JP6063863B2 - 易剥離性粘着フィルム - Google Patents
易剥離性粘着フィルム Download PDFInfo
- Publication number
- JP6063863B2 JP6063863B2 JP2013517975A JP2013517975A JP6063863B2 JP 6063863 B2 JP6063863 B2 JP 6063863B2 JP 2013517975 A JP2013517975 A JP 2013517975A JP 2013517975 A JP2013517975 A JP 2013517975A JP 6063863 B2 JP6063863 B2 JP 6063863B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- adhesive layer
- easily peelable
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
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- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
- B32B2307/736—Shrinkable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- C—CHEMISTRY; METALLURGY
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Description
本発明の仮固定用シートは、被着体を加工するときに該被着体に貼り合わせて使用されるものであり、本発明の易剥離性粘着フィルムで構成したことを特徴とする。
(1)接着層を0.5μm以上10μm以下の厚みで形成することができる。
(2)易剥離性粘着層を、粘着剤とともに反応性オリゴマーを含む、熱硬化剥離タイプの易剥離性粘着層で構成することができる。
(3)反応性オリゴマーは、少なくともウレタンアクリレート系オリゴマーを含むことができる。ウレタンアクリレート系オリゴマーとして、重量平均分子量が300以上30,000以下のものを用いることができる。
(4)第1フィルムとして、120℃での主収縮方向における収縮率が50%以上90%以下のものを用いることができる。第1フィルムとして、120℃での主収縮方向以外の方向における収縮率が10%以下のものを用いることができる。
(5)第2フィルムとして、120℃での収縮率が10%未満のものを用いることができる。
本発明で用いる収縮性フィルムは、主収縮方向以外の方向における収縮率が、好ましくは10%以下、さらに好ましくは5%以下である。
なお、本例において「収縮率」とは、収縮性フィルムを120℃に加熱した前後の寸法変化に基づいて算出されるものをいう(下記算出式を参照)。
収縮率(%)=[{(評価方向での加熱前の寸法)−(評価方向での加熱後の寸法)}/(評価方向での加熱前の寸法)]×100
接着剤としては、例えばゴム系接着剤、アクリル系接着剤、ビニルアルキルエーテル系接着剤、シリコーン系接着剤、ポリアミド系接着剤、ポリウレタン系接着剤、ポリエステル系接着剤、ポリエーテル系接着剤、スチレン−ジエンブロック共重合体系接着剤等の汎用の接着剤や、これらの汎用接着剤に融点が約200℃以下の熱溶融性樹脂を配合したクリ−プ特性改良型接着剤などが挙げられる。これらの接着剤は1種あるいは複数種を組み合わせて用いることもできる。
反応性オリゴマーは、接着層中に、接着剤100重量部に対して12重量部以上の量で含まれていることが必要であり、好ましくは15重量部以上、さらに好ましくは40重量部以上である。反応性オリゴマーの含有量が12重量部以上であると、収縮性フィルムの加熱時の収縮性能を阻害してしまうのを効果的に防止することができる。その結果、被着体からの、より一層容易な剥離が可能となり、当該被着体が変形・破損してしまうのを防止することができる。
また、非収縮性フィルムの表面は、隣接する層との密着性を高めたり、易剥離性粘着フィルムの貼着の有無を識別するため、上述した収縮性フィルムと同様の表面処理が施されていてもよい。
[実施例1]
非熱収縮性フィルム(120℃における熱収縮率10%未満、厚み38μm、ポリエチレンナフタレートフィルム、コスモシャインA4300:東洋紡績社)の一方の面に、下記処方の易剥離性粘着層塗布液をバーコーター法により塗布、乾燥させて、厚み7μmの易剥離性粘着層を形成し、セパレータ(厚み25μm、ポリエチレンナフタレートフィルム、MRF:三菱化学ポリエステルフィルム社)の離型処理面と貼り合わせた。
・アクリル系粘着剤 57.1部
(SKダインSW−2B:綜研化学社、固形分35%)
・ウレタンアクリレート系オリゴマー 20部
(NKオリゴ U−15HA:新中村化学工業社、45000mPa・s/40℃、平均分子量2300、官能基数15、固形分100%)
・重合開始剤 4部
(OTAZO−15:大塚化学社、固形分100%)
・硬化剤(ポリイソシアネート) 5部
(コロネートL45E:日本ポリウレタン工業社、固形分45%)
・酢酸エチル 57.5部
・メチルエチルケトン 57.5部
・ポリウレタン系接着剤 85部
(タケラックA971:三井化学社、固形分50%)
・ウレタンアクリレート系オリゴマー 15部
(NKオリゴ U−15HA:新中村化学工業社、メチルエチルケトンにて固形分50%に調整した)
