JP6083399B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP6083399B2 JP6083399B2 JP2014034552A JP2014034552A JP6083399B2 JP 6083399 B2 JP6083399 B2 JP 6083399B2 JP 2014034552 A JP2014034552 A JP 2014034552A JP 2014034552 A JP2014034552 A JP 2014034552A JP 6083399 B2 JP6083399 B2 JP 6083399B2
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- Prior art keywords
- radiating plate
- semiconductor chip
- heat radiating
- sealing resin
- cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2;半導体チップ
3;放熱板
4;空洞
5;封止樹脂
7;はんだ
8;スペーサー
9;冷却器
21;表面
22;裏面
30;貫通孔
31;表面側放熱板
32;裏面側放熱板
35;閉塞樹脂
44;バネ
45;支持部材
51;薄肉部
60;モジュール
70;ボンディングワイヤ
90;基台
100;成形型
101;上型
102;下型
103;突起部
113;先端
151;隙間
Claims (7)
- 第1表面と前記第1表面の反対側に位置する第2表面とを有する第1の半導体チップと、前記第1の半導体チップに所定間隔をあけて隣接する第2の半導体チップと、
前記第1表面にはんだを介して接合され、表面および裏面を有し、表裏面を貫通する貫通孔が形成された第1放熱板と、
前記第2表面にはんだを介して接合された第2放熱板と、
前記第1放熱板と前記第2放熱板の間に充填されて前記半導体チップを封止する封止樹脂であって、隣接する2つの前記半導体チップの間において前記貫通孔と連通するように空洞が形成され、前記第2放熱板と前記空洞との間に存在している封止樹脂と、を備える、半導体装置。 - 前記第1放熱板に前記貫通孔が複数形成されており、
前記封止樹脂に、前記貫通孔と連通する前記空洞が複数形成されており、
複数の前記空洞が前記半導体チップの側辺に沿って前記半導体チップの周囲に形成されており、前記半導体チップを取り囲んでいる、請求項1に記載の半導体装置。 - 前記第2放熱板と前記空洞との間に存在する前記封止樹脂を押圧する押圧部材が前記空洞に挿入されている、請求項1又は2に記載の半導体装置。
- 前記貫通孔を閉塞する閉塞樹脂を更に備える、請求項1から3のいずれか一項に記載の半導体装置。
- 第1表面と前記第1表面の反対側に位置する第2表面とを有する複数の半導体チップと、前記第1表面にはんだを介して接合されており、その表裏面を貫通する貫通孔が形成されている第1放熱板と、前記第2表面にはんだを介して接合された第2放熱板と、を備えるモジュールを成形型にセットするセット工程であって、前記成形型が備える突起部が前記貫通孔に挿入され、前記突起部の先端が隣接する2つの前記半導体チップの間において前記第1放熱板と前記第2放熱板の間に配置され、前記先端と前記第2放熱板との間に隙間が形成されるように前記モジュールをセットするセット工程と、
前記成形型にセットされた前記モジュールの前記第1放熱板と前記第2放熱板の間に封止樹脂を充填して前記半導体チップを封止する封止工程と、を備える半導体装置の製造方法。 - 前記封止樹脂及び前記貫通孔から前記突起部を引き抜く引抜工程を更に備える、請求項5に記載の半導体装置の製造方法。
- 前記貫通孔に閉塞樹脂を充填し、充填した前記閉塞樹脂を硬化させることにより前記貫通孔を前記閉塞樹脂により閉塞する閉塞工程を更に備える、請求項6に記載の半導体装置の製造方法。
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JP2014034552A JP6083399B2 (ja) | 2014-02-25 | 2014-02-25 | 半導体装置及びその製造方法 |
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JP2015159258A JP2015159258A (ja) | 2015-09-03 |
JP6083399B2 true JP6083399B2 (ja) | 2017-02-22 |
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JP2014034552A Expired - Fee Related JP6083399B2 (ja) | 2014-02-25 | 2014-02-25 | 半導体装置及びその製造方法 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6136978B2 (ja) * | 2014-02-25 | 2017-05-31 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
JP6354674B2 (ja) * | 2015-06-18 | 2018-07-11 | 株式会社デンソー | 半導体装置 |
JP6406190B2 (ja) * | 2015-09-15 | 2018-10-17 | トヨタ自動車株式会社 | 半導体装置 |
JP6662322B2 (ja) * | 2017-02-09 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
JP6765336B2 (ja) | 2017-04-06 | 2020-10-07 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法、ならびに電力変換装置 |
JP7155748B2 (ja) * | 2018-08-22 | 2022-10-19 | 株式会社デンソー | 半導体装置 |
JP2021197568A (ja) | 2020-06-09 | 2021-12-27 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10321780A (ja) * | 1997-05-16 | 1998-12-04 | Hitachi Ltd | 半導体装置 |
TW476147B (en) * | 2001-02-13 | 2002-02-11 | Siliconware Precision Industries Co Ltd | BGA semiconductor packaging with through ventilator heat dissipation structure |
JP4840165B2 (ja) * | 2007-01-29 | 2011-12-21 | 株式会社デンソー | 半導体装置 |
JP5076549B2 (ja) * | 2007-02-23 | 2012-11-21 | 株式会社デンソー | 半導体装置 |
JP5445377B2 (ja) * | 2010-07-27 | 2014-03-19 | 株式会社デンソー | 電力変換装置 |
JP5569400B2 (ja) * | 2011-01-07 | 2014-08-13 | 株式会社デンソー | 半導体モジュール |
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