WO2006038762A1 - Optical subassembly for bidirectional transceiver - Google Patents

Optical subassembly for bidirectional transceiver Download PDF

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Publication number
WO2006038762A1
WO2006038762A1 PCT/KR2005/002053 KR2005002053W WO2006038762A1 WO 2006038762 A1 WO2006038762 A1 WO 2006038762A1 KR 2005002053 W KR2005002053 W KR 2005002053W WO 2006038762 A1 WO2006038762 A1 WO 2006038762A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
die
platform
mount
alignment
Prior art date
Application number
PCT/KR2005/002053
Other languages
French (fr)
Inventor
Tae Hyung Rhee
Hyung Jae Lee
Tae Hun Kim
Original Assignee
Pointek Incorporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pointek Incorporation filed Critical Pointek Incorporation
Publication of WO2006038762A1 publication Critical patent/WO2006038762A1/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/366—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures allowing for adjustment or alignment in all dimensions, i.e. 3D microoptics arrangements, e.g. free space optics on the microbench, microhinges or spring latches, with associated microactuating elements for fine adjustment or alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the present invention relates to the optical sub-assembly for bi-directional optical transceiver.
  • the optical transceiver consists of a transmitter part and a receiver part.
  • the optical transmitter part at A point is connected to the optical receiver part at B point by using a single optical fiber
  • the optical transmitter part at B point is connected to the optical receiver part at A point by using another single optical fiber.
  • an optical technology has been developed and allows the bi-directional optical transmission-reception by sharing a same single optical fiber.
  • An optical bi-directional transceiver is preformed by operating the different transmitting and receiving wavelengths that share the same single line of an optical fiber.
  • FIG. 1 represents the schematic illustration of the conventional optical sub- assembly, the most essential component to assemble an optical transceiver.
  • a metal fixture housing (101) is prepares and an optical fiber (106) is connected to the receptacle.
  • a wavelength selective dielectric filter (102) is mounted with 45° angle to the optical path in the metal fixture housing (101).
  • the optical alignment from a light source (103) to an optical fiber (106) is preformed through passing the dielectric filter (102) when it transmits the light signal.
  • the light signal from the optical fiber is reflected at the dielectric filter (102) and the reflected signal is connected to the photodiode (104).
  • the TO-Can packaged light source (103) and the TO-Can packaged photodiode (104) are mounted in the metal fixture housing (101) by the laser welding process.
  • the light source (103) emits the light to the optical fiber (106) and its position is precisely controlled to locate the maximum light intensity at the fiber end.
  • the best alignment is preformed when the maximum light intensity is reached, and this method is called the optical active alignment .
  • the best alignment is preformed when the maximum light intensity is reached at the photodiode (104).
  • Such manufacturing method based on the active alignment requires an expensive optical alignment facility as well as a laser welding facility. In addition, this method requires the long process time. Therefore, the high manufacturing cost for the optical sub-assembly is easily expected when the conventional method is applied.
  • the passive alignment method between the optical platform and the die-mount platform is applied to replace the conventional active alignment method to manufacture the optical sub-assembly for the bi-directional optical transceiver.
  • the optical platform, by the plastic molding process, and the die-mount platform, by the lead- frame insert plastic molding process are prepared for the passive alignment purpose.
  • the optimized positions, to be mounted with the dies such as light source and photodiode die are designated as well as the alignment structures are arranged for the passive alignment.
  • optical lenses, optical mirror, optical filter mount and optical connector receptacle to have the optical path coupling as well as alignment pins to be optically aligned with the die-mount platform are integrated as a plastic molding body.
  • the optical alignment from the light source to the optical fiber and the alignment from the optical fiber to the photodiode die are preformed by the simple mechanical alignment between the alignment pins in the optical platform and the alignment structures in the die-mount platform.
  • the production cost for the optical sub- assembly can be lowered by eliminating the necessity of the optical active alignment process because the present invention can get rid of the precision alignment facility which requires in the optical active alignment process and because it can reduce the process time which takes long in the active alignment process.
