WO2013097449A1 - 一种光电子器件的光导纤维的安装固定结构 - Google Patents
一种光电子器件的光导纤维的安装固定结构 Download PDFInfo
- Publication number
- WO2013097449A1 WO2013097449A1 PCT/CN2012/078700 CN2012078700W WO2013097449A1 WO 2013097449 A1 WO2013097449 A1 WO 2013097449A1 CN 2012078700 W CN2012078700 W CN 2012078700W WO 2013097449 A1 WO2013097449 A1 WO 2013097449A1
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- WIPO (PCT)
- Prior art keywords
- optical fiber
- tail pipe
- tube
- mounting
- optoelectronic device
- Prior art date
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 262
- 229910000679 solder Inorganic materials 0.000 claims abstract description 54
- 230000008878 coupling Effects 0.000 claims abstract description 38
- 238000010168 coupling process Methods 0.000 claims abstract description 38
- 238000005859 coupling reaction Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 230000005693 optoelectronics Effects 0.000 claims description 52
- 239000010410 layer Substances 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 18
- 239000011247 coating layer Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 12
- 238000005253 cladding Methods 0.000 claims description 9
- 229910000833 kovar Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 230000003287 optical effect Effects 0.000 description 14
- 239000010453 quartz Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000001465 metallisation Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003256 environmental substance Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical group [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
Definitions
- the present invention relates to an optoelectronic device, and more particularly to an optoelectronic device in which an optical fiber is mounted with good airtightness.
- Optoelectronic devices in the field of optical communications include optical emitters, photodetectors, optical amplifiers, and the like, and optical couplers, optical wavelength division multiplexing/demultiplexing devices, optical isolators, optical filters, and the like. Passive type devices. As shown in FIG.
- an optical fiber 110 having a certain standard specification is used for conducting light between various types of optoelectronic devices 100 and the outside world to realize transmission of optical signals and light energy between the outside and the optoelectronic device 100.
- the mounting housing of the optoelectronic device 100 also referred to as a package, generally consists of a tubular body 120 and a tube cover 130.
- the tube body 120 may be of a cube-shaped butterfly type, a double in-line type, or a cylindrical shape of a coaxial type, and the material may be kovar (iron-cobalt-nickel alloy), stainless steel, tungsten copper or other metal.
- the tubular body 120 has one or more through holes therein, and is usually formed into a metal tubular structure called a tail pipe 140.
- the optical fiber 110 is optically coupled to the optoelectronic functional unit 101 mounted in the tubular body 120 through the tail pipe 140, and the optical fiber 110 is mounted and fixed by means of the tail pipe 140.
- the photoelectric functional unit 101 may include various components such as a light emitter chip, a photodetector chip, an optical amplifier chip, an optical waveguide chip, an optical lens, an optical fiber, a collimator, an electronic chip, a pad, a fixing bracket, and the like. combination.
- a substrate 102 is typically provided in the envelope of the optoelectronic device 100 such that the optoelectronic functional unit 101 is mounted over the substrate 102.
- the mounting and fixing portion of the optical fiber 110 in the tail pipe 140 needs to meet a certain airtightness requirement to prevent environmental substances such as external moisture from entering the device and causing damage to the functional components, thereby ensuring that the optoelectronic device can work stably for a long time.
- the entire device is placed in a low-moisture inert gas environment (such as nitrogen) to complete the capping of the tubular body 120, that is, the cap 130 is realized and the tube is completed.
- the hermetic welding of the body 120 allows the entire device to form a fully enclosed environment that meets certain air tightness requirements, and the basic manufacturing process of the device is completed.
- FIG. 2a is a cross-sectional structural view of a quartz substrate basic optical fiber 200 generally used in the industry, which includes a core 201, a cladding 202 coated on the core 201, and a coating layer 203 coated on the cladding 202. .
- the core 201 and the cladding 202 are made of quartz, and constitute a bare optical fiber 230.
- the standard outer diameter is typically 125 microns; the coating layer 203 is made of Acrylate and the standard outer diameter is typically 250 microns.
- the coating layer 203 plays a major protective effect on the slender and fragile bare optical fiber 230 including the core 201 and the cladding 202, so that the formed basic optical fiber 200 is not easily bent, twisted, axially pulled, etc. A break or damage has occurred.
