九、發明說明： 【發明所屬技術領域】 本發明係有關於一種單芯雙向光學模組，詳而言之， 本發明係有關於一種用以構建其主要部分之雙向光學次總 成（bi-directional optical subassembly)及組裝有該雙向光學 次總成之收發器。 t先前技術3 近年來’為了高速且大容量通訊之市場需求，使得加 入者系列（用戶）通訊網絡的光纖化急速加快，遂有一以i 10 條單模光纖進行1310nm頻帶及1490nm頻帶兩種波長進行 發送及接收之分波長多工式（WDM : Wavelength Division Multiplexing)之通訊方式開始引人注意。其中尤以基地台對 豕庭為1對η之被動光纖網路（PON : Passive Optical Network)系統受到矚目，基地台側之149〇nm發送/丨31〇nm 15 接收（光纖線路終端機；〇LT=〇ptical Line Terminal)用之單 芯雙向光學模組)及家庭側之131〇nm發送/1490nm接收之 光纖加入者線路終端機（光纖網路單元；〇NU=0ptica] Network Unit)用之單芯雙向光學模組的研發亦日新月異， 期使ONU用模組小型化及低成本化，且其使該〇nu用模 20 組能容納龐大數量者。 用以構建單芯雙向光學模組的主要部分之雙向光學次 總成（bi-directional optical subassembly)(以下稱為 B0SA)通 常包含有：雷射二極體(LD)用與光二極體(PD)用之兩個封 裝件（即，以所謂的TO CAN之封蓋（can cap)個別分封者）、 5 光纖、分波長多工(WDM)蟬濾器、及，用以固持其等元件 之殼體。LD用封蓋與Pd用封蓋係設置成正交狀態’且LD 用及PD用接腳亦呈垂直狀態。為了減少發送側與接收側間 之電串擾’勢將其等接腳間的距離尺寸相對加長。 對於如此由兩T〇_CAN構成之b〇SA型態時，乃有設 計自由度受到阻礙且構造趨於複雜，並因為多數製程是不 可或缺的’所以製造成本之降低很困難等之課題。 為解決上述課題’有一提案，其係於單一 ΤΟ-CAN的 内部將LD及PD各晶片及各光學系與電系匯集後容置其中 之構造（參考諸如專利文獻丨）。 [專利文獻1]美國專利申請公開第2〇〇5/〇〇84268號 H 明内穷3 惟’依上述ΤΟ-CAN令將用於收發訊息之光要素及電 要素匯總後容置其中之構造，使得光學串擾(雜散光)及電串 擾之電及光學干擾成為極大障礙，顯難實現小型化及低成 本化者乃為實情。 在此’本發明之課題係於實現一種光學模組，藉其可 合理地將收發用之光要素收容在單一ΤΟ-CAN封裝件中，且 可從根本上改善（減少）無可避免之串擾者。 為解決上述課題，本發明之第1態樣(aspect ;觀點）係 —種雙向光學次總成，包含有：雷射二極體；光二極體： 可與座管一起將雷射二極體及光二極體密封之封蓋；及， 用以降低光學及/或電串擾之串擾減少構造。 本發明之第2態樣係於第丨態樣中，前述串擾减少構 1339029 造具有一形成在封蓋内面且，可吸收紅外線之層者。 本發明之第3態樣係於第2態樣中，前述層係形成有 黑色鍵敷層者。 本發明之第4態樣係於第2態樣中，前述層係形成有 5 樹脂層者。 本發明之第5態樣係於第1態樣中，前述串擾減少構 造具有一擋塊(block)，該擋塊係設於雷射二極體與光二極 體之間，可物理性地阻擋由雷射二極體往光二極體之雜散 光者。 10 本發明之第6態樣係於第5態樣中，前述擋塊具有一 用以組裝電子零件（例如雷射二極體及/或光二極體）之電路 板者。 本發明之第7態樣係於第1態樣中，前述争擾減少構 造係具有樹脂，該樹脂設於雷射二極體的後方位置，且可 15 吸收雷射二極體的後方光。 本發明之第8態樣係於第7態樣中，更具有一可組裝 有雷射二極體及光二極體之矽基板，而前述樹脂係設於矽 基板上者。 本發明之第9態樣係於第7態樣中，前述座管具有： 20 圓盤狀臺座；及，突起，係由臺座垂直突出且可載設用以 組裝雷射二極體及光二極體之矽基板者，而前述樹脂係設 於座管之臺座者。 本發明之第10態樣係於第1態樣中，座管具有：圓盤 狀臺座；及，突起，係由前述臺座垂直突出且可載設用以 7 1339029 組裝雷射二極體及光二極蹲之矽基板者，並設有貫穿設置 於座管之發送側用引線接腳群及接收側用引線接腳群，且 發送側用引線接腳群附近設有具備接地電位之座管突起。 本發明之第11態樣係於第1態樣中，更具有一用以將 5 來自光二極體之接收訊號放大之變壓器阻抗放大器，而， 前述串擾減少構造具有：用以將雷射二極體或與雷射二極 體連接之電極墊和發送側引線接腳相連接之導線對；用以 將光二極體或與光二極體連接之電極墊和變壓器阻抗放大 器相連接之導線對；及，用以將變壓器阻抗放大器與接收 10 側引線接腳相速接之導線對；且將各導線對鋪設成相互略 呈正交之狀態者。 本發明之第12態樣係於第1態樣中，座管具有圓盤狀 臺座；及突起，係由前述臺座垂直突出且載設有用以組裝 雷射二極體及光二極體之矽基板者；又1具有發送側用引 15 線接腳群與接收側用引線接腳群之多數電連接用的引線接 腳係構造成：貫穿設置於座管，且於與座管突起相反之側 分成發送側用引線接腳群及接收側用引線接腳群兩群，雙 方平行設置，前述兩群間設有内層具有接地層之印刷電路 板。 20 本發明之第13態樣係於第1態樣中，更具有插座；及， 光濾波器，係設於前述插座靠封蓋側之光出入端且對光軸 傾斜一預定角度者。 本發明之第14態樣係一種光收發器，包含有：雙向光 學次總成，具有：雷射二極體、光二極體、可與座管一起 8 1339029 將雷射二極體及光二極體密封之封蓋、及用以降低光學及/ 或電串擾之串擾減少構造；光學發送接收用印刷電路板， 係用於雙向光學次總成者；及，外殼，係用以覆蓋雙向光 學次總成及印刷電路板者。 5 本發明之第15態樣係於第14態樣中，前述串擾減少 構造具有一形成於封蓋内面且可吸收紅外線之層者。 本發明之第16態樣係於第14態樣中，前述串擾減少 構造係具有一擋塊，該擋塊係設於雷射二極體與光二極體 之間，可物理性地阻擋由雷射二極體往光二極體之雜散光 10 者。 本發明之第17態樣係於第14態樣中，前述串擾減少 構造具有樹脂，該樹脂設於雷射二極體的後方位置，且可 吸收雷射二極體的後方光。 本發明之第18態樣係於第丨4態樣中，座管具有：圓 15 盤狀臺座；及，突起，係由前述臺座垂直突出且可載設用 以組裝前述雷射二極體及光二極體之矽基板者，並設有貫 穿設置於座管之發送側用引線接腳群及接收側用引線接腳 群，且發送側用引線接腳群附近設置具有接地電位之座管 突起。 20 本發明之第19態樣係於第14態樣中，更具有一用以 將來自光二極體之接收訊號放大之變壓器阻抗放大器， 而，前述串擾減少構造係具有：用以將雷射二極體或與雷 射二極體連接之電極墊和發送側引線接腳相連接之導線 對；用以將光二極體或與光二極體連接之電極墊和變壓器 9 H/U放大@相連接之導線對：及用以將變壓器阻抗放大 器與接收則線接聊相連接之導線對；且將各導線對鋪設 成相互略呈正交之狀態者。 本發明之第20態樣係、於第丨4態樣中，更具有插座； 及，光錢器’係、設於插座靠封蓋側之光“端，且對光 轴傾斜一預定角度者。 [發明之效果] 依本發明，可將性能維持與習知同等或之上，並大幅 減少構成零件的使用數量，其構造簡單且製造簡單，因此 10可實現低成本及大量生產者。 熟悉此項技藝者對於本發明之上述及其他目的'作用 及效果等，可由附圖及本發明實施形態之記載而明瞭。 [圖式簡單說明] 第1圖係本實施形態的雙向光學次總成(微型B〇SA) 15 之立體圖。 第2A圖係微型BOSA之側視圖。 第2B圖係微型BOSA之端面圖。 第2C圖係微型BOSA之電路圖。 第3圖係光收發器之立體圖。 2〇 第4A圖係光收發器之俯視圖。 第4B圖之光收發器之端面圖。 第4C圖係光收發器之側視圖。 第5圖係安裝有外殼之光收發器之立體圖。 第6圖係微型BOSA晶片之立體圖。 10 1339029 第7圖係插座之立體圖.。 第8圖係封蓋之縱剖視圖。 第9圖係微型BOSA晶片之俯視圖。 第10圖係顯示於座管上盛設樹脂之結構圖。 5 第11圖係顯示於矽基板上盛設樹脂之結構圖。 第12A圖係顯示封蓋内發送側及接收側之各佈線之配 置圖。 第12B圖係座管突起部的上視圖。 第13圖係顯示以由封蓋突出之引線接腳夾設印刷板之 10 關係圖。 第14A圖係顯示對座管進行附設編號之步驟圖。 第14B圖係顯示微型BOSA晶片進行導線接合(DB)之 步驟圖。 第14C圖係顯示載設電路板之步驟圖。 15 第14D圖係顯示對T1A進行導線接合之步驟圖。 第14E圖係顯示進行真空烘烤(baking)之步驟圖。 第14F圖係顯示對封蓋進行調芯且固定之步驟圖。 第14G係與第14F同樣之圖。 第14H圖係進行YAG熔接之步驟圖。 20 【實施方式】 如下說明本發明之一實施形態，但本發明不限於此種 形態亦不須贅言。 第1圖係本實施形態之超小型雙向光學次總成(microcompact bi-directional optical subassembly)(以下稱為微型 11 1339029 BOSA)l的立體圖，第2A ^ 2B圖各為本微型BOSA】之側 視圖及端面圖。第2C圖係本微型BOSA1之電路圖。第3 圖係光收發器總成(assembly)5之立體圖，該光收發器總成 5係將發送及接收等所使用（驅動用及電介面用）印刷電路 5 板3組裝在微蜇BOSA1而成者。第4A、4B、4C圖各為本 光收發器總成5之俯視圖、端面圖、側視圖。第5圖係安 裝有特定外殼7之光收發器6的立體圖。該光收發器6係 一種1條光纖上以1310nm頻帶/1490nm頻帶2波長進行收 發之分波長多工（WDM : Wavelength Division Multiplexing) 10 方式的光收發器。 本實施形態之微型BOSA1係以其實體大綱而言，將至 少可實現雙向功能之光纖收容在單一罐狀封蓋（或封裝件） 而成簡潔狀態，並且，如後述，可巧妙地解決雜散光等不 當狀況者。 15 微型B〇SAl係可構造成極小結構，諸如全長約i6 4mm、 直徑約6.6mm，可易於組裝成習知的SFF(SmaU〜啦 Factor)收發器封裝件般之大小。一看微型B〇SA1之外觀， 其呈 TO 同軸 OSA(Optical Subassembly)者。 參考第^圖’微型B0SA1基本上包含有：微型b〇sa 2〇晶片9、載設微型B0SA晶片9之座管u、用以覆蓋微型 BOSA晶片9予以密封的附有球透鏡之封蓋（以下有使用 「封蓋」或-般的「TO-CAN」之用詞之形態)13、插座(例 如SC形的光連接器）15、及，用以將封蓋13及插座丨5連 結之連接用圓筒零件17 « 12 1339029 參考第6圖，微型ΒΟβΑ晶片9係具有諸如24mm χ 2.4mm之矽基板(SiOB :矽光具座）19及、安裝其上之如下 各種零件，即，雷射二極體LD及光二極體PD等各晶片及 2個矽微透鏡SL及分波長多工濾波器（以下稱為Wdm濾波 5為）25。1*0晶片係以玻璃基板27為中介而安裝在矽基板19 上。除此之外，矽基板丨9上還安裝有TIA(變壓器阻裝放大 器）29及陶瓷基板（電路板)31。 所使用之LD晶片及PD晶片及WDM濾波器乃係習 知之光學構件（component)，因此可以低成本且大量生產之 10萬用零件所構成者。 兩矽微透鏡SL即所謂的繞射透鏡，用於使空間結合型 之單芯雙向功能簡潔實現者。 由第6圖可理解到，一邊的矽微透鏡SL係設於匕〇晶 片與WDM濾波器25之間，係一種將來自LD晶片之射Z 15光(諸如l310nm)對準(c〇llimate)用之透鏡例如非球面的近 接式石夕微透鏡。另-邊的石夕微透鏡SL則設於pD晶片與 WDM濾波器25之間，是-將來自WDM渡波器25之射入 光(諸如149〇nm)匯聚以導引到PD之透鏡，例如非球面的 近接式稍透鏡。在第6圖中，A是指丨遍m輸出訊號之 光路B則為I490nm輸入訊號之光路。 兩石夕微透鏡SL係可根據習有之⑦⑸製造技術以低成 本且高精密度製成者。切微透鏡SL係藉被動對準技術而 =表面安裝的方式設於諸如#基板19±開設且相對應之V 字形凹槽（圖巾未示）。詳而言之，對相縣之v字形凹槽 13 以與矽微透鏡SL的側壁做抑理性接觸時，可實現高精声之 定位固定。 本實施形態之PD可為一種諸如由真性丰導體的層 (mtHnsic;内在）置於pn接面的中間之構造形成，即所謂的 光二極體。PD晶片係使受光面往下而做倒裴安穿，使 知'通過PD側透鏡的光在下側稍微繞射並匯聚後在v字形 凹槽的端面（鏡子）反射，並往上方側PD晶片入射。LD的 坡長與PD的波長交換後亦可適用於〇LT。 此外’本實施形態之微型BOSA晶片9只須再追加視 訊用的類比PD晶片或矽微透鏡及其他WDM濾波器時，即 可將本發明的適用乃至於應用範圍容易地擴大到所謂的三 工器（triplexer)。 附有球透鏡BL之封蓋13基本上是由—端閉鎖之圓筒 狀（即罐狀)之蓋體及貫穿固定於該_端中央之球透鏡张 構成者。 厅 球透鏡BL係、可發揮作為插入插座15而結合之單模光 纖(SMF)與LD晶片間之聚像透鏡之功能，同時亦可發揮作 為位於PD晶片與SMF間之聚像透鏡之功能。 由於該聚像透鏡之共用功能，因此LD&pD雙方的光 轴調整(對準）只要監視朝SMF之LD晶片輸出的光功率，* 而無須監視PD電流，便可予以實施。 座管η係包含有座管圓盤部4卜由座管圓盤部41的 -面約略垂直延伸形成之座管突起部43、&，貫穿座 盤部4!而設置之多數引線接腳45。