JP2014116546A5 - - Google Patents

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Publication number
JP2014116546A5
JP2014116546A5 JP2012271420A JP2012271420A JP2014116546A5 JP 2014116546 A5 JP2014116546 A5 JP 2014116546A5 JP 2012271420 A JP2012271420 A JP 2012271420A JP 2012271420 A JP2012271420 A JP 2012271420A JP 2014116546 A5 JP2014116546 A5 JP 2014116546A5
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JP
Japan
Prior art keywords
cooling jacket
extending
base plate
extending portion
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012271420A
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English (en)
Japanese (ja)
Other versions
JP5974880B2 (ja
JP2014116546A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012271420A priority Critical patent/JP5974880B2/ja
Priority claimed from JP2012271420A external-priority patent/JP5974880B2/ja
Publication of JP2014116546A publication Critical patent/JP2014116546A/ja
Publication of JP2014116546A5 publication Critical patent/JP2014116546A5/ja
Application granted granted Critical
Publication of JP5974880B2 publication Critical patent/JP5974880B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012271420A 2012-12-12 2012-12-12 半導体装置及びその製造方法 Expired - Fee Related JP5974880B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012271420A JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012271420A JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014116546A JP2014116546A (ja) 2014-06-26
JP2014116546A5 true JP2014116546A5 (enExample) 2015-01-15
JP5974880B2 JP5974880B2 (ja) 2016-08-23

Family

ID=51172229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012271420A Expired - Fee Related JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5974880B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107426940B (zh) * 2016-05-24 2019-04-30 上汽通用五菱汽车股份有限公司 一种车用dc/dc变换器散热方法
EP4095900B1 (en) * 2021-05-28 2024-01-31 Hitachi Energy Ltd Clamping element and method for producing a power semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154054U (enExample) * 1980-04-14 1981-11-18
JP2000082774A (ja) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル
JP3864282B2 (ja) * 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
JP2005302882A (ja) * 2004-04-08 2005-10-27 Nissan Motor Co Ltd 半導体装置
JP4396366B2 (ja) * 2004-04-08 2010-01-13 日産自動車株式会社 半導体装置
JP2008270295A (ja) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd 半導体装置

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