JP6023719B2 - 装着サイクル中に流体を塗布するための方法および装置 - Google Patents
装着サイクル中に流体を塗布するための方法および装置 Download PDFInfo
- Publication number
- JP6023719B2 JP6023719B2 JP2013544668A JP2013544668A JP6023719B2 JP 6023719 B2 JP6023719 B2 JP 6023719B2 JP 2013544668 A JP2013544668 A JP 2013544668A JP 2013544668 A JP2013544668 A JP 2013544668A JP 6023719 B2 JP6023719 B2 JP 6023719B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- fluid
- housing
- fluid application
- pick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012530 fluid Substances 0.000 title claims description 159
- 238000000034 method Methods 0.000 title claims description 29
- 230000008569 process Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000004834 spray adhesive Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- -1 flux Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (18)
- 構成要素装着機であって、
印刷回路基板の上方でXおよびY軸内で移動するように構成された移動可能なハウジングを有し、
該ハウジングは、構成要素を摘み上げ該構成要素を前記印刷回路基板上に装着するように構成された少なくとも1つの摘み上げ/装着ヘッドを有する回転可能なフレームと、前記摘み上げ/装着ヘッドによって摘み上げられた後かつ前記印刷回路基板上に配置される前に流体を前記構成要素に塗布するように構成された流体塗布ステーションとを備え、
前記ハウジングは、少なくとも、所定の装着場所に移動し、又は、前記所定の装着場所において前記構成要素を装着する、構成要素装着機。 - 前記流体塗布ステーションが、所定量の貯留流体を保持するように構成されたハウジングを含む、請求項1に記載の構成要素装着機。
- 前記流体塗布ステーションが、ハウジング内で複数のローラ上に配置されると共に前記貯留流体に部分的に位置するベルトを含み、該ベルトは流体を前記構成要素に塗布するように構成される、請求項2に記載の構成要素装着機。
- 流体塗布ステーションが、前記ベルトを回転させるために前記複数のローラの少なくとも1つを回転させるように構成されたモータおよび駆動軸を含む、請求項3に記載の構成要素装着機。
- 前記流体塗布ステーションが、前記流体を前記ベルトの内周面から除去するように構成されたワイパと、前記流体を前記構成要素に塗布するように構成された前記ベルトの外周面上で前記流体を一様にするように構成されたドクターブレードとを含む、請求項3に記載の構成要素装着機。
- 前記流体塗布ステーションが、前記ハウジングに取り外し可能に装着されている、請求項1に記載の構成要素装着機。
- 前記回転可能なフレームが、複数の摘み上げ/装着ヘッドを含む、請求項1に記載の構成要素装着機。
- 流体が前記流体塗布ステーションによって第1の摘み上げ/装着ヘッドによって摘み上げられた第1の構成要素に塗布されている間、別の摘み上げ/装着ヘッドが他の構成要素を摘み上げる、請求項7に記載の構成要素装着機。
- 装着サイクル中、流体を構成要素に塗布する方法であって、
(a)印刷回路基板の上方でXおよびY軸に沿って移動するように構成されると共に、摘み上げ/装着ヘッドを有するフレームが取り付けられたハウジングを含む構成要素装着機を提供する工程と、
(b)前記ハウジングに設けられ、流体を前記構成要素に塗布するように構成された流体塗布ステーションを提供する工程と、
(c)前記ハウジングを摘み上げ位置まで移動させる工程と、
(d)前記摘み上げ/装着ヘッドを用いて、前記構成要素を構成要素の供給部から摘み上げる工程と、
(e)前記ハウジングを所定の場所に移動させる移動工程と、
(f)流体を前記摘み上げられた構成要素に塗布する流体塗布工程と、
(g)前記流体が塗布された前記摘み上げられた構成要素を、前記所定の場所において前記印刷回路基板上に装着する装着工程とを含み、
前記流体塗布工程(f)が、前記移動工程(e)および前記装着工程(g)の少なくとも1つの間中に実質的に完全に行われる、方法。 - 前記流体塗布ステーションのベルトを回転させる工程をさらに含み、前記ベルトは、前記流体塗布工程(f)において、前記流体を前記摘み上げられた構成要素に塗布するように構成されている、請求項9に記載の方法。
- 前記流体塗布ステーションへのより容易なアクセスのために前記流体塗布ステーションを前記ハウジングから取り外す工程と、前記流体塗布ステーションを前記ハウジングに再取り付けする工程とをさらに含む、請求項9に記載の方法。
- 流体が前記摘み上げられた構成要素に塗布される必要があるか否かを決定する工程をさらに含み、
流体の塗布を必要とすると決定された摘み上げられた構成要素に対してのみ前記流体塗布工程(f)を実施する、請求項9に記載の方法。 - 複数の摘み上げ/装着ヘッドを前記フレーム上に設ける工程をさらに含み、
少なくとも前記工程(d)、(e)および(g)を追加の構成要素に対して繰り返す、請求項9に記載の方法。 - 装着サイクル中、流体を構成要素に塗布する方法であって、
(a)印刷回路基板の上方でXおよびY軸に沿って移動するように構成されると共に、複数の摘み上げ/装着ヘッドを有するフレームが回転可能に取り付けられたハウジングを含む構成要素装着機を提供する工程と、
(b)前記ハウジングに取り付けられ、流体を前記構成要素に塗布するように構成された流体塗布ステーションを提供する工程と、
(c)前記複数の摘み上げ/装着ヘッドの少なくとも1つを用いて、前記構成要素を構成要素の供給部から摘み上げる摘み上げ工程と、
(d)流体を前記摘み上げられた構成要素に塗布する流体塗布工程と、
(e)前記流体が塗布された前記摘み上げられた構成要素を、所定の場所において前記印刷回路基板上に装着する装着工程とを含み、
追加の構成要素に対して工程(c)から(e)を反復することをさらに含み、前記流体塗布工程(d)が、前記追加の構成要素のために繰り返される前記摘み上げ工程(c)の少なくとも1つの間に実質的に行われる、方法。 - 前記装着工程(e)が、前記追加の構成要素に対し反復される前記流体塗布工程(d)の間に実質的に行われる、請求項14に記載の方法。