如前述，在座管 1339029IX. INSTRUCTIONS OF THE INVENTION: 1. Field of the Invention The present invention relates to a single-core bidirectional optical module. In particular, the present invention relates to a bidirectional optical sub-assembly for constructing a main portion thereof (bi- Directional optical subassembly) and a transceiver incorporating the bidirectional optical subassembly. t Prior Art 3 In recent years, in order to meet the market demand for high-speed and large-capacity communication, the fiberization of the subscriber series (user) communication network has been rapidly accelerated, and there are two wavelengths of the 1310nm band and the 1490nm band with i 10 single-mode fibers. The communication method of Wavelength Division Multiplexing (WDM) for transmission and reception has begun to attract attention. Among them, the PON (Passive Optical Network) system, which is a pair of η, is attracting attention, and the 149〇nm transmission/丨31〇nm 15 reception on the base station side (optical line terminal; LT=〇ptical Line Terminal) Single-core bidirectional optical module) and home side 131〇nm transmission/1490nm receiving fiber subscriber line terminal (fiber network unit; 〇NU=0ptica) Network Unit) The development of single-core bidirectional optical modules is also changing with each passing day, which makes the ONU module smaller and lower cost, and it enables the 〇nu modulo 20 group to accommodate a large number. A bi-directional optical subassembly (hereinafter referred to as B0SA) for constructing a main portion of a single-core bidirectional optical module generally includes: a laser diode (LD) and a photodiode (PD) ) two packages (ie, individually sealed with a so-called TO CAN cap), a 5 fiber, a wavelength division multiplexing (WDM) filter, and a shell for holding components such as body. The LD cover and the Pd cover are disposed in an orthogonal state ‘, and the LD and PD pins are also in a vertical state. In order to reduce the electrical crosstalk between the transmitting side and the receiving side, the distance between the pins is relatively lengthened. In the case of the b〇SA type composed of two T〇_CANs, the degree of design freedom is hindered and the structure tends to be complicated, and since most processes are indispensable, it is difficult to reduce the manufacturing cost. . In order to solve the above problem, there is a proposal for accommodating a LD and a PD chip and each optical system and an electric system in a single ΤΟ-CAN (refer to, for example, Patent Document 丨). [Patent Document 1] U.S. Patent Application Publication No. 2/5/842,826H, the disclosure of the light element and the electric element for transmitting and receiving information according to the above-mentioned ΤΟ-CAN order This makes optical crosstalk (stray light) and electrical crosstalk electrical and optical interference a major obstacle, making it difficult to achieve miniaturization and cost reduction. The subject of the present invention is to realize an optical module by which the optical elements for transceiving can be reasonably accommodated in a single ΤΟ-CAN package, and the inevitable crosstalk can be fundamentally improved (reduced). By. In order to solve the above problems, a first aspect of the present invention (aspect; a view) is a two-way optical sub-assembly including: a laser diode; a photodiode: a laser diode can be used together with a seat tube And a photodiode sealed cover; and a crosstalk reduction structure for reducing optical and/or electrical crosstalk. The second aspect of the present invention is in the second aspect, wherein the crosstalk reduction structure 1339029 has a layer formed on the inner surface of the cover and capable of absorbing infrared rays. According to a third aspect of the present invention, in the second aspect, the layer is formed with a black bond layer. According to a fourth aspect of the present invention, in the second aspect, the layer is formed of a resin layer. According to a fifth aspect of the present invention, in the first aspect, the crosstalk reducing structure has a block which is disposed between the laser diode and the photodiode and can physically block The stray light from the laser diode to the light diode. The sixth aspect of the invention is in the fifth aspect, the stopper having a circuit board for assembling electronic components such as a laser diode and/or a photodiode. According to a seventh aspect of the present invention, in the first aspect, the disturbance reducing structure has a resin which is disposed at a position rearward of the laser diode and which absorbs rear light of the laser diode. According to an eighth aspect of the present invention, in a seventh aspect, a substrate in which a laser diode and a photodiode are assembled is provided, and the resin is provided on a ruthenium substrate. The ninth aspect of the present invention is the seventh aspect, wherein the seat tube has: 20 disc-shaped pedestal; and the protrusion is vertically protruded from the pedestal and can be mounted for assembling the laser diode and The substrate of the photodiode is provided, and the resin is provided on the pedestal of the seat tube. According to a tenth aspect of the present invention, in the first aspect, the seat tube has a disc-shaped pedestal; and the protrusion is vertically protruded from the pedestal and can be mounted for assembling the laser diode for 7 1339029 And a substrate for the light-emitting diode, and a lead pin group for the transmitting side and a lead pin group for the receiving side which are provided in the seat tube, and a seat having a ground potential is provided in the vicinity of the lead pin group on the transmitting side. Tube protrusion. The eleventh aspect of the present invention is in the first aspect, and further has a transformer impedance amplifier for amplifying the received signal from the photodiode, and the crosstalk reducing structure has a structure for using the laser diode a pair of wires connected to the electrode pad and the transmitting side lead