JP6050481B2 - 検査用プローブ及びその製造方法 - Google Patents
検査用プローブ及びその製造方法 Download PDFInfo
- Publication number
- JP6050481B2 JP6050481B2 JP2015512586A JP2015512586A JP6050481B2 JP 6050481 B2 JP6050481 B2 JP 6050481B2 JP 2015512586 A JP2015512586 A JP 2015512586A JP 2015512586 A JP2015512586 A JP 2015512586A JP 6050481 B2 JP6050481 B2 JP 6050481B2
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- JP
- Japan
- Prior art keywords
- contact
- point
- plunger
- inspection probe
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007689 inspection Methods 0.000 title claims description 41
- 239000000523 sample Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000005520 cutting process Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000005553 drilling Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49995—Shaping one-piece blank by removing material
- Y10T29/49996—Successive distinct removal operations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
Claims (4)
- 検査用プローブにおいて、
被検査接点に物理的に接触するプランジャー端部と;
前記プランジャー端部に設けられ、前記被検査接点に向かって突出した複数の尖端部と;を有し、
前記複数の尖端部の中で、少なくとも一つは高位尖端部であり、少なくとも他の一つは前記高位尖端部より突出高さが低い低位尖端部であり、前記プランジャー端部は軸方向に傾斜する外周面を有し、前記高位尖端部と前記低位尖端部は、前記外周面の円周方向に沿って交互的に配置されることを特徴とする検査用プローブ。 - 被検査接点に接触するプランジャー端部を有する検査用プローブの製造方法において、
前記プランジャー端部の外周面を所定の傾斜角で加工してテーパー傾斜面を加工する段階と;
前記プランジャー端部の端部面に相互間隔を置いて複数の相互平行なV−カッティングを横及び縦方向に施工して、少なくとも一つの高位尖端部と前記高位尖端部より突出高さが低い少なくとも一つの低位尖端部とを前記テーパー傾斜面の円周方向に沿って交互的に形成する段階と;
を含むことを特徴とする検査用プローブの製造方法。 - 前記テーパー傾斜面は、截頭円錐面であることを特徴とする請求項2に記載の検査用プローブの製造方法。
- 前記テーパー傾斜面は、截頭多角推面であることを特徴とする請求項2に記載の検査用プローブの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0062975 | 2012-06-13 | ||
KR20120062975A KR101328581B1 (ko) | 2012-06-13 | 2012-06-13 | 검사용 프로브 및 그 제조방법 |
PCT/KR2013/004504 WO2013187611A1 (en) | 2012-06-13 | 2013-05-23 | Test probe and machining method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015520851A JP2015520851A (ja) | 2015-07-23 |
JP6050481B2 true JP6050481B2 (ja) | 2016-12-21 |
Family
ID=49758397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015512586A Active JP6050481B2 (ja) | 2012-06-13 | 2013-05-23 | 検査用プローブ及びその製造方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20150123687A1 (ja) |
JP (1) | JP6050481B2 (ja) |
KR (1) | KR101328581B1 (ja) |
CN (1) | CN104350387A (ja) |
MY (1) | MY170044A (ja) |
PH (1) | PH12014502718A1 (ja) |
SG (1) | SG11201406969SA (ja) |
TW (1) | TWI490501B (ja) |
WO (1) | WO2013187611A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106338623A (zh) * | 2015-07-10 | 2017-01-18 | 渭南高新区木王科技有限公司 | 一种新型探针和减少误判的方法 |
JP6637742B2 (ja) * | 2015-11-25 | 2020-01-29 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
KR101907448B1 (ko) * | 2016-12-13 | 2018-10-12 | 퀄맥스시험기술 주식회사 | 전자 부품 검사 소켓 |
JP6881972B2 (ja) * | 2016-12-27 | 2021-06-02 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
CN108226583B (zh) * | 2018-01-23 | 2021-01-19 | 京东方科技集团股份有限公司 | 测试探针 |
CN111190090B (zh) * | 2018-11-15 | 2022-06-10 | 宁波舜宇光电信息有限公司 | 用于模组通电测试的连接结构和相应的转接件 |
KR102208381B1 (ko) * | 2019-09-06 | 2021-01-28 | 리노공업주식회사 | 검사프로브 및 그의 제조방법, 그리고 그를 지지하는 검사소켓 |
KR102212346B1 (ko) * | 2019-12-17 | 2021-02-04 | 주식회사 제네드 | 프로브 핀 |
KR102202826B1 (ko) * | 2020-10-27 | 2021-01-14 | (주) 네스텍코리아 | 플런저 및 이를 적용한 프로브 핀 |
