JP6051359B2 - コア付きインダクタ素子およびその製造方法 - Google Patents

コア付きインダクタ素子およびその製造方法 Download PDF

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Publication number
JP6051359B2
JP6051359B2 JP2010285215A JP2010285215A JP6051359B2 JP 6051359 B2 JP6051359 B2 JP 6051359B2 JP 2010285215 A JP2010285215 A JP 2010285215A JP 2010285215 A JP2010285215 A JP 2010285215A JP 6051359 B2 JP6051359 B2 JP 6051359B2
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insulating film
coil
coil wiring
wiring
film
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JP2010285215A
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JP2012134329A5 (enExample
JP2012134329A (ja
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俊 保坂
俊 保坂
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2010285215A 2010-12-22 2010-12-22 コア付きインダクタ素子およびその製造方法 Expired - Fee Related JP6051359B2 (ja)

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JP2010285215A JP6051359B2 (ja) 2010-12-22 2010-12-22 コア付きインダクタ素子およびその製造方法

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Application Number Priority Date Filing Date Title
JP2010285215A JP6051359B2 (ja) 2010-12-22 2010-12-22 コア付きインダクタ素子およびその製造方法

Publications (3)

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JP2012134329A JP2012134329A (ja) 2012-07-12
JP2012134329A5 JP2012134329A5 (enExample) 2014-02-27
JP6051359B2 true JP6051359B2 (ja) 2016-12-27

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858630B2 (ja) * 2011-03-14 2016-02-10 日本碍子株式会社 インダクタ内蔵基板及び当該基板を含んでなる電気回路
JP5815640B2 (ja) * 2012-12-11 2015-11-17 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品の製造方法。
JP5915821B2 (ja) * 2014-02-27 2016-05-11 株式会社村田製作所 電磁石の製造方法、および、電磁石
KR101942725B1 (ko) * 2014-03-07 2019-01-28 삼성전기 주식회사 칩 전자부품 및 그 제조방법
CN104270885A (zh) * 2014-05-05 2015-01-07 珠海越亚封装基板技术股份有限公司 具有聚合物基质的插件框架及其制造方法
JP6624482B2 (ja) 2014-07-29 2019-12-25 俊 保坂 超小型加速器および超小型質量分析装置
US9496213B2 (en) * 2015-02-05 2016-11-15 Qualcomm Incorporated Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
KR101659212B1 (ko) * 2015-02-13 2016-09-22 삼성전기주식회사 인덕터 부품의 제조방법
JP6572791B2 (ja) * 2016-02-05 2019-09-11 株式会社村田製作所 コイル複合部品及び多層基板、ならびに、コイル複合部品の製造方法
KR20170118430A (ko) 2016-04-15 2017-10-25 삼성전기주식회사 코일 전자부품 및 그 제조방법
KR101887106B1 (ko) * 2016-10-31 2018-08-09 아비코전자 주식회사 초소형 인덕터 및 이의 제조 방법
KR101964980B1 (ko) * 2017-07-31 2019-08-13 주식회사 케이비켐 액추에이터 코일 구조체 및 그 제조방법
WO2019027204A1 (ko) * 2017-07-31 2019-02-07 주식회사 케이비켐 액추에이터 코일 구조체 및 그 제조방법
CN115411020A (zh) * 2021-05-26 2022-11-29 中国科学院微电子研究所 片上螺旋磁芯电感器及其制作方法和批量化生产方法
CN114420435B (zh) * 2022-01-25 2023-11-24 沈阳工业大学 一种变压器用混合材料卷铁心截面设计方法
CN115440676B (zh) * 2022-09-30 2025-03-04 甬矽电子(宁波)股份有限公司 双面电磁屏蔽结构和屏蔽结构制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08130109A (ja) * 1994-11-02 1996-05-21 Matsushita Electric Ind Co Ltd 積層部品用非磁性絶縁材料、積層部品およびその製造法
JP2002043520A (ja) * 2000-07-19 2002-02-08 Sony Corp 半導体装置及びその製造方法
JP2005109097A (ja) * 2003-09-30 2005-04-21 Murata Mfg Co Ltd インダクタ及びその製造方法
JP2006049822A (ja) * 2004-06-29 2006-02-16 Tdk Corp 半導体ｉｃ内蔵モジュール
JP4803993B2 (ja) * 2004-11-09 2011-10-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5136056B2 (ja) * 2005-09-06 2013-02-06 日本電気株式会社 半導体装置
JP2008171853A (ja) * 2007-01-09 2008-07-24 Murata Mfg Co Ltd 電子部品製造方法及び電子部品

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