JP5988882B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5988882B2
JP5988882B2 JP2013005945A JP2013005945A JP5988882B2 JP 5988882 B2 JP5988882 B2 JP 5988882B2 JP 2013005945 A JP2013005945 A JP 2013005945A JP 2013005945 A JP2013005945 A JP 2013005945A JP 5988882 B2 JP5988882 B2 JP 5988882B2
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Prior art keywords
collar
semiconductor device
bolt
diameter portion
diameter
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JP2013005945A
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Japanese (ja)
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JP2014138080A5 (enExample
JP2014138080A (ja
Inventor
井本　裕児
裕児 井本
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2013005945A priority Critical patent/JP5988882B2/ja
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Publication of JP2014138080A5 publication Critical patent/JP2014138080A5/ja
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  • Connection Of Plates (AREA)
  • Bolts, Nuts, And Washers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013005945A 2013-01-17 2013-01-17 半導体装置 Active JP5988882B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013005945A JP5988882B2 (ja) 2013-01-17 2013-01-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013005945A JP5988882B2 (ja) 2013-01-17 2013-01-17 半導体装置

Publications (3)

Publication Number Publication Date
JP2014138080A JP2014138080A (ja) 2014-07-28
JP2014138080A5 JP2014138080A5 (enExample) 2015-06-18
JP5988882B2 true JP5988882B2 (ja) 2016-09-07

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JP2013005945A Active JP5988882B2 (ja) 2013-01-17 2013-01-17 半導体装置

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JP (1) JP5988882B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056366B2 (ja) * 2018-05-16 2022-04-19 富士電機株式会社 半導体モジュール及びそれを用いた半導体装置
CN112707631B (zh) * 2020-12-30 2023-10-31 中国电子科技集团公司第四十研究所 一种THz玻璃绝缘子的烧制组件及烧制方法
JP7666173B2 (ja) * 2021-06-30 2025-04-22 住友電気工業株式会社 半導体装置および樹脂製構造体
DE112021007924T5 (de) * 2021-07-05 2024-04-18 Mitsubishi Electric Corporation Halbleitervorrichtung und Herstellungsverfahren für eine Halbleitervorrichtung
JP2023085765A (ja) * 2021-12-09 2023-06-21 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693349A (en) * 1979-12-25 1981-07-28 Fujitsu Ltd Resin mold type semiconductor device
JPH0178033U (enExample) * 1987-11-12 1989-05-25
JPH0722106U (ja) * 1993-09-28 1995-04-21 エヌオーケー株式会社 ブッシュ
JPH09129823A (ja) * 1995-10-27 1997-05-16 Fuji Electric Co Ltd 半導体装置
JP3310599B2 (ja) * 1997-09-30 2002-08-05 トヨタ自動車株式会社 金属カラー及び同金属カラーを用いた締結構造体
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP4615289B2 (ja) * 2004-11-12 2011-01-19 三菱電機株式会社 半導体装置
JP4882495B2 (ja) * 2006-05-09 2012-02-22 富士電機株式会社 半導体装置
JP2010067924A (ja) * 2008-09-12 2010-03-25 Hitachi Koki Co Ltd 半導体装置及び充電装置

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JP2014138080A (ja) 2014-07-28

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