JP6086914B2 - プラスチック光ファイバネットワークのための密閉したスモールフォームファクタ光デバイスのパッケージング - Google Patents
プラスチック光ファイバネットワークのための密閉したスモールフォームファクタ光デバイスのパッケージング Download PDFInfo
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- JP6086914B2 JP6086914B2 JP2014529719A JP2014529719A JP6086914B2 JP 6086914 B2 JP6086914 B2 JP 6086914B2 JP 2014529719 A JP2014529719 A JP 2014529719A JP 2014529719 A JP2014529719 A JP 2014529719A JP 6086914 B2 JP6086914 B2 JP 6086914B2
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- 230000003287 optical effect Effects 0.000 title claims description 84
- 239000013308 plastic optical fiber Substances 0.000 title description 16
- 238000004806 packaging method and process Methods 0.000 title description 2
- 239000000835 fiber Substances 0.000 claims description 196
- 230000005693 optoelectronics Effects 0.000 claims description 112
- 239000013307 optical fiber Substances 0.000 claims description 80
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 210000004894 snout Anatomy 0.000 description 9
- 238000005253 cladding Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000004320 controlled atmosphere Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000006855 networking Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02033—Core or cladding made from organic material, e.g. polymeric material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/227,428 | 2011-09-07 | ||
| US13/227,428 US8596886B2 (en) | 2011-09-07 | 2011-09-07 | Hermetic small form factor optical device packaging for plastic optical fiber networks |
| PCT/US2012/049634 WO2013036338A1 (en) | 2011-09-07 | 2012-08-03 | Hermetic small form factor optical device packaging for plastic optical fiber networks |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014525609A JP2014525609A (ja) | 2014-09-29 |
| JP2014525609A5 JP2014525609A5 (enExample) | 2015-09-17 |
| JP6086914B2 true JP6086914B2 (ja) | 2017-03-01 |
Family
ID=46851580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014529719A Active JP6086914B2 (ja) | 2011-09-07 | 2012-08-03 | プラスチック光ファイバネットワークのための密閉したスモールフォームファクタ光デバイスのパッケージング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8596886B2 (enExample) |
| EP (1) | EP2753964B1 (enExample) |
| JP (1) | JP6086914B2 (enExample) |
| CN (1) | CN103782212B (enExample) |
| WO (1) | WO2013036338A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101679917B1 (ko) * | 2014-02-13 | 2016-11-25 | 한온시스템 주식회사 | 냉매를 팽창시키는 장치 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10572423B2 (en) | 2013-05-17 | 2020-02-25 | The Boeing Company | Systems and methods of data communication |
| CN109416446B (zh) * | 2016-10-11 | 2020-09-25 | 华为技术有限公司 | 一种光收发组件 |
| US20190278036A1 (en) * | 2018-03-07 | 2019-09-12 | Lightwave Logic Inc. | Embedded hermetic capsule and method |
| US11029475B2 (en) * | 2019-04-08 | 2021-06-08 | Cisco Technology, Inc. | Frame lid for in-package optics |
| CN113745963A (zh) * | 2020-05-29 | 2021-12-03 | 方强 | 防止光纤耦合半导体激光模块壳体产生冷凝水的装置 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4307934A (en) | 1978-05-08 | 1981-12-29 | General Dynamics, Pomona Division | Packaged fiber optic modules |
| JPH04191706A (ja) * | 1990-11-27 | 1992-07-10 | Mitsubishi Rayon Co Ltd | 光フアイバ及びその製造法 |
| US5212762A (en) * | 1990-11-27 | 1993-05-18 | Mitsubishi Rayon Co., Ltd. | Plastic-clad silica (PCS) fibers and methods and apparatuses for producing the same |
| US5202943A (en) | 1991-10-04 | 1993-04-13 | International Business Machines Corporation | Optoelectronic assembly with alignment member |