・重合開始剤 0.23部
(OTAZO−15:大塚化学社、固形分100%)
・硬化剤(ポリイソシアネート) 9.7部
(タケネートD110N:三井化学社、固形分60%)
・トルエン 57部
・メチルエチルケトン 57部
実施例1の接着層塗布液におけるポリウレタン系接着剤を70重量部とし、ウレタンアクリレート系オリゴマーを30重量部とし、重合開始剤を0.45重量部とした以外は、実施例1と同様にして、実施例2の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を60重量部とし、ウレタンアクリレート系オリゴマーを40重量部とし、重合開始剤を0.6重量部とした以外は、実施例1と同様にして、実施例3の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を50重量部とし、ウレタンアクリレート系オリゴマーを50重量部とし、重合開始剤を0.75重量部とした以外は、実施例1と同様にして、実施例4の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を100重量部とし、ウレタンアクリレート系オリゴマー及び重合開始剤を除いた以外は、実施例1と同様にして、比較例1の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を91重量部とし、ウレタンアクリレート系オリゴマーを9重量部とし、重合開始剤を0.14重量部とした以外は、実施例1と同様にして、比較例2の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を40重量部とし、ウレタンアクリレート系オリゴマーを60重量部とし、重合開始剤を0.9重量部とした以外は、実施例1と同様にして、比較例3の易剥離性粘着フィルムを作製した。
実施例1の接着層塗布液におけるポリウレタン系接着剤を30重量部とし、ウレタンアクリレート系オリゴマーを70重量部とし、重合開始剤を1.05重量部とした以外は、実施例1と同様にして、比較例4の易剥離性粘着フィルムを作製した。
(1)加熱前の粘着力
各例の易剥離性粘着フィルムからそれぞれセパレータを剥離して易剥離性粘着層を露出させ、その上にガラスウェハを貼着固定した。次いで、易剥離性粘着フィルムについて、JIS Z0237:2000に準じて、テンシロン万能引張試験機(テンシロンHTM−100:オリエンテック社)を用いて、易剥離性粘着フィルム側から180°剥離試験を行なった。試験片は幅25mmとした。測定結果を表1に示す。
(1)と同様に、各例の易剥離性粘着フィルムからそれぞれセパレータを剥離して易剥離性粘着層を露出させ、その上にガラスウェハを貼着固定した。次いで、当該易剥離性粘着フィルムを、ガラスウェハごと100℃のオーブンに5分間投入して加熱処理を行なった。加熱により易剥離性粘着フィルムがガラスウェハに対して凸カールして粘着部端部から剥離しはじめ、ガラスウェハへの接地面積が極めて小さくなり手で引っ張る等作業を行なうことなくガラスウェハから自然に剥離したものを「◎」、ガラスウェハから自然に剥離はしなかったが、振動を与えることで容易に剥離することができたものを「○」、易剥離性粘着フィルムが適切にカールせず、容易に剥離することができなかったものを「×」、加熱時に易剥離性粘着フィルムが接着層と非収縮性フィルムとの界面で剥離してしまい、易剥離性粘着フィルムとしての体をなさなくなってしまったものを「−」とした。測定結果を表1に示す。
ウレタンアクリレート系オリゴマーとして、商品名:U−15HAに代え、商品名:UA−32P(新中村化学工業社製、平均分子量1560、官能基数9)を用いた以外は実施例1と同処方の接着層塗布液を準備し、その後、実施例1と同様にして易剥離性粘着フィルムを作製し、同様の評価を行ったところ、実施例1と同様の評価が得られた。
Claims (7)
- 熱収縮する第1フィルムと、熱収縮する接着層と、熱収縮しない第2フィルムと、易剥離性粘着層とを、この順に積層して構成してあり、
前記第1フィルムを、主収縮方向における120℃での収縮率が50%以上90%以下のもので構成し、
前記接着層を、ゴム系、アクリル系、ビニルアルキルエーテル系、シリコーン系、ポリアミド系、ポリウレタン系、ポリエステル系、ポリエーテル系及びスチレン−ジエンブロック共重合体系から選択される汎用の接着剤と、熱重合開始剤存在下での加熱により自身の重合反応及び前記接着剤との重合反応を引き起こす熱反応性オリゴマーとを含み、該熱反応性オリゴマーは、少なくともウレタンアクリレート系オリゴマーを含み、前記熱反応性オリゴマーの配合量が前記接着剤100重量部に対して12重量部以上130重量部以下であるもので構成するとともに、0.5μm以上10μm以下の厚みで形成したことを特徴とする易剥離性粘着フィルム。 - 熱収縮する第1フィルムと、熱収縮する接着層と、熱収縮しない第2フィルムと、易剥離性粘着層とを、この順に積層して構成してあり、
前記第1フィルムを、主収縮方向における120℃での収縮率が50%以上90%以下のもので構成し、
前記接着層を、ポリウレタン系の汎用の接着剤と、熱重合開始剤存在下での加熱により自身の重合反応及び前記接着剤との重合反応を引き起こす熱反応性オリゴマーとを含み、該熱反応性オリゴマーは、少なくともウレタンアクリレート系オリゴマーを含み、前記熱反応性オリゴマーの配合量が前記接着剤100重量部に対して12重量部以上130重量部以下であるもので構成したことを特徴とする易剥離性粘着フィルム。 - 請求項2記載の粘着フィルムにおいて、前記接着層は、厚みが0.5μm以上10μm以下である粘着フィルム。