- a protective jacket layer 204 is typically added in addition to the coating layer 203, as illustrated in Figure 2b.
- the protective cover layer 204 can be divided into two types, a tight sleeve and a loose sleeve.
- the tightly disposed optical fiber 210 is formed on the basis of the foregoing basic optical fiber 200 by secondary coating to form the protective cover layer 204, which may be made of Hytrd (polyester resin), PVC (polyvinyl chloride), or Nylon (polyamide fiber). ), Polyimide (polyimide) and other polymers.
- the loose sleeve optical fiber 220 is separately formed into a protective cover layer (tube) 204, and then mechanically added to the basic optical fiber 200, so that the protective sleeve layer 204 of the optical fiber 220 is loosened, and the inner diameter thereof is required. It is slightly larger than the outer diameter of the coating layer 203 of the basic optical fiber 200.
- the material of the loose protective cover layer 204 may be ETFE (ethylene tetrafluoroethylene copolymer) or the like.
- the optical fiber 110 of the optoelectronic device 100 that meets the airtightness requirements is mounted on the tube 120.
- the optical fiber 110 is metallized and its metal solder is mounted and fixed.
- the metallization of the optical fiber 110 is divided into two parts. It is based on two types of tight-fitting optical fiber 210 and basic optical fiber 200.
- FIG. 3 shows a typical structure of a metallized optical fiber assembly 300 made from tightly packed optical fibers 210.
- the protective sleeve layer 204 and the coating layer 203 are stripped at one end of the tight optical fiber 210 to expose the bare optical fiber 230 having a diameter of 125 ⁇ m; the entire surface of the metal sleeve 310 is gold-plated, and the structure is as shown in the figure. It can also be of other shapes, one end of which is a thin tube 311 which can only accommodate the bare optical fiber 230, and the other end is a thick tube 312 which can enter the tight optical fiber 210.
- the bare optical fiber 230 penetrates from the end of the thick tube 312 of the metal sleeve 310, passes through one end of the thin tube 311, and the rear tight optical fiber 210 is located in the thick tube 312 of the metal sleeve 310.
- the surface of the bare optical fiber 230 is previously subjected to gold plating metallization treatment, and then the surface gold-plated bare optical fiber 230 is hermetically welded to the metal sleeve 310 at the port of the thin tube 311 of the metal sleeve 310 using the metal solder 320.
- the thick tube 312 of the metal sleeve 310 is filled inwardly along the inner wall of the tube with a fixing adhesive 330 to firmly bond the tight optical fiber 210 to the metal sleeve 310.
- a side hole 313 is opened in a portion of the metal sleeve 310 near the junction with the thin tube 311, and the function is to fill When filling the glue, drain the air inside the tube and observe the filling of the glue.
- the end of the bare optical fiber 230 is processed or fabricated into a coupling structure 340 for optical coupling.
- the coupling structure 340 may be an optical fiber having a flat or beveled end surface, or may be an optical fiber lens, a collimator, an optical lens, and fixed. Various components such as brackets and combinations thereof.
- the other end of the tight-fitting optical fiber 210 is equipped with a standard connection adapter 350, such as SC, LC, MU, ST, etc., for connection to other objects having corresponding adapter ports.
- the photoelectric function unit 101 is located on a certain mounting substrate 102 in the tube body 120, and the inner surface of the tail tube 140 of the tube body 120 is plated with gold.
- the metallized optical fiber assembly 300 is inserted into the tubular body 120 from the tail pipe 140. After the coupling of the coupling structure 340 and the photoelectric functional unit 101 is aligned, the coupling structure 340 can be fixed on the mounting substrate 102, and the fixing manner can be glued or laser.
- the metal sleeve 310 of the metalized optical fiber assembly 300 and the tail tube 140 of the tubular body 120 are hermetically welded together using the metal solder 150; or, the coupling structure 340 can be fixed directly through the metal
- the hermetic welding between the sleeve 310 and the tail pipe 140 using the metal solder 150 is simultaneously achieved.
- the basic optical fiber 200 For the metallization of the basic optical fiber 200 and its solder mounting and mounting, reference may be made to the case of the tight-fitting optical fiber 210 of Figs. 3 and 4 described above, the main difference being that the compact optical fiber 210 is replaced with the basic optical fiber 200.