| SE9403574L (sv) * | 1994-10-19 | 1996-04-20 | Ericsson Telefon Ab L M | Optokomponentkapsel med optiskt gränssnitt |
| JPH09318849A (ja) * | 1996-05-24 | 1997-12-12 | Fujitsu Ltd | 光伝送モジュールおよびその製造方法 |
| US5745624A (en) | 1996-08-23 | 1998-04-28 | The Boeing Company | Automatic alignment and locking method and apparatus for fiber optic module manufacturing |
| JP2943760B2 (ja) | 1997-04-18 | 1999-08-30 | 日本電気株式会社 | 光ファイバ導入部の気密封止方法及び気密封止構造 |
| US6056447A (en) * | 1998-04-06 | 2000-05-02 | Lucent Technologies, Inc. | Covariant optical module |
| JP2000019360A (ja) * | 1998-07-03 | 2000-01-21 | Hitachi Ltd | 光モジュール |
| US6888169B2 (en) | 2000-09-29 | 2005-05-03 | Optical Communication Products, Inc. | High speed optical subassembly with ceramic carrier |
| DE10112274B4 (de) | 2001-03-14 | 2006-05-24 | Finisar Corp.(N.D.Ges.D.Staates Delaware), Sunnyvale | Optoelektonisches Sendemodul und Verfahren zu dessen Herstellung |
| US20030053169A1 (en) | 2001-06-07 | 2003-03-20 | The Furukawa Electric Co., Ltd. | Optical transmitter, WDM optical transmission device and optical module |
| FR2830087B1 (fr) | 2001-09-27 | 2003-12-19 | Cit Alcatel | Fibre optique silice a double gaine polymere |
| US6757308B1 (en) | 2002-05-22 | 2004-06-29 | Optical Communication Products, Inc. | Hermetically sealed transmitter optical subassembly |
| US6827505B2 (en) | 2002-12-16 | 2004-12-07 | International Business Machines Corporation | Optoelectronic package structure and process for planar passive optical and optoelectronic devices |
| JP3947481B2 (ja) * | 2003-02-19 | 2007-07-18 | 浜松ホトニクス株式会社 | 光モジュール及びその製造方法 |
| US20040240804A1 (en) | 2003-06-02 | 2004-12-02 | Amaresh Mahapatra | Liquid crystal polymer clad optical fiber and its use in hermetic packaging |
| US6900509B2 (en) | 2003-09-19 | 2005-05-31 | Agilent Technologies, Inc. | Optical receiver package |
| US7309174B2 (en) | 2004-01-22 | 2007-12-18 | Finisar Corporation | Integrated optical devices and methods of making same |
| JP2006066875A (ja) * | 2004-07-26 | 2006-03-09 | Fuji Photo Film Co Ltd | レーザモジュール |
| WO2008111218A1 (ja) | 2007-03-15 | 2008-09-18 | Ibiden Co., Ltd. | 熱電変換装置 |
| US7841781B2 (en) | 2007-08-29 | 2010-11-30 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Methods and apparatuses for providing a hermetic sealing system for an optical transceiver module |
| JP5216714B2 (ja) * | 2009-02-25 | 2013-06-19 | 矢崎総業株式会社 | 1芯双方向光通信モジュール及び1芯双方向光通信コネクタ |
| JP2010237636A (ja) | 2009-03-12 | 2010-10-21 | Toshiba Corp | 光リンク装置及びその製造方法 |
| JP2010217323A (ja) * | 2009-03-13 | 2010-09-30 | Fujikura Ltd | 光結合構造および光送受信モジュール |
-
2011
- 2011-09-07 US US13/227,428 patent/US8596886B2/en active Active
-
2012
- 2012-08-03 WO PCT/US2012/049634 patent/WO2013036338A1/en not_active Ceased
- 2012-08-03 EP EP12759291.3A patent/EP2753964B1/en active Active
- 2012-08-03 JP JP2014529719A patent/JP6086914B2/ja active Active
- 2012-08-03 CN CN201280043536.0A patent/CN103782212B/zh active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101679917B1 (ko) * | 2014-02-13 | 2016-11-25 | 한온시스템 주식회사 | 냉매를 팽창시키는 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103782212B (zh) | 2018-08-07 |
| EP2753964A1 (en) | 2014-07-16 |
| CN103782212A (zh) | 2014-05-07 |
| WO2013036338A1 (en) | 2013-03-14 |
| EP2753964B1 (en) | 2020-10-07 |
| US20130058617A1 (en) | 2013-03-07 |
| JP2014525609A (ja) | 2014-09-29 |
| US8596886B2 (en) | 2013-12-03 |
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