2014137994 A JP 2014137994A JP 6092161 B2 JP6092161 B2 JP 6092161B2
Authority
JP
Japan
Prior art keywords
protective film
surface protective
acrylate
meth
acrylic copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014137994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016014124A5 (enExample
JP2016014124A (ja
Inventor
克彦 堀米
克彦 堀米
知親 富永
知親 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2014137994A priority Critical patent/JP6092161B2/ja
Priority to PCT/JP2015/075045 priority patent/WO2016002974A2/ja
Publication of JP2016014124A publication Critical patent/JP2016014124A/ja
Publication of JP2016014124A5 publication Critical patent/JP2016014124A5/ja
Application granted granted Critical
Publication of JP6092161B2 publication Critical patent/JP6092161B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Studio Devices (AREA)
JP2014137994A 2014-07-03 2014-07-03 表面保護フィルム Active JP6092161B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014137994A JP6092161B2 (ja) 2014-07-03 2014-07-03 表面保護フィルム
PCT/JP2015/075045 WO2016002974A2 (ja) 2014-07-03 2015-09-03 表面保護フィルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014137994A JP6092161B2 (ja) 2014-07-03 2014-07-03 表面保護フィルム

Publications (3)

Publication Number Publication Date
JP2016014124A JP2016014124A (ja) 2016-01-28
JP2016014124A5 JP2016014124A5 (enExample) 2016-12-15
JP6092161B2 true JP6092161B2 (ja) 2017-03-08

Family

ID=55230570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014137994A Active JP6092161B2 (ja) 2014-07-03 2014-07-03 表面保護フィルム

Country Status (1)

Country Link
JP (1) JP6092161B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6034522B1 (ja) * 2016-03-17 2016-11-30 古河電気工業株式会社 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
JP2019116609A (ja) * 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
WO2019130741A1 (ja) * 2017-12-26 2019-07-04 日東電工株式会社 光学部材用表面保護シート
JP7538018B2 (ja) * 2020-12-11 2024-08-21 リンテック株式会社 半導体加工用粘着シート及び半導体装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5406456B2 (ja) * 2008-02-01 2014-02-05 株式会社日本触媒 電離放射線硬化性再剥離用粘着剤組成物及びその用途
WO2013136897A1 (ja) * 2012-03-12 2013-09-19 リンテック株式会社 バックグラインドシート用基材および粘着シート、当該基材およびシートの製造方法、ならびにワークの製造方法
JP5979953B2 (ja) * 2012-04-16 2016-08-31 日本合成化学工業株式会社 透明電極用粘着剤、タッチパネル及び画像表示装置、並びに粘着剤層含有積層体の製造方法
JP2014043546A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 放射線硬化型粘着剤層及び放射線硬化型粘着シート
TWI582208B (zh) * 2012-10-19 2017-05-11 Lintec Corp Manufacturing method for adhesive sheet for electronic component processing and semiconductor device
JP6275945B2 (ja) * 2012-12-10 2018-02-07 日東電工株式会社 両面粘着剤付き光学フィルム、およびそれを用いた画像表示装置の製造方法
JP6129541B2 (ja) * 2012-12-17 2017-05-17 リンテック株式会社 ダイシングシート
JP2014025073A (ja) * 2013-10-08 2014-02-06 Mitsubishi Plastics Inc 粘着シート
JP5809685B2 (ja) * 2013-12-12 2015-11-11 リンテック株式会社 粘着シートおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP2016014124A (ja) 2016-01-28

Similar Documents

Publication Publication Date Title
JP6613516B2 (ja) 表面保護フィルム
JP5049620B2 (ja) 粘着シート
JP6528259B2 (ja) 表面保護フィルム
KR101198254B1 (ko) 반도체 제조용 점·접착쉬트
TW202214800A (zh) 補強膜、附補強膜之裝置及其製造方法
KR101454183B1 (ko) 점착 시트
CN110862778B (zh) 层叠体
JP6139808B2 (ja) 表面保護フィルム
JP6092161B2 (ja) 表面保護フィルム
KR20170121146A (ko) 다이싱 시트 및 반도체 칩의 제조 방법
CN110862775A (zh) 层叠体
TWI754679B (zh) 半導體加工用黏著片
TW201920547A (zh) 黏著膜、用於其的黏著組成物以及包含其的顯示構件
JP6496948B2 (ja) 表面保護方法
JP6328397B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
JP6009189B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
JP5727835B2 (ja) 保護膜形成用フィルム、保護膜形成用シートおよび半導体チップの製造方法
JP6006953B2 (ja) 電子部品加工用粘着シートおよび半導体装置の製造方法
WO2016002974A2 (ja) 表面保護フィルム
WO2016013688A1 (ja) 表面保護方法
WO2016027908A1 (ja) 表面保護フィルム
KR101174854B1 (ko) 방사선 박리형 점착제 조성물 및 반도체 웨이퍼 가공용 점착시트
JP6687092B2 (ja) 表面保護フィルム
WO2016006719A1 (ja) 表面保護フィルム
TWI673512B (zh) 表面保護薄膜

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161028

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161028

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20161028

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20161220

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170110

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170208

R150 Certificate of patent or registration of utility model

Ref document number: 6092161

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250