- the other end of the basic optical fiber 200 is typically no longer equipped with a standard connection adapter 350, but will be used by the customer to make a direct fusion bond with another portion of the optical fiber present in the customer's product.
- the purpose of such use is to reduce the volume of space occupied by the optical fibers and their interconnections. Since the optical fibers in this type of case are only present inside the product and are not used for external use, the basic optical fiber 200 can be used without adding a protective cover 204 thereto.
- the metallization of the above optical fiber and its mounting and fixing technology on the pipe body have been widely used in the industry, and the air sealing property is good, and the disadvantage is that the structure and the process are complicated, the cost is high, and the time is long.
- the cost requirements for optoelectronic devices have become higher and higher, and the cost of metallized optical fibers has become more and more prominent.
- the use of metallized optical fibers and metal solder solder mounting and mounting processes the thermal stress of metal and solder soldering may cause the position of the coupling structure 340 to move under ambient temperature changes, and in extreme cases may cause the structure to be very fragile.
- the bare optical fiber 230 breaks.
- the present invention provides a mounting and fixing structure for an optical fiber of an optoelectronic device, the optoelectronic device comprising a tube body, wherein the tube case is provided with a substrate, and the substrate is mounted with an optoelectronic functional unit, the tube case An outwardly projecting tail pipe is provided, wherein one end of the optical fiber is provided with a coupling structure, and the optical fiber comprises a core covered with a core and a core coated with the same material as the core, away from The cladding of one end of the coupling structure is coated with a coating layer, and the optical fiber is adjacent to one end of the coupling structure to form a bare optical fiber composed of a core and a cladding.
- the optical fiber is separated from the other end of the coupling structure to form a fiber.
- a basic optical fiber composed of a core, a cladding and a coating layer, the optical fiber being disposed in the tail pipe, the coupling structure being located inside the casing and corresponding to the photoelectric functional unit, the bare optical fiber of the optical fiber and
- the tail pipes are fixed by glass soldering.
- a portion of the bare optical fiber adjacent to the coupling structure is coated with a coating layer that forms a substantially optical fiber, and the bare optical fiber exposed outside the basic optical fiber passes through the tail tube Glass solder is fixed by welding.
- a connecting sleeve is disposed on the tail pipe outside the casing, the connecting sleeve is sleeved at one end of the tail pipe, and the other end receives one end of the basic optical fiber outside the tail pipe, A filling glue is injected between the connecting sleeve and the tail pipe, and between the connecting sleeve and the basic optical fiber that is accommodated.
- the connecting sleeve is provided with a side hole.
- a stepped hole is formed in the inner portion of the tail pipe, and the stepped hole forms a thin inner tube of the tail pipe toward a side of the tube casing, and the side of the step hole facing away from the tube shell forms a thick inner portion of the tail pipe a glass solder disposed on a step between the stepped hole and the thin inner tube of the tail pipe, the thin inner tube containing the bare optical fiber, the thick inner tube being disposed away from the coupling structure
- One end of the basic optical fiber, and the filling material is injected between the thick inner tube and the basic optical fiber and the glass solder contained therein.
- the thick inner tube is provided with a side hole.
- the basic optical fiber away from the coupling structure is covered with a protective sleeve layer, and the basic optical fiber and the protective sleeve layer form a sheath optical fiber, and the sheath optical fiber is disposed away from one end of the coupling structure.
- a standard connection adapter There is a standard connection adapter.
- a connecting sleeve is disposed at a tail pipe outside the casing, and one end of the connecting sleeve is sleeved at the tail a tube, the other end of which is located at one end of the sheathed optical fiber outside the tail pipe, between the connecting sleeve and the tail pipe, and the connecting sleeve and the jacketed light guide A filler is injected between the fibers.
- the connecting sleeve is provided with a side hole.
- a stepped hole is formed in the inner portion of the tail pipe, and the stepped hole forms a thin inner tube of the tail pipe toward a side of the tube casing, and the side of the step hole facing away from the tube shell forms a thick inner portion of the tail pipe a glass solder placed on a step between the stepped hole and the thin inner tube of the tail pipe, the thin inner tube containing the bare optical fiber, and the thick inner tube containing the sheath optical fiber At one end, the thick inner tube is filled with a filling glue between the sheathed optical fiber accommodated therein and the glass solder.