  • the plastic molding bodies it is easier to make the platforms as well as to be more feasible for the mass-production than the conventional metallic fixture housing.
  • Figure 1 is a schematic illustration of a conventional optical sub-assembly for the conventional bi-directional optical transceiver.
  • Figure 2 is a schematic illustration of the optical sub-assembly for the bi-directional optical transceiver in accordance with the present invention.
  • Figure 3 is a schematic illustration of the plastic molding body for the optical platform in accordance with the present invention.
  • FIG. 4 is a schematic illustration of the plastic molding body for the die-mount platform in accordance with the present invention. Best Mode for Carrying Out the Invention
  • the present invention represents an optical sub-assembly which consists of the two parts, the optical platform prepared by a plastic molding method using the an optically transparent plastic material and the die-mount platform prepared by the lead-frame insert molding method of a plastic material.
  • the die-mount platform is completed by attaching the light source, photodiode, pre-amp chip die and decoupling capacitance into the designated pockets of the lead frame inserted plastic molding body for the die-mount platform with the conductive adhesives, followed by the gold wire-bonding between the electrode pads of the dies and the corresponding metal pads of the lead frames, and finally by attaching a dielectric optical filter at the top of the detection area of the photodiode die with an adhesive.
  • This dielectric filter at the top the photodiode die is required to prevent the deterioration of the optical detection sensitivity due to the optical reflection sharing the optical path from the light source in the same die-mount platform.
  • This specific dielectric filter has a function of passing the light source s wavelength from the corresponding optical sub-assembly as well as another function of blocking the light source s wavelength from the own optical sub-assembly.
  • the optical path alignment between the resultant optical platform and the die-mount platform is performed by the coupling between the alignment pins in the optical platform and the alignment structures in the die-mount platform.
  • the optical alignment from the light source to the optical fiber in the optical connector ferrule receptacle through a lens for paralleling the light, a WDM filter, and a lens for focusing the light, in the order, is preformed as transmitting the light signal
  • the optical alignment from the optical fiber in the receptacle to the photodiode die through a lens for paralleling the light, a WDM filter, a reflection mirror and a lens for focusing the light, in the order is performed as receiving the light signal.
  • Figure 3 is the schematic illustration of the plastic molding body for the optical platform by showing a front view, a side view and a plane view.
  • the elements such as optical lenses (304), a reflection mirror (303), a dielectric filter mount (302) and an optical connector ferrule receptacle (301), in order to perform the optical path, and the alignment pins (305) to be passively aligned with the die-mount platform are integrated as a same body of the plastic molding body for the optical platform.
  • FIG. 4 is the schematic illustration of the plastic molding body for the die-mount platform by showing a plane view, a front view and a cross-section side view.
  • a designated pocket (402) to position a light source such as VCSEL die a designated pocket (403) to position a detector such as photodiode die, a mount (404) to attach a dielectric filter for photodiode die, wire-bonding pads (405), the leads (401, 406, 407) for the electric connection, a designated pocket (408) for a pre-amp chip die, a designated pocket (409) for a decoupling capacitance and the designated alignment structures (410) are integrated in a lead- frame inserted plastic molding body for the die-mount platform.
  • the leads consist of the leads (401) to connect to the receiver part, the leads (406) to connect to the transmitter part, and the rest of the leads (407) for the insertion molding that are eliminated after the molding process.
  • the present invention represents an optical sub-assembly which consists of the two parts, the optical platform prepared by a plastic molding method using the an optically transparent plastic material and the die-mount platform prepared by the lead- frame insert molding method of a plastic material.
  • the optical path alignment between the resultant optical platform and the die-mount platform is performed by the coupling between the alignment pins in the optical platform and the alignment structures in the die-mount platform.
