JP6037814B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP6037814B2
JP6037814B2 JP2012274194A JP2012274194A JP6037814B2 JP 6037814 B2 JP6037814 B2 JP 6037814B2 JP 2012274194 A JP2012274194 A JP 2012274194A JP 2012274194 A JP2012274194 A JP 2012274194A JP 6037814 B2 JP6037814 B2 JP 6037814B2
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JP
Japan
Prior art keywords
plasma processing
faraday shield
window
plasma
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012274194A
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English (en)
Japanese (ja)
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JP2013149960A5 (enExample
JP2013149960A (ja
Inventor
優作 属
優作 属
忠義 川口
忠義 川口
西尾　良司
良司 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2012274194A priority Critical patent/JP6037814B2/ja
Publication of JP2013149960A publication Critical patent/JP2013149960A/ja
Publication of JP2013149960A5 publication Critical patent/JP2013149960A5/ja
Application granted granted Critical
Publication of JP6037814B2 publication Critical patent/JP6037814B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2012274194A 2011-12-21 2012-12-17 プラズマ処理装置 Active JP6037814B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012274194A JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011279149 2011-12-21
JP2011279149 2011-12-21
JP2012274194A JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2013149960A JP2013149960A (ja) 2013-08-01
JP2013149960A5 JP2013149960A5 (enExample) 2015-08-20
JP6037814B2 true JP6037814B2 (ja) 2016-12-07

Family

ID=48653398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012274194A Active JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Country Status (2)

Country Link
US (1) US20130160949A1 (enExample)
JP (1) JP6037814B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9767996B2 (en) * 2015-08-21 2017-09-19 Lam Research Corporation Application of powered electrostatic faraday shield to recondition dielectric window in ICP plasmas
KR102432857B1 (ko) * 2017-09-01 2022-08-16 삼성전자주식회사 플라즈마 처리 장치 및 이를 이용한 반도체 소자의 제조 방법
US12278089B2 (en) * 2023-01-31 2025-04-15 Applied Materials, Inc. Plasma uniformity control system and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056848A (en) * 1996-09-11 2000-05-02 Ctp, Inc. Thin film electrostatic shield for inductive plasma processing
US6459066B1 (en) * 2000-08-25 2002-10-01 Board Of Regents, The University Of Texas System Transmission line based inductively coupled plasma source with stable impedance
US20040173314A1 (en) * 2003-03-05 2004-09-09 Ryoji Nishio Plasma processing apparatus and method
JP3868925B2 (ja) * 2003-05-29 2007-01-17 株式会社日立製作所 プラズマ処理装置
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
JP4888076B2 (ja) * 2006-11-17 2012-02-29 パナソニック株式会社 プラズマエッチング装置
TW200845197A (en) * 2007-03-28 2008-11-16 Matsushita Electric Industrial Co Ltd Plasma etching apparatus

Also Published As

Publication number Publication date
US20130160949A1 (en) 2013-06-27
JP2013149960A (ja) 2013-08-01

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