- the thick inner tube is provided with a side hole.
- the tail pipe is a Kovar alloy material.
- the bare optical fiber in the present invention is a bare optical fiber 230 from which an outer protective layer such as the coating layer 203 and the protective cover layer 204 is removed, and the standard diameter is usually 125 ⁇ m;
- the bare optical fiber 230 is coated with a coating layer 203 to form a basic optical fiber 200 having a standard diameter of usually 250 micrometers;
- a sheath optical fiber formed by the protective sheath layer 204 is added outside the basic optical fiber 200, that is, the optical fiber 210 is tightly wrapped.
- the optical fiber 220 can be loosened and its usual outer diameter standard is 0.9 mm.
- the glass solder involved in the present invention is particularly a low-temperature glass solder, which is mainly a mixture of glassy characteristics formed by a plurality of metals and non-metal oxides in a certain ratio, and the softening point is generally 280 ° C to 400 °. Between C; its main component is lead oxide, low temperature glass solder material obtained by adding other components and adjusting the ratio to obtain different physical indexes, and its related physical indexes include softening point, viscosity, thermal expansion coefficient, surface wettability and the like.
- the low temperature glass solder can be pre-formed into various geometric shapes as desired, referred to as preformed glass solder, such as the glass solder ring 160 shown in FIG.
- Low-temperature glass solder can form a good hermetic solder contact with quartz or other bare optical fibers that may be used for optical fibers.
- Kovar alloy also has a low thermal expansion coefficient close to that of the glass material, so the low temperature Good airtight solder contact can also be achieved between the glass solder and the tail pipe made of kovar material.
- the mounting and fixing structure of the optical fiber of the optoelectronic device proposed by the invention does not need to adopt the metallization of the optical fiber and the mounting and fixing technology of the metal soldering, and the structure and the process are simple, so the time is small, the cost is low, and the The metallization of existing optical fibers and the thermal stress factors caused by the metal solder solder mounting and fixing process may have an impact on the coupling reliability of the optoelectronic device.
- the quartz substrate optical fiber commonly used in the industry in the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention, the bare optical fiber with small thermal expansion coefficient and close to each other is used.
- the optical fiber will also have various mechanical strength properties and protection capabilities, and thus can be applied to various optoelectronic devices.
- FIG. 1 is a schematic view showing a basic mounting and fixing structure of an optical fiber in an optoelectronic device
- FIG. 2a is a schematic view showing a cross-sectional structure of a basic optical fiber of a quartz substrate commonly used in the industry
- FIG. 2b is a basic optical fiber of a quartz substrate commonly used in the industry. Schematic diagram of the cross-sectional structure of the protective sheath;
- FIG. 2c is a cross-sectional structure of a bare optical fiber in a basic optical fiber of a quartz substrate commonly used in the industry;
- FIG. 3 is a schematic view showing a typical structure of a metallized optical fiber component using a tight-fitting optical fiber in the prior art;
- FIG. 4 is a schematic view showing a typical mounting and fixing structure of a metallized tight-fitting optical fiber component in an optoelectronic device in the prior art
- Figure 5a is a schematic view showing the structure of a non-metallized optical fiber module used in the present invention
- Figure 5b is a schematic view showing the structure of another non-metallized optical fiber module used in the present invention
- Figure 6 is a view used in the present invention. Schematic representation of the three-dimensional shape of a preformed low temperature glass solder material
- Figure 7a is a schematic view showing a specific structure of the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention.
- Figure 7b is a view showing the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention, ⁇ Another schematic diagram of a specific structure
- Figure 8a is a view showing the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention; and a schematic diagram of a supplementary structure of the specific structure shown in Figure 7a;
- Figure 8b is a view showing the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention, ⁇ Schematic diagram of the supplementary structure of the specific structure as shown in Figure 7b;
- Figure 9a is a view showing the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention.
- Figure 9b is a view showing the mounting and fixing structure of the optical fiber of the optoelectronic device of the present invention.