  • the optical alignment from the light source to the optical fiber in the optical connector ferrule receptacle through a lens for paralleling the light, a WDM filter, and a lens for focusing the light, in the order, is preformed as transmitting the light signal
  • the optical alignment from the optical fiber in the receptacle to the photodiode die through a lens for paralleling the light, a WDM filter, a reflection mirror and a lens for focusing the light, in the order is performed as receiving the light signal.
  • the embodiments in the present invention are able to provide the low cost manu ⁇ facturing of the optical sub-assembly for the optical transceiver required in the optical communications and data communications.
  • this invention can provides the effective use of the optical fiber lines due to the bi-directional optical transmissions and receptions through a single line of an optical fiber.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The present invention relates to the optical sub-assembly for bi-directional optical transceiver, which can transmit and receive the optical signal through a single optical fiber, and the manufacturing method of such optical sub-assembly. In the present invention, the optical platform is prepared by a plastic molding method using an optical plastic material with good optical transparency and the die-mount platform, in which the optical source, photodiode and preamplifier are well mounted in the designated positions, is prepared by a lead-frame insert molding of a plastic material. In the optical platform, an optical connector ferrule receptacle, the optical lenses, a reflection mirror, the alignment pins and the dielectric filter mount are located and formed by the plastic molding process. The optical passive alignment between the optical platform and the die-mount platform is preformed by using the alignment pins and the alignment structures, which are located in the designated positions in both platforms.

Description

Description
OPTICAL SUBASSEMBLY FOR BIDIRECTIONAL
TRANSCEIVER
Technical Field
[1] The present invention relates to the optical sub-assembly for bi-directional optical transceiver. In general, the optical transceiver consists of a transmitter part and a receiver part. For the optical communications between A point to B point, the optical transmitter part at A point is connected to the optical receiver part at B point by using a single optical fiber, and the optical transmitter part at B point is connected to the optical receiver part at A point by using another single optical fiber. In order to halve the numbers of installed optical fibers in such optical transceiver, an optical technology has been developed and allows the bi-directional optical transmission-reception by sharing a same single optical fiber. An optical bi-directional transceiver is preformed by operating the different transmitting and receiving wavelengths that share the same single line of an optical fiber.
[2]
Background Art
[3] Figure 1 represents the schematic illustration of the conventional optical sub- assembly, the most essential component to assemble an optical transceiver. For the general structure of the conventional optical sub-assembly, a metal fixture housing (101) is prepares and an optical fiber (106) is connected to the receptacle. A wavelength selective dielectric filter (102) is mounted with 45° angle to the optical path in the metal fixture housing (101). Then, the optical alignment from a light source (103) to an optical fiber (106) is preformed through passing the dielectric filter (102) when it transmits the light signal. When it receives the optical signal, the light signal from the optical fiber is reflected at the dielectric filter (102) and the reflected signal is connected to the photodiode (104). The TO-Can packaged light source (103) and the TO-Can packaged photodiode (104) are mounted in the metal fixture housing (101) by the laser welding process. In this alignment process, the light source (103) emits the light to the optical fiber (106) and its position is precisely controlled to locate the maximum light intensity at the fiber end. The best alignment is preformed when the maximum light intensity is reached, and this method is called the optical active alignment . To align the photodiode (104) to the optical fiber (106), the light from optical fiber (106) is launched into the photodiode (104) and the position of the photodiode (104) is precisely controlled to locate the maximum light intensity. The best alignment is preformed when the maximum light intensity is reached at the photodiode (104). Such manufacturing method based on the active alignment requires an expensive optical alignment facility as well as a laser welding facility. In addition, this method requires the long process time. Therefore, the high manufacturing cost for the optical sub-assembly is easily expected when the conventional method is applied.
