JP5974880B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5974880B2
JP5974880B2 JP2012271420A JP2012271420A JP5974880B2 JP 5974880 B2 JP5974880 B2 JP 5974880B2 JP 2012271420 A JP2012271420 A JP 2012271420A JP 2012271420 A JP2012271420 A JP 2012271420A JP 5974880 B2 JP5974880 B2 JP 5974880B2
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extending
extending portion
cooling jacket
base plate
semiconductor device
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Japanese (ja)
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JP2014116546A5 (enExample
JP2014116546A (ja
Inventor
大輔 村田
大輔 村田
吉松　直樹
直樹 吉松
修 碓井
修 碓井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012271420A 2012-12-12 2012-12-12 半導体装置及びその製造方法 Expired - Fee Related JP5974880B2 (ja)

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JP2012271420A JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

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JP2012271420A JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

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JP2014116546A JP2014116546A (ja) 2014-06-26
JP2014116546A5 JP2014116546A5 (enExample) 2015-01-15
JP5974880B2 true JP5974880B2 (ja) 2016-08-23

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JP2012271420A Expired - Fee Related JP5974880B2 (ja) 2012-12-12 2012-12-12 半導体装置及びその製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107426940B (zh) * 2016-05-24 2019-04-30 上汽通用五菱汽车股份有限公司 一种车用dc/dc变换器散热方法
EP4095900B1 (en) * 2021-05-28 2024-01-31 Hitachi Energy Ltd Clamping element and method for producing a power semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56154054U (enExample) * 1980-04-14 1981-11-18
JP2000082774A (ja) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル
JP3864282B2 (ja) * 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
JP2005302882A (ja) * 2004-04-08 2005-10-27 Nissan Motor Co Ltd 半導体装置
JP4396366B2 (ja) * 2004-04-08 2010-01-13 日産自動車株式会社 半導体装置
JP2008270295A (ja) * 2007-04-16 2008-11-06 Sumitomo Electric Ind Ltd 半導体装置

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