JP5974880B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a semiconductor device in which a semiconductor module is attached to a cooling jacket and a manufacturing method thereof.

  A transfer mold type semiconductor module in which a semiconductor element and a cooling fin are sealed with a resin is used for an inverter for controlling a motor of an automobile, a train or the like, a power generation, a regeneration converter, or the like. When this semiconductor module is attached to the cooling jacket, conventionally, the four corners of the base plate extending from the resin sealing portion of the semiconductor module are screwed to the cooling jacket (for example, see Patent Document 1).

JP 2005-286020 A

  However, since a space for providing screw holes in the base plate is required, the size of the semiconductor module increases. For this reason, there existed a problem that a manufacturing apparatus and a conveying apparatus enlarged.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a semiconductor device capable of reducing the size of a semiconductor module and preventing an increase in size of a manufacturing apparatus and a transport apparatus and a manufacturing method thereof. It is.

The method of manufacturing a semiconductor device according to the present invention includes a step of mounting a semiconductor element on a mounting portion of a base plate of a cooling fin, and sealing the semiconductor element and the mounting portion with a resin to form a semiconductor module; A step of inserting the first extending portion of the base plate extending in the lateral direction from the mounting portion into the insertion port of the fixing portion of the cooling jacket; and the state in which the first extending portion is inserted into the insertion port, Fixing the second extending portion of the base plate extending from the mounting portion in a direction opposite to the first extending portion to the cooling jacket, and attaching the semiconductor module to the cooling jacket , In the fixing portion, a groove is provided below a portion into which the first extending portion is inserted .

  According to the present invention, it is possible to reduce the size of a semiconductor module and prevent an increase in size of a manufacturing apparatus and a transfer apparatus.

It is a top view which shows the semiconductor device which concerns on Embodiment 1 of this invention. It is sectional drawing in alignment with I-II of FIG. It is sectional drawing which shows the semiconductor device which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the semiconductor device which concerns on Embodiment 3 of this invention. It is a top view which shows the semiconductor device which concerns on Embodiment 4 of this invention. It is sectional drawing along I-II of FIG. It is sectional drawing which shows the modification of the semiconductor device which concerns on Embodiment 4 of this invention.

  A semiconductor device and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a top view showing a semiconductor device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view taken along the line I-II in FIG. A transfer mold type semiconductor module 2 is attached to the cooling jacket 1.

  The semiconductor module 2 includes a base plate 3, cooling fins 5 including a plurality of fins 4 provided below the base plate 3, a semiconductor element 6 mounted on the mounting portion 3 a of the base plate 3, and the semiconductor element 6 and the mounting portion 3 a. And a resin 7 for sealing. The base plate 3 includes a mounting portion 3a, an extending portion 3b extending from the mounting portion 3a in the lateral direction, and an extending portion 3c extending from the mounting portion 3a in the opposite direction to the extending portion 3b. The extending portions 3 b and 3 c extend from the four corners of the rectangular resin 7 of the semiconductor module 2 in opposite directions.

  On the upper surface of the cooling jacket 1, a fixing portion 9 having an insertion port 8, a cooling water channel 10, and an O-ring groove 11 are provided. The extended portion 3 b of the base plate 3 is inserted into the insertion port 8 of the fixed portion 9. An extending portion 3 c of the base plate 3 is fixed to the cooling jacket 1 by screws 12. The plurality of fins 4 are accommodated in the cooling water channel 10 of the cooling jacket 1. An O-ring 13 is used in the O-ring groove 11 to prevent water leakage.

  Then, the manufacturing method of this Embodiment is demonstrated. First, the semiconductor element 6 is mounted on the mounting portion 3 a of the base plate 3 of the cooling fin 5, and the semiconductor element 6 and the mounting portion 3 a are sealed with the resin 7 to form the semiconductor module 2.

  Next, the extending portion 3 b of the base plate 3 extending in the lateral direction from the mounting portion 3 a is inserted into the insertion port 8 of the fixing portion 9 of the cooling jacket 1. Next, with the extended portion 3 b inserted into the insertion port 8, the extended portion 3 c of the base plate 3 extending from the mounting portion 3 a in the direction opposite to the extended portion 3 c is fixed to the cooling jacket 1 with screws. Then, the semiconductor module 2 is attached to the cooling jacket 1.

  In the present embodiment, when the extending portion 3 b of the cooling fin 5 is screwed to the cooling jacket 1 by inserting the extending portion 3 b of the base plate 3 of the cooling fin 5 into the insertion port 8 of the fixing portion 9 of the cooling jacket 1. In comparison, the length of the extending portion 3b can be shortened. As a result, since the semiconductor module 2 can be reduced, it is possible to prevent an increase in size of the manufacturing apparatus and the transfer apparatus. Moreover, the number of parts can be reduced by eliminating the screwing of the extending portion 3b.

Embodiment 2. FIG.
FIG. 3 is a sectional view showing a semiconductor device according to the second embodiment of the present invention. In addition to the configuration of the first embodiment, a groove 14 is provided in the fixed portion 9 below the portion into which the extended portion 3b is inserted.

  Since the extended portion 3b can be inserted into the fixed portion 9 obliquely and deeply by the groove 14, contact between the cooling fin 5 and the cooling jacket 1 can be prevented at the time of insertion. As a result, the cooling performance can be improved by increasing the area of the cooling fins 5.