[4]
Disclosure of Invention Technical Problem
[5] The conventional method to manufacture an optical sub-assembly requires the long process time as well as the high manufacturing cost because it is necessary for the active alignment method, which requires the optimized optical alignment by monitoring the optical active devices, to use the expensive alignment facility and to take the long process time. Otherwise, the passive alignment method, which performs the optical alignment without using the optical active devices, can provide the sub¬ stantially low cost because the simple assembly of manufacturing an optical sub- assembly is possible. Technical Solution
[6] In the present invention, the passive alignment method between the optical platform and the die-mount platform is applied to replace the conventional active alignment method to manufacture the optical sub-assembly for the bi-directional optical transceiver. In addition, the optical platform, by the plastic molding process, and the die-mount platform, by the lead- frame insert plastic molding process, are prepared for the passive alignment purpose. In the die-mount platform, the optimized positions, to be mounted with the dies such as light source and photodiode die, are designated as well as the alignment structures are arranged for the passive alignment. In the optical platform, optical lenses, optical mirror, optical filter mount and optical connector receptacle to have the optical path coupling as well as alignment pins to be optically aligned with the die-mount platform are integrated as a plastic molding body. The optical alignment from the light source to the optical fiber and the alignment from the optical fiber to the photodiode die are preformed by the simple mechanical alignment between the alignment pins in the optical platform and the alignment structures in the die-mount platform.
Advantageous Effects
[7] With accordance of the present invention, the production cost for the optical sub- assembly can be lowered by eliminating the necessity of the optical active alignment process because the present invention can get rid of the precision alignment facility which requires in the optical active alignment process and because it can reduce the process time which takes long in the active alignment process. As well, by using the plastic molding bodies, it is easier to make the platforms as well as to be more feasible for the mass-production than the conventional metallic fixture housing. Brief Description of the Drawings
[8] The subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of practice, together with further objects and advantages thereof, may be best understood by reference to the following detailed description of the preferred embodiment(s) and the accompanying drawings in which:
[9] Figure 1 is a schematic illustration of a conventional optical sub-assembly for the conventional bi-directional optical transceiver.
[10] Figure 2 is a schematic illustration of the optical sub-assembly for the bi-directional optical transceiver in accordance with the present invention.
[11] Figure 3 is a schematic illustration of the plastic molding body for the optical platform in accordance with the present invention.
[12] Figure 4 is a schematic illustration of the plastic molding body for the die-mount platform in accordance with the present invention. Best Mode for Carrying Out the Invention
[13] As shown in Figure 2, the present invention represents an optical sub-assembly which consists of the two parts, the optical platform prepared by a plastic molding method using the an optically transparent plastic material and the die-mount platform prepared by the lead-frame insert molding method of a plastic material. A plastic molding body for the optical platform in which a receptacle part (201) to be connected to the optical connector ferrule, three optical lenses (204), an optical reflection mirror (203) to change the optical path, an optical filter mount to hold a wavelength selective dielectric filter (202), and the alignment pins (205) to have the optical path aligned with the die-mount platform (207) are integrated, is prepared and the resultant optical platform is embodied by attaching the wavelength selective filter (202) to the dielectric filter mount in the plastic molding body for the optical platform.
[14] A plastic molding body for the die-mount platform in which a designated pocket to position a light source (209) such as VCSEL die, a designated pocket to position a photodiode die (209), a designated pocket for a pre-amp chip die, a designated pocket for a decoupling capacitance, the designated alignment structures (210) to align with the alignment pins in optical platform, and the lead frame (211) inserted into the plastic molding body for the electric connection are integrated, is prepared and the resultant die-mount platform is embodied by attaching the VCSEL die, photodiode die, pre-amp chip die and decoupling capacitance into the designated pockets of the plastic molding body for die-mount platform. The die-mount platform is completed by attaching the light source, photodiode, pre-amp chip die and decoupling capacitance into the designated pockets of the lead frame inserted plastic molding body for the die-mount platform with the conductive adhesives, followed by the gold wire-bonding between the electrode pads of the dies and the corresponding metal pads of the lead frames, and finally by attaching a dielectric optical filter at the top of the detection area of the photodiode die with an adhesive. This dielectric filter at the top the photodiode die is required to prevent the deterioration of the optical detection sensitivity due to the optical reflection sharing the optical path from the light source in the same die-mount platform. This specific dielectric filter has a function of passing the light source s wavelength from the corresponding optical sub-assembly as well as another function of blocking the light source s wavelength from the own optical sub-assembly.