- Fig. 10 is a view showing a modification of the above-described embodiment of the optical fiber mounting and fixing structure of the optoelectronic device of the present invention. DETAILED DESCRIPTION OF THE INVENTION
- the present invention employs the optical fiber assembly 500 as shown in FIG. 5a, wherein the portion of the optical fiber connected to the coupling structure 340 is a bare optical fiber 230, and the portion connected to the standard connection adapter 350 is a sleeve.
- the layer of optical fibers that is, the tight optical fiber 210 or the loose optical fiber 220.
- the surface of the bare optical fiber 230 is no longer metallized. deal with.
- the present invention employs a non-metallized optical fiber assembly 600 as shown in Figure 5b, which differs from the non-metallized optical fiber assembly 500 described above in that the portion of the optical fiber that is coupled to the coupling structure 340 has a coating layer retained thereon.
- the basic optical fiber 200 of 203 exposes a section of bare optical fiber 230 only between the basic optical fiber 200 and the sheath optical fiber on the other side, that is, the tight optical fiber 210 or the loose optical fiber 220.
- a schematic view of the first embodiment includes the above non-metalized optical fiber module 500/600.
- a stepped hole 141A is formed at the nozzle of the tail pipe 140A of the pipe body 120, and a correspondingly shaped preformed low-temperature glass solder 160 having an annular shape as shown in FIG. 6 is placed on the step.
- a correspondingly shaped preformed low-temperature glass solder 160 having an annular shape as shown in FIG. 6 is placed on the step.
- the hole 141A or, as shown in FIG.
- a chamfered opening 141B is formed at the nozzle of the tail pipe 140B of the pipe body 120, and a correspondingly shaped preformed low-temperature glass solder having an annular shape as shown in FIG. A 160 is placed over the chamfered opening 141B.
- the non-metallized optical fiber assembly 500/600 passes through the tailpipe 140A/140B and the low temperature glass solder ring 160, and a portion of the bare optical fiber 230 of the non-metallized optical fiber assembly 500/600 is placed in the low temperature glass solder ring 160 and A certain position before and after.
- the tail pipe 140A/140B is heated, such as the conventional electric resistance welding method using the prior art, or the induction heating method.
- the low-temperature glass solder 160 is melted, and the molten glass solder enters the gap between the bare optical fiber 230 and the tail pipe 140A/140B and is filled, and after cooling and solidifying, the bare optical fiber 230 is tightly welded and fixed to the tail pipe 140A/140B. .
- the preformed low-temperature glass solder 160 placed in the stepped hole 141A can be taken as the tail.
- the tube 140A is in the form of horizontal placement, and may also take the form in which the tail pipe 140A is placed vertically (the tail pipe is placed vertically and the pipe body 120 is placed upward with the tail pipe 140A facing upward), so that it is heated and melted;
- the molten low temperature glass solder 160 can evenly fill all voids between the bare optical fiber 230 and the inner wall of the tailpipe 140A under the effect of the capillary effect.
- the tail pipe 140B is required. Take the form for vertical placement.
- a connecting sleeve 170 is passed through the non-metallized optical fiber assembly 500/600.
- a tight or loose optical fiber other than the tube 140A/140B is mated to the tailpipe 140A/140B, and the other end of the connecting sleeve 170 is mated with the tight or loose optical fiber.
- connection sleeve 170 may need to be previously placed over the tight-fitting optical fiber 210 or the loose-fitting optical fiber 220 of the non-metallized optical fiber assembly 500/600, depending on the particular application; corresponding thereto, the non-metallized optical fiber assembly 500
- the /600 standard connection adapter 350 may be pre-assembled or assembled on its tight-fitting optical fiber 210 or loose-fitting optical fiber 220.
- a filling glue 180 is injected between the connecting sleeve 170 and the tail pipe 140A/140B, and between the connecting sleeve 170 and the mating connection portion of the tight sleeve or the loose optical fiber of the non-metallized optical fiber assembly 500/600, Complete their fixation to each other.
- a side hole 173 can also be formed in the connecting sleeve 170, as shown in Figs. 8a and 8b, to facilitate the injection of the filling glue 180 when the fixing is fixed.
- FIG. 9a which is a mounting and fixing structure of an optical fiber of an optoelectronic device of the present invention
- a schematic view of a second embodiment thereof includes the aforementioned non-metallized optical fiber module 500/600.