- 前記流体塗布工程(d)が、複数の前記摘み上げ/装着ヘッドの少なくとも1つを延ばす工程を含み、それにより前記流体が前記流体塗布ステーションによって前記構成要素に塗布される、請求項14に記載の方法。
- 流体が前記摘み上げられた構成要素に塗布される必要があるかを決定し、流体の塗布が必要であると決定された摘み上げられた構成要素に対してのみ前記流体塗布工程(d)を実施する、請求項14に記載の方法。
- 前記流体塗布ステーションへのより容易なアクセスのために前記流体塗布ステーションを前記ハウジングから取り外す工程と、前記流体塗布ステーションを前記ハウジングに再取り付けする工程とをさらに含む、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/968,385 | 2010-12-15 | ||
US12/968,385 US8898893B2 (en) | 2010-12-15 | 2010-12-15 | Method and apparatus for applying fluid during a placement cycle |
PCT/US2011/064536 WO2012082681A1 (en) | 2010-12-15 | 2011-12-13 | Method and apparatus for applying fluid during a placement cycle |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014504012A JP2014504012A (ja) | 2014-02-13 |
JP6023719B2 true JP6023719B2 (ja) | 2016-11-09 |
Family
ID=46232757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013544668A Active JP6023719B2 (ja) | 2010-12-15 | 2011-12-13 | 装着サイクル中に流体を塗布するための方法および装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8898893B2 (ja) |
JP (1) | JP6023719B2 (ja) |
KR (1) | KR101893233B1 (ja) |
CN (1) | CN103299725B (ja) |
DE (1) | DE112011104380T5 (ja) |
SG (1) | SG191188A1 (ja) |
WO (1) | WO2012082681A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8898893B2 (en) * | 2010-12-15 | 2014-12-02 | Universal Instruments Corporation | Method and apparatus for applying fluid during a placement cycle |
CN106217038A (zh) | 2012-06-28 | 2016-12-14 | 环球仪器公司 | 灵活的装配机械、系统及方法 |
JP6678596B2 (ja) | 2014-02-07 | 2020-04-08 | ユニヴァーサル インストゥルメンツ コーポレイションUniversal Instruments Corporation | ポンプとモーターを持つピックアンドプレースヘッド |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62114289A (ja) * | 1985-11-14 | 1987-05-26 | 松下電器産業株式会社 | 電子部品の装着方法および装置 |
US5345514A (en) * | 1991-09-16 | 1994-09-06 | General Electric Company | Method for inspecting components having complex geometric shapes |
GB2269335A (en) * | 1992-08-04 | 1994-02-09 | Ibm | Solder particle deposition |
JP3114034B2 (ja) * | 1992-06-05 | 2000-12-04 | ヤマハ発動機株式会社 | 部品実装方法及び部品実装装置 |
KR100204171B1 (ko) * | 1997-02-17 | 1999-06-15 | 윤종용 | 자동 적층 및 솔더링 장치 및 3차원 적층형 패키지 소자 제조 방법 |
EP1117287A4 (en) * | 1998-09-25 | 2002-09-18 | Matsushita Electric Ind Co Ltd | METHOD AND DEVICE FOR ASSEMBLING COMPONENTS |
JP4167790B2 (ja) * | 2000-03-10 | 2008-10-22 | 東レエンジニアリング株式会社 | チップ実装装置 |
JP2003298291A (ja) * | 2002-03-29 | 2003-10-17 | Fuji Mach Mfg Co Ltd | 電子部品実装方法および電子部品実装装置 |
JP4163452B2 (ja) * | 2002-05-31 | 2008-10-08 | 松下電器産業株式会社 | 部品実装基板生産装置 |
JP2004111797A (ja) * | 2002-09-20 | 2004-04-08 | Fuji Mach Mfg Co Ltd | 供給位置検出機能を有する電子回路部品供給装置および電子回路部品供給・取出装置 |
DE10258798A1 (de) * | 2002-12-16 | 2004-07-22 | Siemens Ag | Verfahren und Vorrichtung zum partiellen Aufbringen von Klebstoff auf elektronische Bauelemente, Bestückvorrichtung zum Bestücken von Bauelementen |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
JP4334892B2 (ja) * | 2003-03-20 | 2009-09-30 | パナソニック株式会社 | 部品実装方法 |
US6879869B2 (en) * | 2003-03-28 | 2005-04-12 | Accu-Assembly Incorporated | Placement of electronic components |
