JP6073383B2 - スパッタ堆積用の小型の回転可能なスパッタデバイス - Google Patents

スパッタ堆積用の小型の回転可能なスパッタデバイス Download PDF

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Publication number
JP6073383B2
JP6073383B2 JP2014561293A JP2014561293A JP6073383B2 JP 6073383 B2 JP6073383 B2 JP 6073383B2 JP 2014561293 A JP2014561293 A JP 2014561293A JP 2014561293 A JP2014561293 A JP 2014561293A JP 6073383 B2 JP6073383 B2 JP 6073383B2
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JP
Japan
Prior art keywords
sputter device
sputter
rotatable
coating
deposition
Prior art date
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Expired - Fee Related
Application number
JP2014561293A
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English (en)
Japanese (ja)
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JP2015511667A (ja
JP2015511667A5 (enExample
Inventor
トーマス デピッシュ，
トーマス デピッシュ，
フランク シュナッペンベルガー，
フランク シュナッペンベルガー，
アンドレアス ロップ，
アンドレアス ロップ，
フロック，アンヌマリー
ゲッツ ゴーリッシュ，
ゲッツ ゴーリッシュ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2015511667A publication Critical patent/JP2015511667A/ja
Publication of JP2015511667A5 publication Critical patent/JP2015511667A5/ja
Application granted granted Critical
Publication of JP6073383B2 publication Critical patent/JP6073383B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2014561293A 2012-03-12 2012-03-12 スパッタ堆積用の小型の回転可能なスパッタデバイス Expired - Fee Related JP6073383B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/054261 WO2013135265A1 (en) 2012-03-12 2012-03-12 Mini rotatable sputter devices for sputter deposition

Publications (3)

Publication Number Publication Date
JP2015511667A JP2015511667A (ja) 2015-04-20
JP2015511667A5 JP2015511667A5 (enExample) 2015-05-28
JP6073383B2 true JP6073383B2 (ja) 2017-02-01

Family

ID=45852532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014561293A Expired - Fee Related JP6073383B2 (ja) 2012-03-12 2012-03-12 スパッタ堆積用の小型の回転可能なスパッタデバイス

Country Status (7)

Country Link
US (1) US20160189939A1 (enExample)
EP (1) EP2826057B1 (enExample)
JP (1) JP6073383B2 (enExample)
KR (1) KR101780466B1 (enExample)
CN (1) CN104160471B (enExample)
TW (1) TWI567216B (enExample)
WO (1) WO2013135265A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636195A (zh) * 2015-06-05 2018-01-26 应用材料公司 溅射沉积源、溅射装置及其操作方法
CN107743528B (zh) * 2015-06-16 2020-07-31 施耐德两合公司 用于镜片覆层的装置、方法和用途
KR102407392B1 (ko) * 2015-07-03 2022-06-13 삼성디스플레이 주식회사 스퍼터링 장치 및 이를 이용한 스퍼터링 방법
US12057297B2 (en) * 2015-10-22 2024-08-06 Richard DeVito Deposition system with integrated cooling on a rotating drum
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
CN107354443B (zh) * 2017-07-26 2019-10-11 中国电子科技集团公司第五十五研究所 一种调节磁控溅射镀膜均匀性的装置
CN109487225A (zh) * 2019-01-07 2019-03-19 成都中电熊猫显示科技有限公司 磁控溅射成膜装置及方法
BE1027427B1 (nl) 2019-07-14 2021-02-08 Soleras Advanced Coatings Bv Bewegingssystemen voor sputter coaten van niet-vlakke substraten

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610253C2 (de) * 1996-03-15 1999-01-14 Fraunhofer Ges Forschung Zerstäubungseinrichtung
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
JP2008527177A (ja) * 2005-01-13 2008-07-24 日本板硝子株式会社 メンテナンスの手間の軽減されたスパッタリングチャンバ
JP2008038192A (ja) * 2006-08-04 2008-02-21 Optorun Co Ltd スパッタ源、スパッタ成膜装置およびスパッタ成膜方法
JP2009024230A (ja) * 2007-07-20 2009-02-05 Kobe Steel Ltd スパッタリング装置
CN102356450A (zh) * 2009-03-20 2012-02-15 应用材料公司 具有高温可旋转靶的沉积设备及该设备的操作方法
JP5240782B2 (ja) * 2009-05-18 2013-07-17 株式会社神戸製鋼所 連続成膜装置
EP2306489A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
WO2012066079A1 (en) * 2010-11-17 2012-05-24 Bekaert Advanced Coatings Soft sputtering magnetron system

Also Published As

Publication number Publication date
EP2826057B1 (en) 2018-01-24
KR20140138908A (ko) 2014-12-04
WO2013135265A1 (en) 2013-09-19
US20160189939A1 (en) 2016-06-30
CN104160471A (zh) 2014-11-19
EP2826057A1 (en) 2015-01-21
TWI567216B (zh) 2017-01-21
CN104160471B (zh) 2017-11-28
JP2015511667A (ja) 2015-04-20
TW201348482A (zh) 2013-12-01
KR101780466B1 (ko) 2017-09-21

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