KR101780466B1 - 스퍼터 증착을 위한 소형의 회전가능한 스퍼터 디바이스들 - Google Patents

스퍼터 증착을 위한 소형의 회전가능한 스퍼터 디바이스들 Download PDF

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Publication number
KR101780466B1
KR101780466B1 KR1020147028546A KR20147028546A KR101780466B1 KR 101780466 B1 KR101780466 B1 KR 101780466B1 KR 1020147028546 A KR1020147028546 A KR 1020147028546A KR 20147028546 A KR20147028546 A KR 20147028546A KR 101780466 B1 KR101780466 B1 KR 101780466B1
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KR
South Korea
Prior art keywords
sputter device
sputter
rotatable
deposition apparatus
deposition
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020147028546A
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English (en)
Korean (ko)
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KR20140138908A (ko
Inventor
토마스 데피쉬
프랑크 슈나펜베르거
안드레아스 로프
안네마리 플로크
괴츠 괴리쉬
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20140138908A publication Critical patent/KR20140138908A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1020147028546A 2012-03-12 2012-03-12 스퍼터 증착을 위한 소형의 회전가능한 스퍼터 디바이스들 Expired - Fee Related KR101780466B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/054261 WO2013135265A1 (en) 2012-03-12 2012-03-12 Mini rotatable sputter devices for sputter deposition

Publications (2)

Publication Number Publication Date
KR20140138908A KR20140138908A (ko) 2014-12-04
KR101780466B1 true KR101780466B1 (ko) 2017-09-21

Family

ID=45852532

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147028546A Expired - Fee Related KR101780466B1 (ko) 2012-03-12 2012-03-12 스퍼터 증착을 위한 소형의 회전가능한 스퍼터 디바이스들

Country Status (7)

Country Link
US (1) US20160189939A1 (enExample)
EP (1) EP2826057B1 (enExample)
JP (1) JP6073383B2 (enExample)
KR (1) KR101780466B1 (enExample)
CN (1) CN104160471B (enExample)
TW (1) TWI567216B (enExample)
WO (1) WO2013135265A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636195A (zh) * 2015-06-05 2018-01-26 应用材料公司 溅射沉积源、溅射装置及其操作方法
CN107743528B (zh) * 2015-06-16 2020-07-31 施耐德两合公司 用于镜片覆层的装置、方法和用途
KR102407392B1 (ko) * 2015-07-03 2022-06-13 삼성디스플레이 주식회사 스퍼터링 장치 및 이를 이용한 스퍼터링 방법
US12057297B2 (en) * 2015-10-22 2024-08-06 Richard DeVito Deposition system with integrated cooling on a rotating drum
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
CN107354443B (zh) * 2017-07-26 2019-10-11 中国电子科技集团公司第五十五研究所 一种调节磁控溅射镀膜均匀性的装置
CN109487225A (zh) * 2019-01-07 2019-03-19 成都中电熊猫显示科技有限公司 磁控溅射成膜装置及方法
BE1027427B1 (nl) 2019-07-14 2021-02-08 Soleras Advanced Coatings Bv Bewegingssystemen voor sputter coaten van niet-vlakke substraten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610253A1 (de) * 1996-03-15 1997-10-09 Fraunhofer Ges Forschung Zerstäubungseinrichtung
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008527177A (ja) * 2005-01-13 2008-07-24 日本板硝子株式会社 メンテナンスの手間の軽減されたスパッタリングチャンバ
JP2008038192A (ja) * 2006-08-04 2008-02-21 Optorun Co Ltd スパッタ源、スパッタ成膜装置およびスパッタ成膜方法
JP2009024230A (ja) * 2007-07-20 2009-02-05 Kobe Steel Ltd スパッタリング装置
CN102356450A (zh) * 2009-03-20 2012-02-15 应用材料公司 具有高温可旋转靶的沉积设备及该设备的操作方法
JP5240782B2 (ja) * 2009-05-18 2013-07-17 株式会社神戸製鋼所 連続成膜装置
EP2306489A1 (en) * 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
WO2012066079A1 (en) * 2010-11-17 2012-05-24 Bekaert Advanced Coatings Soft sputtering magnetron system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610253A1 (de) * 1996-03-15 1997-10-09 Fraunhofer Ges Forschung Zerstäubungseinrichtung
WO2000028104A1 (en) * 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
DE10145201C1 (de) * 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
WO2003023813A1 (de) * 2001-09-13 2003-03-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Einrichtung zum beschichten von substraten mit gekrümmter oberfläche durch pulsmagnetron-zerstäuben

Also Published As

Publication number Publication date
EP2826057B1 (en) 2018-01-24
KR20140138908A (ko) 2014-12-04
WO2013135265A1 (en) 2013-09-19
US20160189939A1 (en) 2016-06-30
CN104160471A (zh) 2014-11-19
EP2826057A1 (en) 2015-01-21
TWI567216B (zh) 2017-01-21
CN104160471B (zh) 2017-11-28
JP2015511667A (ja) 2015-04-20
TW201348482A (zh) 2013-12-01
JP6073383B2 (ja) 2017-02-01

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