pin connected to the laser diode; a pair of wires for connecting the photodiode or the electrode pad connected to the photodiode and the transformer impedance amplifier; and The pair of wires used to connect the transformer impedance amplifier to the receiving side of the 10-side lead pin; and the pairs of wires are laid in a state of being slightly orthogonal to each other. According to a twelfth aspect of the present invention, in the first aspect, the seat tube has a disk-shaped pedestal; and the protrusion is vertically protruded from the pedestal and is provided with a laser diode and a photodiode. Further, the lead pin having a plurality of electrical connections for the transmitting side pin 15 pin group and the receiving side pin pin group is configured to be disposed through the seat tube and opposite to the seat tube protrusion The side is divided into two groups of a transmitting side lead pin group and a receiving side lead pin group, and both sides are arranged in parallel, and a printed circuit board having an inner layer having a ground layer is provided between the two groups. The ninth aspect of the present invention is the first aspect of the invention, further comprising a socket; and the optical filter is disposed on the light-incident end of the socket on the side of the cover and inclined to the optical axis by a predetermined angle. A fourteenth aspect of the present invention is an optical transceiver comprising: a bidirectional optical sub-assembly having: a laser diode, a photodiode, and a seat tube 8 1339029, a laser diode and a photodiode a body seal cover and a crosstalk reduction structure for reducing optical and/or electrical crosstalk; a printed circuit board for optical transmission and reception for a two-way optical sub-assembly; and an outer casing for covering two-way optical times Assembly and printed circuit board. The fifteenth aspect of the invention is in the fourteenth aspect, wherein the crosstalk reducing structure has a layer formed on the inner surface of the cover and absorbing infrared rays. According to a sixteenth aspect of the present invention, in the fourteenth aspect, the crosstalk reducing structure has a stopper which is disposed between the laser diode and the photodiode, and is physically blocked by the lightning The stray light of the diode to the photodiode is 10 . According to a seventeenth aspect of the present invention, in the fourteenth aspect, the crosstalk reducing structure has a resin provided at a rear position of the laser diode and absorbing rear light of the laser diode. The ninth aspect of the present invention is the 丨4 aspect, the seat tube has: a circular 15 disk-shaped pedestal; and a protrusion which is vertically protruded from the pedestal and can be mounted for assembling the aforementioned laser diode The base plate of the body and the photodiode is provided with a lead pin group for the transmitting side and a lead pin group for the receiving side which are provided in the seat tube, and a seat having a ground potential is provided in the vicinity of the lead pin group on the transmitting side. Tube protrusion. The ninth aspect of the present invention is in the fourteenth aspect, further comprising a transformer impedance amplifier for amplifying the received signal from the photodiode, wherein the crosstalk reducing structure has: a pair of poles connected to the electrode pad and the transmitting side lead pin connected to the laser diode; for connecting the photodiode or the electrode pad connected to the photodiode and the transformer 9 H/U amplification@ The pair of wires: and the pair of wires used to connect the transformer impedance amplifier to the receiving line; and the wires are laid in a state of being slightly orthogonal to each other. According to a twentieth aspect of the present invention, in the fourth aspect, the socket has a socket; and the lighter is provided on the end of the light on the side of the cover and is inclined by a predetermined angle to the optical axis. [Effects of the Invention] According to the present invention, the performance can be maintained at the same level as or above the conventional one, and the number of components used can be greatly reduced, and the structure is simple and the manufacturing is simple, so that a low cost and a large number of producers can be realized. The above-mentioned and other objects of the present invention will be apparent from the drawings and the embodiments of the present invention. [FIG. 1] FIG. 1 is a bidirectional optical sub-assembly of the present embodiment. Fig. 2A is a side view of a miniature BOSA. Fig. 2B is an end view of a miniature BOSA. Fig. 2C is a circuit diagram of a miniature BOSA. Fig. 3 is a perspective view of an optical transceiver. Fig. 4A is a plan view of the optical transceiver. Fig. 4C is an end view of the optical transceiver. Fig. 4C is a side view of the optical transceiver. Fig. 5 is a perspective view of the optical transceiver with the housing mounted. A perspective view of a miniature BOSA wafer. 10 133 9029 Fig. 7 is a perspective view of the socket. Fig. 8 is a longitudinal sectional view of the cover. Fig. 9 is a plan view of the micro BOSA wafer. Fig. 10 is a structural view showing the resin on the seat tube. Fig. 12A is a view showing the arrangement of the wirings on the transmitting side and the receiving side in the cover. Fig. 12B is a top view of the projection of the seat tube. Fig. 13 is a view Fig. 14A is a diagram showing the steps of attaching the printed circuit board to the lead pins protruding from the cover. Fig. 14B is a diagram showing the steps of the wire bonding (DB) of the micro BOSA wafer. Figure 14C shows the steps of the board. 15 Figure 14D shows the step of wire bonding T1A. Figure 14E shows the step of vacuum baking. Figure 14F shows Fig. 14G is a view similar to the 14F. Fig. 14H is a step diagram of performing YAG welding. 