US7188409B2 (en) * | 2003-10-31 | 2007-03-13 | Universal Instruments Corp. | Method for rejecting component during a placement cycle |
US8898893B2 (en) * | 2010-12-15 | 2014-12-02 | Universal Instruments Corporation | Method and apparatus for applying fluid during a placement cycle |
-
2010
- 2010-12-15 US US12/968,385 patent/US8898893B2/en active Active
-
2011
- 2011-12-13 JP JP2013544668A patent/JP6023719B2/ja active Active
- 2011-12-13 WO PCT/US2011/064536 patent/WO2012082681A1/en active Application Filing
- 2011-12-13 DE DE201111104380 patent/DE112011104380T5/de active Pending
- 2011-12-13 CN CN201180060298.XA patent/CN103299725B/zh active Active
- 2011-12-13 SG SG2013046313A patent/SG191188A1/en unknown
- 2011-12-13 KR KR1020137018391A patent/KR101893233B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20130129240A (ko) | 2013-11-27 |
WO2012082681A1 (en) | 2012-06-21 |
DE112011104380T5 (de) | 2013-11-21 |
CN103299725B (zh) | 2017-06-23 |
SG191188A1 (en) | 2013-07-31 |
US8898893B2 (en) | 2014-12-02 |
US20120152358A1 (en) | 2012-06-21 |
CN103299725A (zh) | 2013-09-11 |
JP2014504012A (ja) | 2014-02-13 |
KR101893233B1 (ko) | 2018-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4643719B2 (ja) | はんだ供給装置、印刷装置および印刷方法 | |
EP2648914B1 (en) | Method for depositing viscous material on a substrate with a combination stencil printer and dispenser | |
US20120145013A1 (en) | Combination stencil printer and dispenser and related methods | |
US20120145015A1 (en) | Combination stencil printer and dispenser and related methods | |
US20120145014A1 (en) | Combination stencil printer and dispenser and related methods | |
JP7556892B2 (ja) | はんだペーストビード回収システム及び方法 | |
JP6023719B2 (ja) | 装着サイクル中に流体を塗布するための方法および装置 | |
JP2001320159A (ja) | 電子部品の実装方法および表面実装機 | |
TW201641296A (zh) | 具有網板穿梭組件的網板打印機 | |
JP4781945B2 (ja) | 基板処理方法および部品実装システム | |
JP2003179399A (ja) | 部品実装機 | |
JP7402362B2 (ja) | 部品装着機 | |
JP4252720B2 (ja) | 電子部品実装方法 | |
JP2007142216A (ja) | 部品実装方法およびノズル割付け方法 | |
JP2003273166A (ja) | 電子部品搭載装置および電子部品搭載方法 | |
JP2019047067A (ja) | 基板作業装置 | |
KR101815050B1 (ko) | 부품 실장기 | |
JP2006073959A (ja) | 部品認識装置及び表面実装機並びに部品試験装置 | |
JP5726581B2 (ja) | 電子部品リペア機および生産ライン | |
JP2000174158A (ja) | ボールマウント装置 | |
JP6529442B2 (ja) | 保持部駆動ユニット設定方法、制御装置、部品実装装置、及び、表面実装機 | |
JP7177928B2 (ja) | 転写装置及び部品作業機並びに転写量補正方法 | |
US20050091845A1 (en) | Method of component rejection from a placement head | |
WO2017068645A1 (ja) | 部品装着方法および部品装着機 | |
JP7420698B2 (ja) | 管理装置及びそれを備えた部品実装システム並びに管理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20131125 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20131125 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150804 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20151104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151119 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160905 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20160913 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161007 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6023719 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |