JP2014138080A5 - - Google Patents
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- Publication number
- JP2014138080A5 JP2014138080A5 JP2013005945A JP2013005945A JP2014138080A5 JP 2014138080 A5 JP2014138080 A5 JP 2014138080A5 JP 2013005945 A JP2013005945 A JP 2013005945A JP 2013005945 A JP2013005945 A JP 2013005945A JP 2014138080 A5 JP2014138080 A5 JP 2014138080A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- diameter
- collar
- diameter portion
- bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000003086 colorant Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013005945A JP5988882B2 (ja) | 2013-01-17 | 2013-01-17 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013005945A JP5988882B2 (ja) | 2013-01-17 | 2013-01-17 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014138080A JP2014138080A (ja) | 2014-07-28 |
| JP2014138080A5 true JP2014138080A5 (enExample) | 2015-06-18 |
| JP5988882B2 JP5988882B2 (ja) | 2016-09-07 |
Family
ID=51415428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013005945A Active JP5988882B2 (ja) | 2013-01-17 | 2013-01-17 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5988882B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7056366B2 (ja) * | 2018-05-16 | 2022-04-19 | 富士電機株式会社 | 半導体モジュール及びそれを用いた半導体装置 |
| CN112707631B (zh) * | 2020-12-30 | 2023-10-31 | 中国电子科技集团公司第四十研究所 | 一种THz玻璃绝缘子的烧制组件及烧制方法 |
| JP7666173B2 (ja) * | 2021-06-30 | 2025-04-22 | 住友電気工業株式会社 | 半導体装置および樹脂製構造体 |
| WO2023281562A1 (ja) * | 2021-07-05 | 2023-01-12 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2023085765A (ja) * | 2021-12-09 | 2023-06-21 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5693349A (en) * | 1979-12-25 | 1981-07-28 | Fujitsu Ltd | Resin mold type semiconductor device |
| JPH0178033U (enExample) * | 1987-11-12 | 1989-05-25 | ||
| JPH0722106U (ja) * | 1993-09-28 | 1995-04-21 | エヌオーケー株式会社 | ブッシュ |
| JPH09129823A (ja) * | 1995-10-27 | 1997-05-16 | Fuji Electric Co Ltd | 半導体装置 |
| JP3310599B2 (ja) * | 1997-09-30 | 2002-08-05 | トヨタ自動車株式会社 | 金属カラー及び同金属カラーを用いた締結構造体 |
| JP3740117B2 (ja) * | 2002-11-13 | 2006-02-01 | 三菱電機株式会社 | 電力用半導体装置 |
| JP4615289B2 (ja) * | 2004-11-12 | 2011-01-19 | 三菱電機株式会社 | 半導体装置 |
| JP4882495B2 (ja) * | 2006-05-09 | 2012-02-22 | 富士電機株式会社 | 半導体装置 |
| JP2010067924A (ja) * | 2008-09-12 | 2010-03-25 | Hitachi Koki Co Ltd | 半導体装置及び充電装置 |
-
2013
- 2013-01-17 JP JP2013005945A patent/JP5988882B2/ja active Active
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