Embodiment 3 FIG.
FIG. 4 is a cross-sectional view showing a semiconductor device according to Embodiment 3 of the present invention. In addition to the configuration of the first embodiment, a protrusion 15 is provided on the contact surface of the fixed portion 9 with the extended portion 3b. This protrusion 15 presses the extended portion 3b. At the time of assembly, the extended portion 3b and the protrusion 15 are prevented from contacting each other when the extended portion 3b is inserted into the insertion port 8. Then, when the extension portion 3 c is screwed, the extension portion 3 b is pressed by the protrusion 15. Thereby, the adhesiveness of the base plate 3 of the cooling fin 5 and the cooling jacket 1 can be improved.

  In addition, it is necessary to adjust the height of the protrusion 15 so as to produce the above function. The cross-sectional shape of the protrusion is preferably a triangular shape that easily bites into the base plate 3, but may be a semicircular shape or a quadrangular shape.

Embodiment 4 FIG.
FIG. 5 is a top view showing a semiconductor device according to the fourth embodiment of the present invention. 6 is a cross-sectional view taken along line I-II in FIG. Unlike the first embodiment, the extending portions 3b and 3c of the base plate 3 of the semiconductor module 2 are not provided with screw holes. The semiconductor module 2 is attached to the cooling jacket 1 by an external component 16. Specifically, the extending portions 3 b and 3 c of the base plate 3 are pressed against the cooling jacket 1 by the external parts 16 and are fixed by screws. The external component 16 is fixed to the cooling jacket 1 with screws 12. The cross-sectional shape of the external component 16 is S-shaped.

  Since the extending portions 3b and 3c of the base plate 3 are not directly screwed but fixed by the external component 16, there is no need to provide screw holes in the extending portions 3b and 3c. Therefore, the length of the extending portions 3b and 3c can be shortened. As a result, since the semiconductor module 2 can be reduced, it is possible to prevent an increase in size of the manufacturing apparatus and the transfer apparatus. Moreover, the number of parts can be reduced by eliminating the screwing of the extending portion 3b.

  FIG. 7 is a sectional view showing a modification of the semiconductor device according to the fourth embodiment of the present invention. In this example, the cross-sectional shape of the external component 16 is rectangular. As long as the extended portions 3b and 3c of the base plate 3 can be pressed and fixed to the cooling jacket 1, the cross-sectional shape of the external component 16 is not limited to the S shape, and may be a rectangular shape or a square shape.

  The semiconductor element 6 is not limited to being formed of silicon, but may be formed of a wide band gap semiconductor having a larger band gap than silicon. The wide band gap semiconductor is, for example, silicon carbide, a gallium nitride-based material, or diamond. Since the semiconductor element 6 formed of such a wide band gap semiconductor has high withstand voltage and allowable current density, it can be miniaturized. By using this miniaturized element, the semiconductor module 2 incorporating this element can also be miniaturized. Further, since the heat resistance of the element is high, the cooling fin 5 can be downsized and the cooling unit can be air-cooled, so that the semiconductor device can be further downsized. Moreover, since the power loss of the element is low and the efficiency is high, the semiconductor module 2 can be highly efficient.

DESCRIPTION OF SYMBOLS 1 Cooling jacket, 2 Semiconductor module, 3 Base board, 3a Mounting part, 3b, 3c Extension part, 5 Cooling fin, 6 Semiconductor element, 7 Resin, 8 Insert, 9 Fixing part, 14 Groove, 15 Protrusion, 16 External parts

Claims (6)

Mounting a semiconductor element on the mounting portion of the base plate of the cooling fin, and sealing the semiconductor element and the mounting portion with a resin to form a semiconductor module;
Inserting the first extending portion of the base plate extending laterally from the mounting portion into the insertion port of the fixing portion of the cooling jacket;
With the first extending portion inserted into the insertion port, the second extending portion of the base plate extending from the mounting portion in the direction opposite to the first extending portion is used as the cooling jacket. Fixing and attaching the semiconductor module to the cooling jacket ,
In the fixing portion, a groove is provided below a portion into which the first extending portion is inserted .   The method of manufacturing a semiconductor device according to claim 1, wherein the second extending portion is screwed to the cooling jacket. Protrusions are provided on the contact surface of the fixed portion with the first extending portion,
When the first extending portion is inserted into the insertion port, the first extending portion and the protrusion are not in contact with each other,
3. The method of manufacturing a semiconductor device according to claim 1, wherein the first extending portion is pressed by the protrusion when the second extending portion is fixed. 4. A cooling jacket,
A semiconductor module attached to the cooling jacket,
The semiconductor module includes a cooling fin including a base plate, a semiconductor element mounted on a mounting portion of the base plate, and a resin that seals the semiconductor element and the mounting portion.
The cooling jacket has a fixing part having an insertion port,
A first extending portion of the base plate extending laterally from the mounting portion is inserted into the insertion port of the fixing portion;
A second extending portion of the base plate extending from the mounting portion in a direction opposite to the first extending portion is fixed to the cooling jacket ;
The semiconductor device according to claim 1, wherein a groove is provided below the portion into which the first extending portion is inserted in the fixing portion . The semiconductor device according to claim 4 , wherein the second extending portion is screwed to the cooling jacket. A protrusion is provided on a contact surface of the fixed portion with the first extending portion,
6. The semiconductor device according to claim 4, wherein the protrusion presses the first extending portion.

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