JP6026829B2 - 弾性表面波デバイス - Google Patents

弾性表面波デバイス Download PDF

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JP6026829B2
JP6026829B2 JP2012199152A JP2012199152A JP6026829B2 JP 6026829 B2 JP6026829 B2 JP 6026829B2 JP 2012199152 A JP2012199152 A JP 2012199152A JP 2012199152 A JP2012199152 A JP 2012199152A JP 6026829 B2 JP6026829 B2 JP 6026829B2
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insulator
acoustic wave
piezoelectric substrate
wave device
cover body
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JP2014057124A5 (enExample
JP2014057124A (ja
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邦博 藤井
邦博 藤井
隆文 柏木
隆文 柏木
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スカイワークスフィルターソリューションズジャパン株式会社
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JP2012199152A 2012-09-11 2012-09-11 弾性表面波デバイス Active JP6026829B2 (ja)

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JP2016166411A Division JP6185125B2 (ja) 2016-08-29 2016-08-29 弾性表面波デバイスの製造方法

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JP2014057124A JP2014057124A (ja) 2014-03-27
JP2014057124A5 JP2014057124A5 (enExample) 2015-10-29
JP6026829B2 true JP6026829B2 (ja) 2016-11-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230134299A1 (en) * 2021-11-02 2023-05-04 Murata Manufacturing Co., Ltd. Acoustic wave device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5877932B1 (ja) 2014-02-26 2016-03-08 日本碍子株式会社 貫通孔を有する絶縁基板
KR102016489B1 (ko) * 2014-12-02 2019-09-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN105811917A (zh) * 2016-04-01 2016-07-27 江苏长电科技股份有限公司 金属圆片级表面声滤波芯片封装结构及其制造方法
KR102432301B1 (ko) 2017-12-27 2022-08-11 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치
CN114128144A (zh) * 2019-06-28 2022-03-01 京瓷株式会社 弹性波装置以及弹性波装置的制造方法
TWI690156B (zh) * 2019-07-10 2020-04-01 頎邦科技股份有限公司 表面聲波裝置及其製造方法

Family Cites Families (9)

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US5420472A (en) * 1992-06-11 1995-05-30 Motorola, Inc. Method and apparatus for thermal coefficient of expansion matched substrate attachment
JP2002261582A (ja) * 2000-10-04 2002-09-13 Matsushita Electric Ind Co Ltd 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール
JP2006352617A (ja) * 2005-06-17 2006-12-28 Alps Electric Co Ltd 電子部品の製造方法
JP2007324162A (ja) * 2006-05-30 2007-12-13 Sony Corp 半導体装置及びその製造方法
JP4906557B2 (ja) * 2007-03-28 2012-03-28 京セラ株式会社 弾性表面波装置の製造方法
US8299678B2 (en) * 2007-06-28 2012-10-30 Kyocera Corporation Surface acoustic wave device and method for production of same
US8384272B2 (en) * 2008-01-30 2013-02-26 Kyocera Corporation Acoustic wave device and method for production of same
JP5176603B2 (ja) * 2008-03-04 2013-04-03 パナソニック株式会社 弾性表面波デバイスおよびその製造方法
JP5755434B2 (ja) * 2010-11-30 2015-07-29 京セラ株式会社 弾性波装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230134299A1 (en) * 2021-11-02 2023-05-04 Murata Manufacturing Co., Ltd. Acoustic wave device

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