- 請求項1〜3の何れか一項記載の粘着フィルムにおいて、前記易剥離性粘着層は、粘着剤とともに、熱重合開始剤存在下での加熱により自身の重合反応及び前記粘着剤との重合反応を引き起こす熱反応性オリゴマーを含む、熱硬化剥離タイプの易剥離性粘着層で構成してある粘着フィルム。
- 請求項4記載の粘着フィルムにおいて、前記熱反応性オリゴマーとして、少なくともウレタンアクリレート系オリゴマーを含む粘着フィルム。
- 請求項1〜5の何れか一項記載の粘着フィルムにおいて、前記第1フィルムは、主収縮方向以外の方向における120℃での収縮率が10%以下である粘着フィルム。
- 請求項1〜6の何れか一項記載の粘着フィルムで構成した、被着体を加工するときに該被着体に貼り合わせて使用される仮固定用シート。
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JP6464454B2 (ja) * | 2015-03-27 | 2019-02-06 | リンテック株式会社 | 再剥離性フィルム |
JP6705264B2 (ja) * | 2016-04-06 | 2020-06-03 | Dic株式会社 | 粘着テープ及び物品の解体方法 |
JP6088701B1 (ja) * | 2016-10-06 | 2017-03-01 | 株式会社きもと | レーザーダイシング用補助シート |
JP6986479B2 (ja) * | 2018-04-04 | 2021-12-22 | 旭化成株式会社 | 解体性接着剤組成物 |
CN112789337A (zh) * | 2018-10-05 | 2021-05-11 | 三井化学东赛璐株式会社 | 粘着性膜及电子装置的制造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56159266A (en) * | 1980-05-13 | 1981-12-08 | Dainippon Printing Co Ltd | Laminating adhesive composition |
JPS604579A (ja) * | 1983-06-22 | 1985-01-11 | Nitto Electric Ind Co Ltd | マスキング用感圧性接着テ−プまたはシ−ト |
JPH0657232A (ja) * | 1992-08-05 | 1994-03-01 | Dainippon Printing Co Ltd | 接着剤組成物 |
JP2000129227A (ja) * | 1998-10-29 | 2000-05-09 | Lintec Corp | 半導体ウエハ保護用粘着シートおよびその使用方法 |
US6887917B2 (en) * | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
US20070179254A1 (en) * | 2004-01-14 | 2007-08-02 | Zhikai Wang | Adhesives |
JP2005281561A (ja) * | 2004-03-30 | 2005-10-13 | Dainippon Ink & Chem Inc | 粘着フィルム及びそれを用いたラベル類 |
JP5087372B2 (ja) * | 2007-11-19 | 2012-12-05 | 日東電工株式会社 | 樹脂積層体、粘着シート、該粘着シートを用いた被着体の加工方法、及びその剥離装置 |
JP2010100686A (ja) * | 2008-10-21 | 2010-05-06 | Nitto Denko Corp | 自発巻回性粘着シート |
JP5599157B2 (ja) * | 2009-04-24 | 2014-10-01 | 株式会社きもと | 粘着シート |
-
2012
- 2012-05-21 WO PCT/JP2012/062969 patent/WO2012165201A1/ja active Application Filing
- 2012-05-21 US US14/123,266 patent/US20140087180A1/en not_active Abandoned
- 2012-05-21 JP JP2013517975A patent/JP6063863B2/ja active Active
- 2012-05-21 KR KR1020137033945A patent/KR20140047619A/ko not_active Application Discontinuation
- 2012-05-31 TW TW101119534A patent/TW201249653A/zh unknown
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WO2012165201A1 (ja) | 2012-12-06 |
KR20140047619A (ko) | 2014-04-22 |
US20140087180A1 (en) | 2014-03-27 |
JPWO2012165201A1 (ja) | 2015-02-23 |
TW201249653A (en) | 2012-12-16 |
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