- a stepped hole 141C is formed in the inner portion of the tail pipe 140C of the pipe body 120.
- the stepped hole forms a thin inner pipe portion of the tail pipe 140C toward one side of the pipe body 120, and a tail pipe 140C is formed at a side facing away from the pipe body 120.
- the thick inner tube portion mainly refers to a step formed between the stepped hole 141C and the thin inner tube of the tail pipe 140C to place a correspondingly shaped preformed low-temperature glass solder 160 having an annular shape as shown in FIG.
- the optical fiber assembly 210 of the optical fiber assembly 500/600 is tightly wrapped or the optical fiber 220 is loosened.
- the low temperature glass solder ring 160 is placed along the thick inner tube of the tail pipe 140C shown in the drawing to the step where the stepped hole 141C meets the thin inner tube of the tail pipe 140C, and the non-metalized light guide
- the fiber assembly 500/600 passes through the tailpipe 140C and the low temperature glass solder ring 160, and a portion of the bare optical fiber 230 of the non-metallized optical fiber assembly 500/600 is positioned in the low temperature glass solder ring 160 and at a predetermined position.
- the tail pipe 140C is heated to melt the low temperature glass solder 160, and the molten glass solder enters the bare optical fiber 230 and the tail pipe.
- the gap between the thin inner tubes of 140C is filled, and after cooling and solidification, the bare optical fiber 230 and the tail tube 140C are hermetically welded and fixed together.
- the stepped hole 141A is formed at the nozzle of the tail pipe 140A as shown in FIG. 7a and FIG. 8a.
- the pair is placed.
- the preformed low-temperature glass solder 160 at the step where the stepped hole 141C meets the thin inner tube of the tail pipe 140C, the tail pipe 140C may take the form in which the tail pipe is horizontally placed, or the tail pipe 140C may be placed vertically.
- the form is such that the low temperature glass solder located there is heated and melted to form a hermetic weld between the bare optical fiber 230 and the inner wall of the thin inner tube of the tail pipe 140C.
- the thick inner tube of the tail pipe 140C formed by the stepped hole 141C facing away from the pipe body 120 side is provided with a side hole 143.
- the side holes 143 of the tail pipe 140C can be eliminated to form the tail pipe 140D without side holes.
- the fixing of the tight-fitting optical fiber 210 or the loose-fitting optical fiber 220 of the non-metalized optical fiber component 500/600 in the tail pipe 140D is realized only by injecting the filling glue 180 through the nozzle of the tail pipe 140D.
- the non-metallized optical fiber assembly 500/600 used in the mounting and fixing structure of the optical fiber of the present invention and the cases described in the above embodiments, in particular, the non-metallized optical fiber assembly 500 used.
- the tight optical fiber 210 or the loose optical fiber 220 connected to the standard connection adapter 350 may also be the basic optical fiber 200, in which case the portion of the basic optical fiber 200 is no longer assembled with the standard connection adapter 350. Instead, it is directly welded to another part of the optical fiber.
- the non-metallized optical fiber assembly 500/600 is used to The portion of the optical fiber to which the exterior of the tubular body 120 is joined is firstly in the form of the basic optical fiber 200 such that the optical fiber of the non-metallized optical fiber assembly 500/600 can pass from the interior of the tubular body 120 through the tailpipe 140A/140B/140C. /140D wears out; after that, depending on the needs of the application, The basic optical fiber 200 is covered with a protective cover layer 204 to form a loose optical fiber 220, and the assembly of the standard connection adapter 350 is completed.
- the optical fiber mounting structure of the optoelectronic device of the present invention has a tail tube 140A/140B/140C/140D and a connecting sleeve 170 which may be circular, rectangular or other cross-sectional shape.
- Tubular structure The mounting and fixing structure of the optical fiber of the optoelectronic device proposed by the invention comprises the installation and fixing of an optical fiber, and also includes the mounting and fixing of a plurality of optical fibers, and the mounting and fixing method thereof and the optical fiber in the above embodiments
- the installation and fixing methods are the same, and the specific implementation is consistent.