20 Embodiments An embodiment of the present invention will be described below, but the present invention is described. It is not limited to this form and there is no need to say anything. Fig. 1 is a perspective view of a microcompact bi-directional optical subassembly (hereinafter referred to as a micro 11 1339029 BOSA) l according to the present embodiment, and a second side of Fig. 2A 2B is a side view of the micro BOSA. Fig. 2C is a circuit diagram of the micro BOSA1. Fig. 3 is a perspective view of an optical transceiver assembly 5, which is used for transmission and reception (drive and power) For the interface) Printed circuit 5 The board 3 is assembled in the micro-蜇BOSA1. 4A, 4B, and 4C are each a plan view, an end view, and a side view of the optical transceiver assembly 5. Figure 5 is a perspective view of an optical transceiver 6 incorporating a particular housing 7. The optical transceiver 6 is an optical transceiver of a wavelength division multiplexing (WDM) method in which one optical fiber is transmitted and received at a wavelength of two wavelengths of 1310 nm/1490 nm. In the micro-BOSA1 of the present embodiment, the optical fiber having at least the bidirectional function is housed in a single can-shaped cover (or package) in a compact state, and the stray light can be skillfully solved as will be described later. Waiting for the wrong situation. 15 The micro B〇SAl system can be constructed into a very small structure, such as a full length of about i6 4 mm and a diameter of about 6.6 mm, which can be easily assembled into a conventional SFF (SmaU~ Factor) transceiver package. Look at the appearance of the micro B〇SA1, which is a TO coaxial OSA (Optical Subassembly). Referring to FIG. 2, the micro B0SA1 basically includes: a microb〇sa 2〇 wafer 9, a seat tube u carrying the micro B0SA wafer 9, a cover with a ball lens for covering the micro BOSA wafer 9 ( In the following, a "cover" or "TO-CAN" term is used. 13, a socket (for example, an SC-shaped optical connector) 15, and a cover 13 and a socket 丨5 are connected. Connecting cylindrical parts 17 « 12 1339029 Referring to Fig. 6, the miniature ΒΟβ Α wafer 9 has a 矽 substrate (SiOB: 矽 具) 19 such as 24 mm χ 2.4 mm and various components mounted thereon, namely, Each of the wafers such as the diode LD and the photodiode PD, and two 矽 microlenses SL and a wavelength division multiplexing filter (hereinafter referred to as Wdm filter 5) 25 are used. The 1*0 wafer is mainly composed of the glass substrate 27. Mounted on the crucible substrate 19. In addition to this, a TIA (transformer resistor amplifier) 29 and a ceramic substrate (circuit board) 31 are mounted on the substrate substrate 9. Since the LD chip, the PD chip, and the WDM filter used are conventional optical components, they can be constructed at a low cost and mass-produced parts of 100,000. The two-turn microlens SL, a so-called diffractive lens, is used to make the spatially coupled single-core bidirectional function simple. As can be understood from Fig. 6, one side of the 矽 microlens SL is disposed between the 匕〇 wafer and the WDM filter 25, and is a kind of aligning the Z 15 light (such as l310nm) from the LD wafer (c〇llimate). A lens such as an aspherical proximity type Shishi microlens is used. The other side of the Shishi microlens SL is disposed between the pD wafer and the WDM filter 25, and is a lens that converges the incident light (such as 149 〇 nm) from the WDM ferrite 25 to be guided to the PD, for example Aspherical close-contact lens. In Fig. 6, A is the optical path of the I490nm input signal when the optical path B of the output signal is m. The two-stone microlens SL system can be manufactured at a low cost and high precision according to the conventional 7(5) manufacturing technique. The cut microlens SL is provided by a passive alignment technique and is surface mounted in a manner such as a #substrate 19± and a corresponding V-shaped groove (not shown). In detail, when the v-shaped groove 13 of the county is in an irrational contact with the side wall of the 矽 microlens SL, the positioning of the high-precision sound can be achieved. The PD of the present embodiment may be formed by a structure in which a layer of a true abundance conductor (mtHnsic; intrinsic) is placed in the middle of a pn junction, a so-called photodiode. The PD wafer is placed so that the light-receiving surface is turned down, so that the light passing through the PD-side lens is slightly diffracted on the lower side and concentrated, and then reflected at the end surface (mirror) of the v-shaped groove, and the PD chip is turned to the upper side. Incident. The slope length of the LD can be applied to the 〇LT after exchanging the wavelength of the PD. In addition, when the micro BOSA chip 9 of the present embodiment only needs to add an analog PD chip or a 矽 microlens and other WDM filters for video, the application and the scope of application of the present invention can be easily expanded to the so-called three-worker. Triplexer. The cover 13 to which the ball lens BL is attached is basically a cylindrical body (i.e., a can-shaped) cover body that is closed at the end and a ball lens that is fixed to the center of the _ end. The ball lens BL can function as a condenser lens between the single mode fiber (SMF) and the LD chip inserted into the socket 15, and can also function as a condenser lens between the PD chip and the SMF. Due to the shared function of the concentrating lenses, the optical axis adjustment (alignment) of both LD&pD can be performed by monitoring the optical power output to the LD chip of the SMF, without monitoring the PD current. The seat tube η includes a seat tube disc portion 4, and a seat tube projection portion 43 formed by the side surface of the seat tube disc portion 41 extending approximately vertically, and a plurality of lead pins provided through the seat portion 4! 45. As mentioned above, in the seat tube 1339029