KR102683906B1 (ko) * | 2022-07-07 | 2024-07-11 | (주) 테크웰 | 반도체 패키지 테스트용 소켓 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5276969A (en) * | 1975-12-23 | 1977-06-28 | Fujitsu Ltd | Rotary probe |
US4105970A (en) * | 1976-12-27 | 1978-08-08 | Teradyne, Inc. | Test pin |
FR2479643A1 (fr) * | 1980-03-26 | 1981-10-02 | Sodeteg Tai | Palpeur pour dispositif de test de circuits imprimes et dispositifs de test incorporant un tel palpeur |
US4417206A (en) * | 1981-03-09 | 1983-11-22 | Virginia Panel Corporation | Electrical contact probe and method of manufacturing |
US4571540A (en) * | 1983-09-14 | 1986-02-18 | Virginia Panel Corporation | Electrical contact probe |
US6570399B2 (en) * | 2000-05-18 | 2003-05-27 | Qa Technology Company, Inc. | Test probe and separable mating connector assembly |
JP2002174642A (ja) * | 2000-12-06 | 2002-06-21 | Seiken Co Ltd | 検査用プローブ及び検査装置 |
JP2002202322A (ja) * | 2000-12-28 | 2002-07-19 | Yokowo Co Ltd | コンタクトプローブ |
JP3565824B2 (ja) * | 2002-05-31 | 2004-09-15 | 沖電気工業株式会社 | 半導体パッケージのテスト用プローブ及びテスト方法 |
JP4695337B2 (ja) * | 2004-02-04 | 2011-06-08 | 日本発條株式会社 | 導電性接触子および導電性接触子ユニット |
KR100647131B1 (ko) * | 2005-07-12 | 2006-11-23 | 리노공업주식회사 | 절곡홈이 형성된 프로브 및 그 제조방법 |
KR100659944B1 (ko) * | 2005-12-23 | 2006-12-21 | 리노공업주식회사 | 플런저 및 이를 장착한 검사용 탐침장치 |
JP2007218675A (ja) * | 2006-02-15 | 2007-08-30 | Fujitsu Ltd | プローブ及びプローブの製造方法 |
JP2008046100A (ja) * | 2006-08-10 | 2008-02-28 | Leeno Industrial Inc | 検査用探針装置及びその製造方法 |
US20090261851A1 (en) * | 2008-04-18 | 2009-10-22 | Antares Advanced Test Technologies, Inc. | Spring probe |
JP2010060316A (ja) * | 2008-09-01 | 2010-03-18 | Masashi Okuma | 異方性導電部材および異方導電性を有する測定用基板 |
KR101004708B1 (ko) * | 2008-09-23 | 2011-01-04 | 리노공업주식회사 | 반도체 패키지 검사용 탐침 장치 |
CN201359614Y (zh) * | 2009-02-26 | 2009-12-09 | 沈芳珍 | 一种测试探针 |
TWI400450B (zh) * | 2009-09-30 | 2013-07-01 | Chunghwa Picture Tubes Ltd | 測試裝置 |
GB201000344D0 (en) * | 2010-01-11 | 2010-02-24 | Cambridge Silicon Radio Ltd | An improved test probe |
KR101154519B1 (ko) | 2010-05-27 | 2012-06-13 | 하이콘 주식회사 | 스프링 콘택트 구조 |
-
2012
- 2012-06-13 KR KR20120062975A patent/KR101328581B1/ko active IP Right Grant
-
2013
- 2013-04-30 TW TW102115334A patent/TWI490501B/zh active
- 2013-05-23 JP JP2015512586A patent/JP6050481B2/ja active Active
- 2013-05-23 MY MYPI2014703670A patent/MY170044A/en unknown
- 2013-05-23 CN CN201380029823.0A patent/CN104350387A/zh active Pending
- 2013-05-23 WO PCT/KR2013/004504 patent/WO2013187611A1/en active Application Filing
- 2013-05-23 SG SG11201406969SA patent/SG11201406969SA/en unknown
- 2013-05-23 US US14/400,104 patent/US20150123687A1/en not_active Abandoned
-
2014
- 2014-12-04 PH PH12014502718A patent/PH12014502718A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20150123687A1 (en) | 2015-05-07 |
CN104350387A (zh) | 2015-02-11 |
TW201350859A (zh) | 2013-12-16 |
KR101328581B1 (ko) | 2013-11-13 |
WO2013187611A1 (en) | 2013-12-19 |
JP2015520851A (ja) | 2015-07-23 |
PH12014502718A1 (en) | 2015-02-02 |
SG11201406969SA (en) | 2014-11-27 |
MY170044A (en) | 2019-06-26 |
TWI490501B (zh) | 2015-07-01 |
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