JP2013149960A5 - - Google Patents

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Publication number
JP2013149960A5
JP2013149960A5 JP2012274194A JP2012274194A JP2013149960A5 JP 2013149960 A5 JP2013149960 A5 JP 2013149960A5 JP 2012274194 A JP2012274194 A JP 2012274194A JP 2012274194 A JP2012274194 A JP 2012274194A JP 2013149960 A5 JP2013149960 A5 JP 2013149960A5
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JP
Japan
Prior art keywords
plasma processing
processing apparatus
dielectric window
dielectric
faraday shield
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Application number
JP2012274194A
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English (en)
Japanese (ja)
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JP6037814B2 (ja
JP2013149960A (ja
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Priority to JP2012274194A priority Critical patent/JP6037814B2/ja
Priority claimed from JP2012274194A external-priority patent/JP6037814B2/ja
Publication of JP2013149960A publication Critical patent/JP2013149960A/ja
Publication of JP2013149960A5 publication Critical patent/JP2013149960A5/ja
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Publication of JP6037814B2 publication Critical patent/JP6037814B2/ja
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JP2012274194A 2011-12-21 2012-12-17 プラズマ処理装置 Active JP6037814B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012274194A JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011279149 2011-12-21
JP2011279149 2011-12-21
JP2012274194A JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2013149960A JP2013149960A (ja) 2013-08-01
JP2013149960A5 true JP2013149960A5 (enExample) 2015-08-20
JP6037814B2 JP6037814B2 (ja) 2016-12-07

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ID=48653398

Family Applications (1)

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JP2012274194A Active JP6037814B2 (ja) 2011-12-21 2012-12-17 プラズマ処理装置

Country Status (2)

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US (1) US20130160949A1 (enExample)
JP (1) JP6037814B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9767996B2 (en) * 2015-08-21 2017-09-19 Lam Research Corporation Application of powered electrostatic faraday shield to recondition dielectric window in ICP plasmas
KR102432857B1 (ko) * 2017-09-01 2022-08-16 삼성전자주식회사 플라즈마 처리 장치 및 이를 이용한 반도체 소자의 제조 방법
US12278089B2 (en) * 2023-01-31 2025-04-15 Applied Materials, Inc. Plasma uniformity control system and methods

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056848A (en) * 1996-09-11 2000-05-02 Ctp, Inc. Thin film electrostatic shield for inductive plasma processing
US6459066B1 (en) * 2000-08-25 2002-10-01 Board Of Regents, The University Of Texas System Transmission line based inductively coupled plasma source with stable impedance
US20040173314A1 (en) * 2003-03-05 2004-09-09 Ryoji Nishio Plasma processing apparatus and method
JP3868925B2 (ja) * 2003-05-29 2007-01-17 株式会社日立製作所 プラズマ処理装置
JP2007012734A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd プラズマエッチング装置及びプラズマエッチング方法
JP4888076B2 (ja) * 2006-11-17 2012-02-29 パナソニック株式会社 プラズマエッチング装置
TW200845197A (en) * 2007-03-28 2008-11-16 Matsushita Electric Industrial Co Ltd Plasma etching apparatus

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