41載設有微型B〇SA晶片？。 第2B圖中，位於座管圓盤部41 (座管11)中心之上側 排列成水平一列之引線接腳45係接收側用之引線接腳’由 左邊開始附上N、P、VCC、NC(預備）之記號，而位於座管 5 11中心之下側排列成水平一列之引線接腳45係發送側用 之引線接腳，由左邊開始附上GND ' LDK、LDA之記號。 與各引線接腳45相對應之零件是藉導線接合之金線（參考 第1圖中的粗實線）而做電連接者。 藉如此引線接腳45的配置結構，引線接腳45構造成 10 夾住印刷電路板3的上下面，使微型BOSA1及印刷電路板 3連接固定（參考第4A及4C圖）。 印刷電路板3的一面分成光學發送電路之用，而印刷 電路板3的另一面則分作為光學接收電路之用（因此可使用 個別的晶片組）。又’在印刷電路板3的中間層設有接地面。 如此，光學發送系統與光學接收系統係藉印刷電路板3的 接地層而隔開，因此可有效率地降低電串擾。 參考第7圖，插座15係一將單模光纖SMF與球透鏡 L做光學連接用之連接器，具有一用以固持SMF之諸如 °陶瓷製光纖筒件(fiber tub)47。插座15靠小型封蓋側之對 光輸出輪入端且形成有預定角度之端面上安裝長波長載斷 皮器（光學濾波器49)(載斷1550nm頻帶以上之波長）。藉 構，例如利用EPON(乙太光纖網路）時，雖發送有諸如 頻帶之類比視訊般之另__長波長的光訊號仍可有 地抑制此訊號到達PD晶片及反射到光纖者。此效果不只 15 1339029 是插座15，即使是捲縮線(pigtail)狀亦可實現者。 由上述記載亦可非常理解到，依本實施形態，藉將LD 及PD兩晶片收容配置於單一封蓋13，便能巧妙地將可能 發生的不當狀況（尤指光學串擾（雜散光）或電串擾）予以解 5 決。如下，對此簡單加以說明。 (1)雜散光對策1 有一不當狀況之虞存在，即，由發送用LD射出之光（前 方光、後方光兩者）中未朝光纖及監視器PD結合之光即於 封蓋（封裝件）13内部變成雜散光，而朝接收用PD晶片結 10 合，變成雜訊，使接收特性不佳者。 為解決如此問題，依本發明，提供例如如下之兩結構 (第1及第2結構）。此外，兩結構可單獨或重疊使用。 第1結構即如第8圖所示，在封蓋13内面設有用以吸 收紅外線之層LYR者。以形成該層LYR之形成方法例如有 15 藉鍍敷形成之方法及塗佈樹脂之方法。 採用藉鍍敷形成之方法時，是對封蓋13的内面施與用 以吸收紅外線（雜散光）之鍍敷諸如黑色鍍鎳者。藉此，使由 LD射出之光被鍍敷層（LYR)吸收，不產生雜散光。鍍敷係 於易做厚度控制且薄型並均勻處理，一次可進行多數封蓋 20 處理之優點而言為佳。 在封蓋内面以如下之作法形成之幾層黑色鍍敷層後， 針對紅外線吸收特性的優劣進行實驗。 (a) 精電解鍍鎳形成 (b) 藉無電解鍍鎳形成 16 (C)經噴除(blast)處理後藉電解鍍鎳形成 (d)經噴除處理後藉無電解鍍鎳形成 由實H果確4知’（e)『經噴除處理後藉電解鍍鎮 而形成之黑色鍵敷層』之紅外線吸收特性極為優秀者。 5採用㈣職之方法時，將卜線(㈣光)之吸收 效率高之«㈣㈣蓋13之内面上。不施與鑛敷之金屬 (不_)等可進行樹脂塗佈’對於—般市面流通之透鏡罩蓋 (lens cap)亦可做後加工(樹脂塗佈），因此亦優。 對樹脂而言，由所進行之幾個實驗，已確認美國Epoxy H) Technology公司之EP0_TEK恥2(商品名稱）為優異者這 是-㈣有紹填料且為單液性黑色型態之產業用功能性接 合材料，用於塗覆CMOS晶>{或固定肥粒鐵等，具有不須 選擇肥粒鐵、玻璃等之材質之優異點著力及適當的柔軟 性，可為做一種室溫保存之樹脂（取自株式會社DAiz〇 15 NICHIMOLY事業部的資料）。 第2結構係一於發送用LD晶片與接收用pD晶片之間 設置擋塊，以物理性載斷雜散光者。即，由於來自發送用 LD晶片之射出光由於與透鏡之結合損失而形成雜散光但 設置一雜散光載斷用擋塊後，藉此裁斷該雜散光，便可使 20 其不射入接收用PD。 由第9圖可知’前述陶瓷基板(電路板31)可實現作為 該擋塊之功能。本圖中，用粗實線的箭頭表示雜散光。 藉上述第2結構，可實現藉降低接收雜訊所造成之接 收特性的提升，同時可實現高密度安裝者。更具體之結構 17 1339029 可為諸如：在氧化鋁陶瓷棊板或氮化鋁陶瓷基板上形成有 用以安裝各種丨c驅動用之電容器之一層電路者。 由實驗可知，擋塊（電路板3丨）具有一定以上之高度 時，便可極力減少LD射出光朝PD之繞入(雜散光)者。 5 (2)雜散光對策2 供被動光纖網路(ρ0Ν)所使用之光加入者線路終端裝 置(〇而)用之LD軸器係使用於叢發模式，以使用有監視 器PD之控制方法而言，輸出之控制不易，因此採用一不依 靠監視器PD之控制。此時並不安裝監視器pD。如此型態 】〇下’由LD後方射出之光就這樣在封蓋】3中成為雜散光， 恐有與接收用PD結合之疑慮。 為解決如此問題，吸收LD後方光(雜散光），按本發明 可提供如下兩種結構。 第1結構係如第1〇圖所示，係一於座管u上之 15後方位置盛6又預疋樹脂(封裝=p〇uing)之結構，而第2結構 則如第11圖所示，係一於安裝有LD之矽基板19上之 後方位置盛設有預定樹脂之結構。 在任一結搆中，設於LD後方側之預定樹脂53能有效 地吸收LD後方光（第1〇圖及第^圖中以粗實線的箭頭顯 20不雜散光）。為此，與沒有設置如此樹脂之結構相較時，已 由實驗確認，朝接枚用PD之雜散光已大幅減少，降低因雜 散光所造成之雜訊，顯著地提昇收訊特性者。如此樹脂可 株用適於塗佈在前述封蓋13内面之樹脂同一者。 (3)電串擾對策 18 1339029 如本實施形態’在超小型封蓋13内收容有LD及pd 兩晶片之結構時，收送訊用之訊號佈線係呈相近狀態者。 具體而言，發送電路及接收電路間之距離只能設有2mm， 對於電串擾的降低極為困難，因此依本發明，即能精彩地 5予以解決。按本發明，可提供如下3種結構。 第1結構係如第12圖所示，於封蓋13内部中進行零 件配置，使發送側LD之接合導線(發送側佈線（金線))與接 收側PD之接合導線(接收側佈線（金線))略呈正交狀態之結 構（》玄圖中以粗貫線顯示金線）。藉此，可減少發送訊號用導 10 線(金線）間之串擾。 第2結構係如第12圖所示’座管11(座管圓盤部41) 靠封蓋側，將發送側用引線接腳45(圖中有2條）配設於矽 基板19表面下側，且將接收側用之引線接腳45(圖中有4 條）配設於矽基板19表面之上側，並使構成接地用之接地 15 構成金屬位於發送側之引線接腳近旁者。藉此，可減少電 串擾。 第3結構係如上述，如第13圖所示，在座管11 (座營 圓盤部41)與封管13相反之側，朝外突出之一連串引線接 腳45則劃分成：（該圖中位於上側之）接收側用引線接卿 2〇 45(N、P、VCC、NC)與（該圖中位於下側之）發送側用引線 接腳45(LDK、LDA)及接地用引線接腳45等兩群組，其等 之間設置有内層具有接地層之印刷電路板3。各引線接腳 45係以筆直伸長之狀態下連接且固定於印刷電路板3。 如上3種結構係構造成：（1)以封蓋13密封之内部中發 19 1339029 送接收訊號之接合導線略呈正交之結構、（2)令發送側引線 接腳群及接收侧引線接腳側以矽基板表面為境界而分成上 下，且在發送側引線接腳群附近設有接地金屬之結構、（3) 在夾設有内層具有接地層之印刷電路板3之狀態下由封蓋 5外之部分突出之發送側及接收側之各引線接腳分成2領域 之結構，可將電_擾明顯降低’且可確實地分離發送側放 射雜訊。 (4)反射損耗(loss)對策 在光收發器内部載斷類比視訊(諸如l55〇nm)，所截斷 10之訊號成為雜散光，變成數位式接收訊號之雜訊。 為解決如此問題，按本發明可提供一種結構，即如 上述將插座端面形成傾斜預定角度（諸如6。〜8。)之研磨面， 且在該研磨面貼設有截斷類比式視訊用之濾波器（長波長 載斷濾波器49)者。 15 本結構’即，在插座15之傾斜研磨面貼設濾波器49 且使其濾波器表面朝外者，可使類比訊號在濾波器49反射 朝光纖SMF的接地出去’且被光纖被覆層吸收。為此，與 内部形成濾波器之結構相較，可使被載斷之類比視訊不進 入數位接收系統’在外料赠去，使得數位訊號之接收 2〇 特性不受類比訊號影響。 如下’參照第MA至14H圖，簡單說明本實施形態之 微型BOSA1之製造步驟例。 (A)設置座管編號： 藉雷射而在座管11附上批次號碼等編號。接著進行 20 上述雜散光對策用之預定樹脂53之封裝（未於圖中顯示）。 (B)微型BOSA晶片DB(切片接合=diesbonding): 塗佈銀膏後，再將微型BOSA晶片9載設在座管11(座 管突起部43)上。 5 (C)載設電珞板： 塗佈銀膏後，再載設陶瓷基板（電路板31)。經同樣步 驟，載設電容器（capacitor ; condenser)。 (D)TIA DB : 塗佈銀膏後再載設TIA(變壓器阻抗放大器29)。 10 (E)真空烘烤： 在諸如140°C下施與4小時的真空烘烤（真空乾燥）處 理。 (F)(G)封蓋調芯固定： 藉喷射熔接，安裝封蓋13，俾使附有球透鏡BL之封 15 蓋13密封微型BOSA晶片9 d其後，進行He漏氣檢查、 閥漏氣檢查、電光學特性試驗及外觀檢查。 (H)調芯 YAG : 將連接用圓筒零件17安設在封蓋13,經調芯後進行 YAG雷射焊接（貫穿焊接），連接用圓筒零件π予以固定。 20 其次，對連接圓筒零件17安設插座15，經調芯後進行 YAG雷射熔接（填角焊接=fi丨丨et weid)，將插座15予以固定。 在焊接結束後進行功能檢查及外觀檢查。藉此，便能 獲得微型B0SA1。 惟，製造本發明之微型BOSA的試製品，測試25X：時 21 之光特性及光電特性。可得到如下極為優異之結果，即： 閾值電流8.0mA、傾斜效率137mW/A、折回損耗(return l〇ss)50dB 以上（1490nm)、折回損耗 42dB(1550nm)、折回損 耗13dB(1310nm)、截斷濾波器損耗46.5dB(PD上有 5 13l〇nm)、裁斷濾波器損耗43dB(PD上有1550nm)、光隔離 (optical isolation)47dB(由 LD 朝 PD 上有 1310nm)等結果。 又’試做一組裝有本發明之微型B0SA之光收發器， 且測試其光特性。所獲得之實證為：在於1.25Gbit/s之雙 向通訊，具有雖低但對於GB EPON收發器使用時足夠之最 10 少光接收感度一28.5dBm者。此外，該微型BOSA亦適用 於0LT方面者極為明確。 以上，參考特定實施形態詳細揭示並以附圖進行說明 本發明，但其記載並沒有以限定之意來詮釋本發明，熟悉 該技術領域之人士可參考本說明書，便可明瞭本發明之其 15 餘實施形態。即，所揭示之實施形態可做各種變更，因此 在不脫離本發明申請專利範圍所載之發明範圍下可做各種 變更。 如上’本發明可提供一種超小型B0SA，其構造簡單 且製造簡單，且可順利地解決光學及電串擾之問題，進一 20 步有助於雙向光學通訊之發展。 【圖式簡單說明】 第1圖係本實施形態的雙向光學次總成(微型B〇sa) 之立體圖。 第2A圖係微型BOSA之側視圖。 22 1339029 第2B圖係微型BOSA.之端面圖。 第2C圖係微型BOSA之電路圖。 第3圖係光收發器之立體圖。 第4A圖係光收發器之俯視圖。 5 第4B圖之光收發器之端面圖。 第4C圖係光收發器之側視圖。 第5圖係安裝有外殼之光收發器之立體圖。 第6圖係微型BOSA晶片之立體圖。 第7圖係插座之立體圖。 10 第8圖係封蓋之縱剖視圖。 第9圖係微型BOSA晶片之俯視圖。 第10圖係顯示於座管上盛設樹脂之結構圖。 第11圖係顯示於矽基板上盛設樹脂之結構圖。 第12A圖係顯示封蓋内發送側及接收側之各佈線之配 15 置圖。 第12B圖係座管突起部的上視圖。 第13圖係顯示以由封蓋突出之引線接腳夾設印刷板之 關係圖。 第14A圖係顯示對座管進行附設編號之步驟圖。 20 第14B圖係顯示微型BOSA晶片進行導線接合(DB)之 步驟圖。 第14C圖係顯示載設電路板之步驟圖。 第14D圖係顯示對TIA進行導線接合之步驟圖。 第14E圖係顯示進行真空烘烤(baking)之步驟圖。 23 1339029 第14F圖係顯示對封蓋.進行調芯且固定之步驟圖。 第14G係與第14F同樣之圖。 第14H圖係進行YAG熔接之步驟圖。 