[15] The optical path alignment between the resultant optical platform and the die-mount platform is performed by the coupling between the alignment pins in the optical platform and the alignment structures in the die-mount platform. The optical alignment from the light source to the optical fiber in the optical connector ferrule receptacle through a lens for paralleling the light, a WDM filter, and a lens for focusing the light, in the order, is preformed as transmitting the light signal, and the optical alignment from the optical fiber in the receptacle to the photodiode die through a lens for paralleling the light, a WDM filter, a reflection mirror and a lens for focusing the light, in the order, is performed as receiving the light signal. These alignments are preformed because every element in two plastic molding bodies is positioned in the places cor¬ responding to the alignment pins and alignment structures.
[16] Figure 3 is the schematic illustration of the plastic molding body for the optical platform by showing a front view, a side view and a plane view. As explained, the elements such as optical lenses (304), a reflection mirror (303), a dielectric filter mount (302) and an optical connector ferrule receptacle (301), in order to perform the optical path, and the alignment pins (305) to be passively aligned with the die-mount platform are integrated as a same body of the plastic molding body for the optical platform.
[17] Figure 4 is the schematic illustration of the plastic molding body for the die-mount platform by showing a plane view, a front view and a cross-section side view. As explained, a designated pocket (402) to position a light source such as VCSEL die, a designated pocket (403) to position a detector such as photodiode die, a mount (404) to attach a dielectric filter for photodiode die, wire-bonding pads (405), the leads (401, 406, 407) for the electric connection, a designated pocket (408) for a pre-amp chip die, a designated pocket (409) for a decoupling capacitance and the designated alignment structures (410) are integrated in a lead- frame inserted plastic molding body for the die-mount platform. The leads consist of the leads (401) to connect to the receiver part, the leads (406) to connect to the transmitter part, and the rest of the leads (407) for the insertion molding that are eliminated after the molding process. Mode for the Invention
[18] The present invention represents an optical sub-assembly which consists of the two parts, the optical platform prepared by a plastic molding method using the an optically transparent plastic material and the die-mount platform prepared by the lead- frame insert molding method of a plastic material. The optical path alignment between the resultant optical platform and the die-mount platform is performed by the coupling between the alignment pins in the optical platform and the alignment structures in the die-mount platform. Also, the optical alignment from the light source to the optical fiber in the optical connector ferrule receptacle through a lens for paralleling the light, a WDM filter, and a lens for focusing the light, in the order, is preformed as transmitting the light signal, and the optical alignment from the optical fiber in the receptacle to the photodiode die through a lens for paralleling the light, a WDM filter, a reflection mirror and a lens for focusing the light, in the order, is performed as receiving the light signal. These alignments are preformed because every element in two plastic molding bodies is positioned in the places corresponding to the alignment pins and alignment structures. Industrial Applicability
[19] The embodiments in the present invention are able to provide the low cost manu¬ facturing of the optical sub-assembly for the optical transceiver required in the optical communications and data communications. As well, this invention can provides the effective use of the optical fiber lines due to the bi-directional optical transmissions and receptions through a single line of an optical fiber.
[20]

Claims

Claims
[1] An optical sub-assembly for an optical bi-directional transceiver, which consists of an optical platform and a die-mount platform, comprising: An optical platform, which is formed by plastic molding of an optically transparent polymer;
A die-mount platform, which is formed by lead frame inserting molding; A die-mount platform in which an optical source, photodiode die, a pre-amp chip die, and other element dies are placed and attached; A die-mount platform in which the alignment structures are formed at the designated positions in order to have the passive alignment; An optical platform in which the alignment pins are formed at the designated positions in order to have the passive alignment; and
An optical sub-assembly that is passively aligned by coupling the alignment pins and alignment structures formed in an optical platform and a die-mount platform.
