JP2020501354A5 - - Google Patents

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Publication number
JP2020501354A5
JP2020501354A5 JP2019528492A JP2019528492A JP2020501354A5 JP 2020501354 A5 JP2020501354 A5 JP 2020501354A5 JP 2019528492 A JP2019528492 A JP 2019528492A JP 2019528492 A JP2019528492 A JP 2019528492A JP 2020501354 A5 JP2020501354 A5 JP 2020501354A5
Authority
JP
Japan
Prior art keywords
substrate
heat sink
pin
movable fingers
fingers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019528492A
Other languages
English (en)
Japanese (ja)
Other versions
JP7106536B2 (ja
JP2020501354A (ja
Filing date
Publication date
Priority claimed from US15/362,064 external-priority patent/US10117356B2/en
Application filed filed Critical
Publication of JP2020501354A publication Critical patent/JP2020501354A/ja
Publication of JP2020501354A5 publication Critical patent/JP2020501354A5/ja
Application granted granted Critical
Publication of JP7106536B2 publication Critical patent/JP7106536B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019528492A 2016-11-28 2017-11-28 ヒートシンクコネクタピン及びアセンブリ Active JP7106536B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/362,064 US10117356B2 (en) 2016-11-28 2016-11-28 Heat sink connector pin and assembly
US15/362,064 2016-11-28
PCT/US2017/063367 WO2018098456A1 (en) 2016-11-28 2017-11-28 Heat sink connector pin and assembly

Publications (3)

Publication Number Publication Date
JP2020501354A JP2020501354A (ja) 2020-01-16
JP2020501354A5 true JP2020501354A5 (enExample) 2021-01-14
JP7106536B2 JP7106536B2 (ja) 2022-07-26

Family

ID=57799449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019528492A Active JP7106536B2 (ja) 2016-11-28 2017-11-28 ヒートシンクコネクタピン及びアセンブリ

Country Status (6)

Country Link
US (1) US10117356B2 (enExample)
EP (1) EP3327770B1 (enExample)
JP (1) JP7106536B2 (enExample)
KR (1) KR102443652B1 (enExample)
CN (1) CN109891581B (enExample)
WO (1) WO2018098456A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113251047A (zh) * 2021-04-29 2021-08-13 成都飞机工业（集团）有限责任公司 一种可单边操作的安全插销及其使用方法
US11758690B2 (en) * 2021-06-18 2023-09-12 Nanning Fulian Fugui Precision Industrial Co., Ltd. Heat-dissipation device allowing easy detachment from heat-generating component
US12471221B2 (en) * 2022-10-21 2025-11-11 Raytheon Company Clamping device with pivoting retainer

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213642A (en) * 1979-02-12 1980-07-22 Hartwell Corporation Rotary latch and method of operation
US4760495A (en) * 1987-04-16 1988-07-26 Prime Computer Inc. Stand-off device
US5199733A (en) * 1991-09-09 1993-04-06 Delorme Glen E Safety hitch pin
US5517734A (en) * 1995-04-10 1996-05-21 Korpi; John G. Quick fastener
US5870286A (en) 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US6118659A (en) * 1998-03-09 2000-09-12 International Business Machines Corporation Heat sink clamping spring additionally holding a ZIF socket locked
KR100457220B1 (ko) 2002-02-27 2004-11-16 잘만테크 주식회사 칩셋 냉각용 히트싱크장치
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
JP3894070B2 (ja) 2002-08-06 2007-03-14 富士通株式会社 ヒートシンク、ヒートシンク装置、該ヒートシンクの固定方法及び該ヒートシンクを使用した電子装置
US20040238947A1 (en) 2003-05-28 2004-12-02 Intel Corporation Package and method for attaching an integrated heat spreader
US20050072558A1 (en) 2003-10-03 2005-04-07 Aavid Thermalloy, Llc Heat sink assembly and connecting device
TWM248206U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Clip for heat sink
US7516948B2 (en) * 2004-04-02 2009-04-14 Phd, Inc. Pin clamp accessories
JP4212511B2 (ja) * 2004-05-06 2009-01-21 富士通株式会社 半導体装置及び半導体装置の組立方法
US7489511B2 (en) * 2006-12-28 2009-02-10 Hon Hai Precision Industry Co., Ltd. Heat sink clip
US7852633B2 (en) * 2008-07-24 2010-12-14 Yamaichi Electronics Co., Ltd. Connector for connection to a module board
DE102009002992B4 (de) * 2009-05-11 2014-10-30 Infineon Technologies Ag Leistungshalbleitermodulanordnung mit eindeutig und verdrehsicher auf einem Kühlkörper montierbarem Leistungshalbleitermodul und Montageverfahren
JP3153773U (ja) * 2009-07-08 2009-09-17 本俊 游 放熱モジュール用固定部材
JP2011023491A (ja) * 2009-07-15 2011-02-03 Nec Corp 係止治具及び半導体装置
US20110027038A1 (en) * 2009-07-28 2011-02-03 Pen-Chun YU Heat sink anchoring apparatus
CN102146944A (zh) 2010-02-05 2011-08-10 鸿富锦精密工业（深圳）有限公司 固定装置及使用该固定装置的散热模组
KR101508467B1 (ko) 2014-09-23 2015-04-07 삼성전기주식회사 히트 싱크가 결합된 반도체 모듈

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