【主要元件符號說明】 1 微型BOSA 31 電路板 3 印刷電路板 41 座管圓盤部 5 光收發器總成 43 座管突起部 • 6 光收發器 45 引線接腳 7 外殼 47 光纖筒件 Λ 9 微型BOSA晶片 49 光學濾波器 11 座管 53 樹脂 13 封蓋 A 1310nm頻帶輸入訊號之光路 15 插座 B 1490nm頻帶輸入訊號之光路 17 連接用圓筒零件 BL 球透鏡 • 19 矽基板 LD雷射二極體 25 WDM濾波器 LYR 層 27 玻璃板 PD 光二Μ 29 ΤΙΑ SL矽微透鏡 2441 carrying a micro B〇SA wafer? . In Fig. 2B, the lead pins 45 which are arranged in a horizontal row on the upper side of the center of the seat tube disk portion 41 (seat tube 11) are the lead pins for the receiving side 'attached N, P, VCC, NC from the left side The (prepared) mark, and the lead pins 45 arranged in a horizontal row on the lower side of the center of the seat tube 5 11 are the lead pins for the transmitting side, and the marks of GND 'LDK and LDA are attached from the left side. The parts corresponding to the respective lead pins 45 are electrically connected by a gold wire joined by a wire (refer to the thick solid line in Fig. 1). With such an arrangement of the lead pins 45, the lead pins 45 are configured to sandwich the upper and lower surfaces of the printed circuit board 3, and the micro BOSA 1 and the printed circuit board 3 are connected and fixed (refer to Figs. 4A and 4C). One side of the printed circuit board 3 is divided into optical transmitting circuits, and the other side of the printed circuit board 3 is used as an optical receiving circuit (so that an individual chip set can be used). Further, a ground plane is provided on the intermediate layer of the printed circuit board 3. Thus, the optical transmitting system and the optical receiving system are separated by the ground layer of the printed circuit board 3, so that electrical crosstalk can be efficiently reduced. Referring to Fig. 7, the socket 15 is a connector for optically connecting the single mode fiber SMF to the ball lens L, and has a fiber tube 47 such as a ceramic for holding the SMF. The socket 15 is provided with a long-wavelength load breaker (optical filter 49) on the end face of the small cover side opposite to the light output wheel end and formed with a predetermined angle (wavelength of the band of 1550 nm or more is carried). By using, for example, an EPON (Ethernet optical network), an optical signal transmitted with a wavelength such as a frequency band like a video can still suppress the signal from reaching the PD chip and being reflected to the optical fiber. This effect is not only 15 1339029 is the socket 15, even in the form of a pigtail. As can be understood from the above description, according to the present embodiment, by arranging the LD and PD chips in a single cover 13, it is possible to skillfully perform an inappropriate situation (especially optical crosstalk (stray light) or electricity). Crosstalk) is resolved. This is briefly explained as follows. (1) Stray light countermeasures 1 There is an erroneous condition, that is, the light that is not combined with the optical fiber and the monitor PD among the light (both front light and rear light) emitted by the transmitting LD is in the cover (package) ) 13 is internally turned into stray light, and is turned into a PD chip for reception, and becomes noise, so that the receiving characteristics are not good. In order to solve such a problem, according to the present invention, for example, the following two structures (first and second structures) are provided. In addition, the two structures can be used individually or in combination. As shown in Fig. 8, the first structure is provided with a layer LYR for absorbing infrared rays on the inner surface of the cover 13. The method for forming the layer LYR is, for example, a method of forming by plating and a method of coating a resin. In the method of forming by means of plating, plating is applied to the inner surface of the cover 13 to absorb infrared rays (stray light) such as black nickel plating. Thereby, the light emitted from the LD is absorbed by the plating layer (LYR), and stray light is not generated. Plating is preferred for thickness control and thinness and uniform treatment, and the advantages of most closures 20 are preferred at one time. After several layers of black plating layers formed on the inner surface of the cover by the following method, experiments were conducted on the advantages and disadvantages of infrared absorption characteristics. (a) Formation of fine electrolytic nickel plating (b) Formation by electroless nickel plating 16 (C) After blast treatment, formed by electrolytic nickel plating (d) After being sprayed, formed by electroless nickel plating H is indeed known as '(e) "The black bond layer formed by electrolytic plating after the spraying process" has excellent infrared absorption characteristics. 5 When using the method of (4), the absorption line of the (4) light is high on the inner surface of the cover. Resin coating is not applied to the metal (not _), etc. The lens cap for the general market circulation can also be post-processed (resin coating), so it is also excellent. For the resin, it has been confirmed that the EP0_TEK shame 2 (trade name) of the US Epoxy H) Technology Company is excellent in several experiments conducted. This is - (4) industrial use with a filler and a single liquid black type. Functional bonding material for coating CMOS crystals>{or fixed-fertilizer iron, etc., having excellent strength and appropriate flexibility without the need to select ferrite, glass, etc., can be used for a room temperature preservation Resin (taken from DAiz〇15 NICHIMOLY Division). In the second structure, a stopper is provided between the transmitting LD wafer and the receiving pD wafer, and the stray light is physically stopped. In other words, since the stray light is formed by the loss of the light from the transmitting LD wafer due to the loss of the coupling with the lens, a stray light-carrying stopper is provided, whereby the stray light is cut, so that the light is not incident on the receiving device. PD. As is apparent from Fig. 9, the ceramic substrate (circuit board 31) can function as the stopper. In this figure, stray light is indicated by a thick solid arrow. With the second configuration described above, it is possible to achieve an improvement in the receiving characteristics by reducing the reception noise, and at the same time, a high-density installer can be realized. More specifically, the structure 13 1339029 may be, for example, a layer circuit formed of a capacitor for mounting various 丨c driving on an alumina ceramic raft or an aluminum nitride ceramic substrate. It can be seen from the experiment that when the stopper (circuit board 3 丨) has a certain height or more, the LD emission light toward the PD (stray light) can be reduced as much as possible. 