[2] An optical platform to constitute the optical sub-assembly for the optical bi¬ directional, comprising:
A plastic molding body for the said optical platform, in which an optical connector ferrule receptacle, the optical lenses to make the parallel light or focused light for the optical alignment, a reflection mirror for optical path angle change, a dielectric optical filter mount for wavelength selective filter, the alignment pins or alignment structures for the optical passive alignment, are formed as a same plastic body.
[3] A die-mount platform to compose the optical sub-assembly for an optical bi¬ directional transceiver, comprising:
A plastic molding body for the die-mount platform, in which the designated pockets to position a light source, a photodiode die, a pre-amp chip die and a de coupling capacitance, the dielectric optical filter mount, the wire-bonding pads for the electric connections between the lead frames and the dies, the designated alignment pins or structures to be passively aligned with an optical platform, are formed as a same plastic body.
[4] The method of attaching the said wavelength selective filter to the said optical dielectric filter mount formed in the said plastic molding body for an optical platform by using a photo-curing adhesive.
[5] The method of manufacturing a die-mount platform for an optical sub-assembly, comprising the steps performed either sequentially or non-sequentially of; A step to conductively attach the said light source, photodiode die, pre-amp chip die and decoupling capacitance into the designated pockets in the said plastic molding body for a die-mount platform by using the conductive adhesives;
A step to have the wire-bonding electric connections from the said light source, photodiode die, pre-amp chip die and decoupling capacitance to the pads connected to the lead frames;
A step to mount the dielectric filter to the filter mount for the photodiode die in the said plastic molding body; and
A step to attach the dielectric filter to the filter mount for the photodiode die in the said plastic molding body by using an adhesive. [6] An optical platform in the Claim 1, comprising:
Two different wavelengths are operated for the bi-directional transmission; and
The dielectric wavelength selective filter, which has the wavelength-pass or wavelength-rejection function to the operating wavelengths. [7] An optical platform, comprising:
The said plastic molding body for the optical platform which is composed of a plastic material with good optical transparency comprising polycarbonates (PC), polymethylmethacrylates (PMMA), Ultem resins. [8] A die-mount platform, comprising:
The said plastic molding body for the die-mount platform that is composed of a plastic material with good thermal stability comprising liquid crystal polymers
(LCP).
PCT/KR2005/002053 2004-10-05 2005-06-30 Optical subassembly for bidirectional transceiver WO2006038762A1 (en)

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Application Number Priority Date Filing Date Title
KR10-2004-0078932 2004-10-05
KR20040078932A KR100684460B1 (en) 2004-10-05 2004-10-05 Optical Sub-Assembly for Optical Transceiver and the Manufacturing Method Thereof

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WO2012031781A3 (en) * 2010-09-12 2012-05-24 Amphenol-Tuchel Electronics Gmbh Optoelectronic coupling device, optoelectronic component and optoelectronic transceiver
CN103443680A (en) * 2010-09-17 2013-12-11 株式会社优奈芙 Optical transmission and receiving device for implementing passive alignment of components and method for passively aligning components
CN105242360A (en) * 2006-12-22 2016-01-13 思科技术公司 Dual-lensed unitary optical receiver assembly
CN106938396A (en) * 2017-02-24 2017-07-11 成都光创联科技有限公司 The processing method of multiport optical device
CN109716190A (en) * 2017-06-09 2019-05-03 深圳市亚派光电器件有限公司 A kind of bi-directional single fiber component
WO2020196696A1 (en) * 2019-03-26 2020-10-01 株式会社エンプラス Optical receptacle, optical module, and method for manufacturing optical module

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WO2015156431A1 (en) * 2014-04-08 2015-10-15 주식회사 옵토웰 Multiwavelength optical sub-assembly module
KR101916496B1 (en) * 2014-08-07 2018-11-08 엘에스엠트론 주식회사 A plug-type light alignment device with an optical mirror, manufacturing methods thereof and an assembly of a light alignment device with a receptacle

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