JP6007413B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP6007413B2 JP6007413B2 JP2013546505A JP2013546505A JP6007413B2 JP 6007413 B2 JP6007413 B2 JP 6007413B2 JP 2013546505 A JP2013546505 A JP 2013546505A JP 2013546505 A JP2013546505 A JP 2013546505A JP 6007413 B2 JP6007413 B2 JP 6007413B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal block
- wiring board
- hole
- soldering
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 claims description 38
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000005452 bending Methods 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/515—Terminal blocks providing connections to wires or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
11 配線パターン
12 スルーホール
13 端子台
14 半田付部
16 半田
17 ジャンパ線(金属線)
18 孔
31 足
32 ねじ孔
33 端子台の上面
34 端子台の側面
A 隙間
Claims (4)
- 配線基板の端子台を配置する側の面上に配線パターンを設け、前記端子台はこの配線パ
ターン内の2つのスルーホールに夫々嵌る2つの足を半田付可能な板部材を折り曲げた側
面から突起させると共に上面のねじ孔に配線の端子をねじで固定するように成し、前記配
線パターン上に前記足を前記スルーホール内に挿入して半田付けする半田付部を備え、
前記配線基板の端子台の配置される側に半田付可能な金属線を前記2つのスルーホール
をまたぐと共に前記側面に沿って配置された状態であり、前記配線基板の前記端子台を配
置する側の面と反対側から前記スルーホールを介して供給され、かつ前記金属線と前記側
面との間に、前記2つのスルーホールの内一方から他方にわたって前記金属線と前記側面
と前記半田付部とを一体にする半田を備えることを特徴とする配線基板。 - 前記スルーホールは、前記複数の足に相対向して夫々設けられ、前記金属線は直線状に
配置されることを特徴とする請求項1に記載の配線基板。 - 前記金属線は少なくとも2つ設けられ、前記2つの金属線は前記端子台を挟んで互いに
対向する位置に設けられることを特徴とする請求項1又は請求項2に記載の配線基板。 - 前記スルーホールと前記足とは異なる形状を有することを特徴とする請求項3に記載の
配線基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/063837 WO2013179403A1 (ja) | 2012-05-30 | 2012-05-30 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013179403A1 JPWO2013179403A1 (ja) | 2016-01-14 |
JP6007413B2 true JP6007413B2 (ja) | 2016-10-12 |
Family
ID=49672657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013546505A Expired - Fee Related JP6007413B2 (ja) | 2012-05-30 | 2012-05-30 | 配線基板 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2688374A4 (ja) |
JP (1) | JP6007413B2 (ja) |
CN (1) | CN204014279U (ja) |
WO (1) | WO2013179403A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6503650B2 (ja) * | 2014-07-07 | 2019-04-24 | 富士電機株式会社 | 電力変換装置の冷却構造 |
CN108449885B (zh) * | 2018-05-17 | 2020-06-16 | 无锡和晶智能科技有限公司 | 一种在单面印刷线路板上实现双面焊接元器件的方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0446536U (ja) * | 1990-08-28 | 1992-04-21 | ||
JPH0617270U (ja) * | 1992-06-02 | 1994-03-04 | 三洋電機株式会社 | プリント基板の電気部品取り付け装置 |
JPH06302932A (ja) * | 1993-04-09 | 1994-10-28 | Toyo Electric Mfg Co Ltd | プリント配線基板 |
JPH07336029A (ja) * | 1994-06-08 | 1995-12-22 | Aiwa Co Ltd | プリント基板 |
JP2001332848A (ja) | 2000-05-22 | 2001-11-30 | Matsushita Electric Ind Co Ltd | 電子部品の基板実装方法及び基板実装構造 |
JP2006012873A (ja) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | 電子制御装置 |
JP4816788B2 (ja) * | 2009-10-29 | 2011-11-16 | ダイキン工業株式会社 | 配線基板ユニット |
-
2012
- 2012-05-30 WO PCT/JP2012/063837 patent/WO2013179403A1/ja active Application Filing
- 2012-05-30 EP EP12866400.0A patent/EP2688374A4/en not_active Withdrawn
- 2012-05-30 JP JP2013546505A patent/JP6007413B2/ja not_active Expired - Fee Related
- 2012-05-30 CN CN201290000939.2U patent/CN204014279U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2013179403A1 (ja) | 2016-01-14 |
WO2013179403A1 (ja) | 2013-12-05 |
EP2688374A1 (en) | 2014-01-22 |
CN204014279U (zh) | 2014-12-10 |
EP2688374A4 (en) | 2015-09-02 |
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