5 (2) Stray light countermeasures 2 The optical add-on line terminal device used by the passive optical network (ρ0Ν) is used in the burst mode to use the control method with the monitor PD. In other words, the control of the output is not easy, so a control that does not rely on the monitor PD is used. The monitor pD is not installed at this time. In this way, the light emitted from the rear of the LD becomes stray light in the cover 3, and there is a fear of combining with the receiving PD. In order to solve such a problem, LD rear light (stray light) is absorbed, and according to the present invention, the following two structures can be provided. The first structure is as shown in Fig. 1 and is a structure in which a resin is placed in the rear of the seat tube u at a position of 15 and a resin (package = p〇uing), and the second structure is as shown in Fig. 11. It is a structure in which a predetermined resin is placed on the substrate 19 on which the LD is mounted. In either configuration, the predetermined resin 53 provided on the rear side of the LD can effectively absorb the rear light of the LD (in the first and second figures, the arrow with a thick solid line shows no stray light). For this reason, when compared with the structure in which such a resin is not provided, it has been experimentally confirmed that the stray light of the PD for use in the connection is greatly reduced, the noise caused by the stray light is reduced, and the reception characteristics are remarkably improved. Thus, the resin can be the same as the resin suitable for application to the inner surface of the cover 13 described above. (3) Electrical crosstalk countermeasures 18 1339029 As in the present embodiment, when the LD and pd wafers are housed in the ultra-small cover 13, the signal wiring for the transmission and reception is in a similar state. Specifically, the distance between the transmitting circuit and the receiving circuit can be set to only 2 mm, which is extremely difficult to reduce the electrical crosstalk. Therefore, according to the present invention, it can be solved brilliantly. According to the present invention, the following three structures can be provided. As shown in Fig. 12, the first structure is arranged in the inside of the cover 13, and the bonding wires (the transmitting side wiring (gold wire)) of the transmitting side LD and the bonding wire of the receiving side PD (the receiving side wiring (gold) are arranged. Line)) Structure of a slightly orthogonal state ("the gold line is shown by a thick line in the mysterious figure). Thereby, crosstalk between the conductive lines 10 (gold lines) for transmitting signals can be reduced. In the second structure, as shown in Fig. 12, the seat tube 11 (seat tube disc portion 41) is placed on the cover side, and the transmission side lead pins 45 (two in the figure) are disposed under the surface of the cymbal substrate 19. On the side, the lead pins 45 (four in the figure) for the receiving side are disposed on the upper side of the surface of the cymbal substrate 19, and the ground 15 constituting the ground is formed to be adjacent to the lead pins on the transmitting side. Thereby, electrical crosstalk can be reduced. The third structure is as described above. As shown in Fig. 13, on the side opposite to the sealing tube 13 on the side opposite to the sealing tube 13 of the seat tube 11 (the seat disk portion 41), a series of lead pins 45 projecting outwardly are divided into: (In the figure The receiving side is connected to the receiving side with a lead wire 2〇45 (N, P, VCC, NC) and (the lower side in the figure) the transmitting side lead pin 45 (LDK, LDA) and the grounding lead pin Two groups, such as 45, are provided with a printed circuit board 3 having an inner layer with a ground layer. Each of the lead pins 45 is connected and fixed to the printed circuit board 3 in a straight state. The above three types of structures are constructed as follows: (1) the internal wiring 19 1339029 sealed by the cover 13 is slightly orthogonal to the receiving wire, and (2) the transmitting side lead pin group and the receiving side lead wire are connected. The foot side is divided into upper and lower sides with the surface of the substrate as the boundary, and a grounded metal structure is provided in the vicinity of the transmitting side lead pin group, and (3) in the state in which the printed circuit board 3 having the inner layer having the ground layer is sandwiched The outer lead pins on the transmitting side and the receiving side are divided into two fields, and the electric_interference can be significantly reduced, and the transmitting side radiated noise can be surely separated. (4) Reflection loss (loss) countermeasures In the optical transceiver, analog video (such as l55 〇 nm) is loaded, and the signal that is cut off becomes a stray light and becomes a noise of the digital reception signal. In order to solve such a problem, according to the present invention, it is possible to provide a structure in which the end face of the socket is formed to be inclined at a predetermined angle (such as 6 to 8) as described above, and a filter for cutting analog video is attached to the polished surface. (Long wavelength load breaking filter 49). 