JP6017382B2 - 個片化された電子部品の搬送装置及び搬送方法 - Google Patents

個片化された電子部品の搬送装置及び搬送方法 Download PDF

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Publication number
JP6017382B2
JP6017382B2 JP2013156950A JP2013156950A JP6017382B2 JP 6017382 B2 JP6017382 B2 JP 6017382B2 JP 2013156950 A JP2013156950 A JP 2013156950A JP 2013156950 A JP2013156950 A JP 2013156950A JP 6017382 B2 JP6017382 B2 JP 6017382B2
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Japan
Prior art keywords
electronic component
electronic components
transfer mechanism
electronic
transporting
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JP2013156950A
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English (en)
Japanese (ja)
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JP2015026789A5 (zh
JP2015026789A (ja
Inventor
一郎 今井
一郎 今井
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Towa Corp
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Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2013156950A priority Critical patent/JP6017382B2/ja
Priority to TW103115317A priority patent/TWI570829B/zh
Priority to KR1020140091043A priority patent/KR101641771B1/ko
Priority to CN201410363740.1A priority patent/CN104347463B/zh
Publication of JP2015026789A publication Critical patent/JP2015026789A/ja
Publication of JP2015026789A5 publication Critical patent/JP2015026789A5/ja
Application granted granted Critical
Publication of JP6017382B2 publication Critical patent/JP6017382B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)
JP2013156950A 2013-07-29 2013-07-29 個片化された電子部品の搬送装置及び搬送方法 Active JP6017382B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013156950A JP6017382B2 (ja) 2013-07-29 2013-07-29 個片化された電子部品の搬送装置及び搬送方法
TW103115317A TWI570829B (zh) 2013-07-29 2014-04-29 經切片之電子零件之搬送裝置及搬送方法
KR1020140091043A KR101641771B1 (ko) 2013-07-29 2014-07-18 개편화된 전자 부품의 반송 장치 및 반송 방법
CN201410363740.1A CN104347463B (zh) 2013-07-29 2014-07-28 经切片的电子零件的搬送装置及搬送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013156950A JP6017382B2 (ja) 2013-07-29 2013-07-29 個片化された電子部品の搬送装置及び搬送方法

Publications (3)

Publication Number Publication Date
JP2015026789A JP2015026789A (ja) 2015-02-05
JP2015026789A5 JP2015026789A5 (zh) 2015-10-01
JP6017382B2 true JP6017382B2 (ja) 2016-11-02

Family

ID=52491198

Family Applications (1)

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JP2013156950A Active JP6017382B2 (ja) 2013-07-29 2013-07-29 個片化された電子部品の搬送装置及び搬送方法

Country Status (4)

Country Link
JP (1) JP6017382B2 (zh)
KR (1) KR101641771B1 (zh)
CN (1) CN104347463B (zh)
TW (1) TWI570829B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6419596B2 (ja) 2015-02-13 2018-11-07 株式会社東芝 薄膜線材の接続構造、その接続構造を用いた高温超電導線材およびその接続構造を用いた高温超電導コイル
JP6382132B2 (ja) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 切断装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体
JP2016213240A (ja) * 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
WO2017194286A1 (en) 2016-05-13 2017-11-16 Asml Netherlands B.V. Multiple miniature pick up elements for a component stacking and/or pick-and-place process
CN109789630B (zh) 2016-10-10 2021-05-28 惠普发展公司，有限责任合伙企业 微结构转移系统
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP6598811B2 (ja) * 2017-03-23 2019-10-30 Ｔｏｗａ株式会社 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法
JP6640142B2 (ja) * 2017-03-31 2020-02-05 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
JP2018181951A (ja) * 2017-04-06 2018-11-15 株式会社ディスコ 加工装置
JP6952515B2 (ja) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
EP4285403A2 (de) 2021-01-29 2023-12-06 PINK GmbH Thermosysteme Anlage und verfahren zum verbinden von elektronischen baugruppen

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP4514321B2 (ja) * 2000-12-08 2010-07-28 パナソニック株式会社 部品実装装置
JP2004039706A (ja) * 2002-07-01 2004-02-05 Yokogawa Electric Corp 搬送装置
KR20040009803A (ko) * 2002-07-25 2004-01-31 삼성전자주식회사 진공흡착패드의 피치 조절이 자유로운 반도체 칩 패키지이송 장치
US20040146383A1 (en) * 2003-01-14 2004-07-29 International Product Technology, Inc. Apparatus having a variable pitch pick-and-place head for packaging electrical parts and methods of operating the same
KR101042655B1 (ko) * 2006-07-27 2011-06-20 가부시키가이샤 아드반테스트 전자부품 이송방법 및 전자부품 핸들링 장치
JP2008186981A (ja) * 2007-01-30 2008-08-14 Towa Corp ワークの搬送方法及び搬送装置
JP5108481B2 (ja) * 2007-11-30 2012-12-26 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
US8166638B2 (en) * 2009-06-11 2012-05-01 Asm Assembly Automation Ltd Rotary clip bonder
SG172499A1 (en) * 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5466624B2 (ja) * 2010-12-02 2014-04-09 ヤマハ発動機株式会社 実装機

Also Published As

Publication number Publication date
TWI570829B (zh) 2017-02-11
KR20150014377A (ko) 2015-02-06
CN104347463B (zh) 2017-12-19
KR101641771B1 (ko) 2016-07-21
TW201505119A (zh) 2015-02-01
CN104347463A (zh) 2015-02-11
JP2015026789A (ja) 2015-02-05

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