- the mounting and fixing structure of the optical fiber of the optoelectronic device proposed by the present invention, the tube body and the tube cover included in the tube shell are a relative concept, that is, the tube cover included in any specific implementation structure (or The portion which may be referred to as a cap) may also be a tubular portion of the mounting and fixing structure of the optical fiber in the present invention, and the tube (or possibly referred to as a stem) portion included therein may also be an optical fiber in the present invention. Install the cap part of the fixed structure. As shown in FIG.
- the optical fiber of the optoelectronic device comprises a cap 420 and a stem 430, wherein the cap 420 comprises a
- the tail pipe 440 has a connecting sleeve 470 outside the tail pipe 440, and a stepped hole 441 is formed in the nozzle of the tail pipe 440.
- the low temperature glass solder 160 placed therein will pass through the non-metalized optical fiber component 500/ of the tail pipe 440.
- the bare optical fiber 230 of 600 is hermetically welded and fixed to the tail pipe 440, in the connecting sleeve 470 and the tail pipe 440, and the tight sleeve or loose optical fiber of the connecting sleeve 470 and the non-metallized optical fiber assembly 500/600.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014549308A JP2015503770A (ja) | 2011-12-29 | 2012-07-16 | 光電子素子の光ファイバーの実装固定構造 |
EP12862755.1A EP2799919A4 (en) | 2011-12-29 | 2012-07-16 | MOUNTING AND FIXING STRUCTURE FOR OPTICAL FIBER OF A PHOTOELECTRONIC DEVICE |
US14/369,686 US20150030293A1 (en) | 2011-12-29 | 2012-07-16 | Mounting and fixing structure for optical fiber of photoelectron device |
Applications Claiming Priority (2)
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CN2011104502889A CN102436045A (zh) | 2011-12-29 | 2011-12-29 | 一种光电子器件的光导纤维的安装固定结构 |
CN201110450288.9 | 2011-12-29 |
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WO2013097449A1 true WO2013097449A1 (zh) | 2013-07-04 |
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PCT/CN2012/078700 WO2013097449A1 (zh) | 2011-12-29 | 2012-07-16 | 一种光电子器件的光导纤维的安装固定结构 |
Country Status (5)
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US (1) | US20150030293A1 (zh) |
EP (1) | EP2799919A4 (zh) |
JP (1) | JP2015503770A (zh) |
CN (1) | CN102436045A (zh) |
WO (1) | WO2013097449A1 (zh) |
Cited By (2)
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EP3021148A1 (en) * | 2014-11-05 | 2016-05-18 | The Boeing Company | Ruggedized small form factor optical sub-assembly (osa) and data bus-in-a-box (bib) |
US9791644B2 (en) | 2014-11-05 | 2017-10-17 | The Boeing Company | Data bus-in-a-box (BiB) system design and implementation |
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CN102436045A (zh) * | 2011-12-29 | 2012-05-02 | 武汉电信器件有限公司 | 一种光电子器件的光导纤维的安装固定结构 |
US9500808B2 (en) * | 2012-05-09 | 2016-11-22 | The Boeing Company | Ruggedized photonic crystal sensor packaging |
MX344525B (es) * | 2012-09-27 | 2016-12-19 | Dow Global Technologies Llc | Fibra optica metalizada. |
CN105723264A (zh) * | 2013-11-15 | 2016-06-29 | 日本电气株式会社 | 光学通信模块的密封方法和密封结构 |
CN104678517B (zh) * | 2015-03-02 | 2016-09-28 | 武汉电信器件有限公司 | 一种集成的半导体光学器件 |
CN106483683B (zh) * | 2015-09-01 | 2023-11-10 | 广州奥鑫通讯设备有限公司 | 一种气密性封装的铌酸锂调制器件 |
FR3048076B1 (fr) * | 2016-02-18 | 2018-03-16 | Arianegroup Sas | Initiateur opto-pyrotechnique |
JP6540745B2 (ja) * | 2017-03-31 | 2019-07-10 | 住友大阪セメント株式会社 | 光学素子モジュール |
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Also Published As
Publication number | Publication date |
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US20150030293A1 (en) | 2015-01-29 |
CN102436045A (zh) | 2012-05-02 |
EP2799919A1 (en) | 2014-11-05 |
JP2015503770A (ja) | 2015-02-02 |
EP2799919A4 (en) | 2015-02-25 |
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