15 The structure 'i.e., the filter 49 is placed on the inclined polished surface of the socket 15 with the filter surface facing outward, so that the analog signal can be reflected at the filter 49 toward the ground of the optical fiber SMF' and absorbed by the optical fiber coating layer. . For this reason, compared with the structure of the internally formed filter, the analog video of the load can not be fed into the digital receiving system, so that the receiving characteristics of the digital signal are not affected by the analog signal. An example of the manufacturing procedure of the micro BOSA 1 of the present embodiment will be briefly described with reference to the drawings of Figs. (A) Setting the seat tube number: By the laser, a number such as a lot number is attached to the seat tube 11. Next, the package of the predetermined resin 53 for the stray light countermeasure (not shown in the figure) is performed. (B) Micro BOSA wafer DB (slice bonding = dies bonding): After the silver paste is applied, the micro BOSA wafer 9 is placed on the seat tube 11 (seat tube projection 43). 5 (C) Mounting the electric raft: After applying the silver paste, the ceramic substrate (circuit board 31) is placed. Through the same steps, a capacitor (capacitor; condenser) is placed. (D) TIA DB: TIA (transformer impedance amplifier 29) is placed after the silver paste is applied. 10 (E) Vacuum baking: treatment was carried out by vacuum baking (vacuum drying) at, for example, 140 ° C for 4 hours. (F) (G) Cover and core adjustment: By means of jet welding, the cover 13 is mounted, and the cover 15 with the ball lens BL is sealed to seal the micro BOSA wafer 9 d, and then the He leak check and the valve leak are performed. Gas inspection, electro-optical property test and visual inspection. (H) Alignment YAG: The connecting cylindrical member 17 is placed on the cover 13, and after aligning, YAG laser welding (through-welding) is performed, and the connecting cylindrical member π is fixed. 20 Next, the socket 15 is placed on the connecting cylinder part 17, and after adjusting the core, YAG laser welding (filler welding = fillet weid) is performed, and the socket 15 is fixed. Perform functional inspection and visual inspection after welding. In this way, the miniature B0SA1 can be obtained. However, the prototype of the micro BOSA of the present invention was produced, and the light characteristics and photoelectric characteristics of 25X: 21 were tested. The following excellent results are obtained: threshold current 8.0 mA, tilt efficiency 137 mW/A, return loss (return l〇ss) 50 dB or more (1490 nm), return loss 42 dB (1550 nm), foldback loss 13 dB (1310 nm), truncation The filter loss is 46.5dB (5 13l〇nm on PD), the cut filter loss is 43dB (1550nm on PD), and optical isolation is 47dB (1310nm from LD to PD). Also, a set of optical transceivers equipped with the miniature B0SA of the present invention was tested and tested for optical characteristics. The empirical evidence obtained is that it is a two-way communication of 1.25 Gbit/s, which has a low optical reception sensitivity of 28.5 dBm which is low for the use of the GB EPON transceiver. In addition, the micro BOSA is also very clear for those who apply to the 0LT. The present invention has been described in detail above with reference to the preferred embodiments of the present invention. The remaining embodiments. That is, various modifications can be made to the disclosed embodiments, and various modifications can be made without departing from the scope of the invention as set forth in the appended claims. As described above, the present invention can provide an ultra-small B0SA which is simple in construction and simple in manufacture, and can smoothly solve the problems of optical and electrical crosstalk, and further progresses in the development of two-way optical communication. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a bidirectional optical sub-assembly (mini B〇sa) of the present embodiment. Figure 2A is a side view of a miniature BOSA. 22 1339029 Figure 2B is an end view of the miniature BOSA. Figure 2C is a circuit diagram of a miniature BOSA. Figure 3 is a perspective view of an optical transceiver. Figure 4A is a top view of an optical transceiver. 5 End view of the optical transceiver of Figure 4B. Figure 4C is a side view of an optical transceiver. Figure 5 is a perspective view of an optical transceiver with a housing mounted. Figure 6 is a perspective view of a miniature BOSA wafer. Figure 7 is a perspective view of the socket. 10 Figure 8 is a longitudinal section view of the closure. Figure 9 is a top view of a miniature BOSA wafer. Fig. 10 is a structural view showing the resin on the seat tube. Fig. 11 is a structural view showing a resin on a crucible substrate. Fig. 12A is a diagram showing the arrangement of the wirings on the transmitting side and the receiving side in the cover. Figure 12B is a top view of the seat tube projection. Fig. 13 is a view showing a relationship in which a printed board is sandwiched by a lead pin protruding from a cover. Fig. 14A is a view showing a step of attaching a number to the seat tube. 20 Figure 14B shows a step diagram of wire bonding (DB) for a miniature BOSA wafer. Figure 14C is a diagram showing the steps of mounting a circuit board. Figure 14D shows a step diagram of wire bonding to TIA. Figure 14E is a diagram showing the steps of performing a vacuum baking. 23 1339029 Figure 14F shows a step-by-step diagram of the alignment and fixing of the closure. The 14G series is the same as the 14F. Figure 14H is a diagram showing the steps of performing YAG welding. [Main component symbol description] 1 Mini BOSA 31 Circuit board 3 Printed circuit board 41 Seat tube disc part 5 Optical transceiver assembly 43 Seat tube protrusion • 6 Optical transceiver 45 Lead pin 7 Case 47 Fiber barrel Λ 9 Micro BOSA chip 49 Optical filter 11 Seat tube 53 Resin 13 Cover A 1310nm band input signal light path 15 Socket B 1490nm band input signal light path 17 Connection cylinder part BL ball lens • 19 矽 substrate LD laser diode 25 WDM filter LYR layer 27 glass plate PD light secondary Μ 29 ΤΙΑ SL 矽 microlens 24