JP2014116546A5 - - Google Patents
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- JP2014116546A5 JP2014116546A5 JP2012271420A JP2012271420A JP2014116546A5 JP 2014116546 A5 JP2014116546 A5 JP 2014116546A5 JP 2012271420 A JP2012271420 A JP 2012271420A JP 2012271420 A JP2012271420 A JP 2012271420A JP 2014116546 A5 JP2014116546 A5 JP 2014116546A5
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- JP
- Japan
- Prior art keywords
- cooling jacket
- extending
- base plate
- extending portion
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (12)
前記実装部から横方向に延びる前記ベース板の第１の延設部を冷却ジャケットの固定部の差込口に差し込む工程と、
前記第１の延設部を前記差込口に差し込んだ状態で、前記実装部から前記第１の延設部とは反対方向に延びる前記ベース板の第２の延設部を前記冷却ジャケットに固定して、前記半導体モジュールを前記冷却ジャケットに取り付ける工程とを備えることを特徴とする半導体装置の製造方法。 Mounting a semiconductor element on the mounting portion of the base plate of the cooling fin, and sealing the semiconductor element and the mounting portion with a resin to form a semiconductor module;
Inserting the first extending portion of the base plate extending laterally from the mounting portion into the insertion port of the fixing portion of the cooling jacket;
With the first extending portion inserted into the insertion port, the second extending portion of the base plate extending from the mounting portion in the direction opposite to the first extending portion is used as the cooling jacket. And a step of fixing and attaching the semiconductor module to the cooling jacket.
前記第１の延設部を前記差込口に差し込む際に前記第１の延設部と前記突起が接触しないようにし、
前記第２の延設部を固定する際に前記突起で前記第１の延設部を押さえ付けることを特徴とする請求項１〜３の何れか1項に記載の半導体装置の製造方法。 Protrusions are provided on the contact surface of the fixed portion with the first extending portion,
When the first extending portion is inserted into the insertion port, the first extending portion and the protrusion are not in contact with each other,
4. The method of manufacturing a semiconductor device according to claim 1, wherein the first extending portion is pressed by the protrusion when the second extending portion is fixed. 5.
前記実装部から横方向に延びる前記ベース板の延設部を外付け部品により冷却ジャケットに押し付けて固定して、前記半導体モジュールを前記冷却ジャケットに取り付ける工程とを備えることを特徴とする半導体装置の製造方法。 Mounting a semiconductor element on the mounting portion of the base plate of the cooling fin, and sealing the semiconductor element and the mounting portion with a resin to form a semiconductor module;
A step of attaching the semiconductor module to the cooling jacket by pressing and fixing the extending portion of the base plate extending in the lateral direction from the mounting portion to the cooling jacket by an external component. Production method.
前記冷却ジャケットに取り付けられた半導体モジュールとを備え、
前記半導体モジュールは、ベース板を含む冷却フィンと、前記ベース板の実装部上に実装された半導体素子と、前記半導体素子と前記実装部を封止する樹脂とを有し、
前記冷却ジャケットは、差込口を持つ固定部を有し、
前記実装部から横方向に延びる前記ベース板の第１の延設部が前記固定部の前記差込口に差し込まれ、
前記実装部から前記第１の延設部とは反対方向に延びる前記ベース板の第２の延設部が前記冷却ジャケットに固定されていることを特徴とする半導体装置。 A cooling jacket,
A semiconductor module attached to the cooling jacket,
The semiconductor module includes a cooling fin including a base plate, a semiconductor element mounted on a mounting portion of the base plate, and a resin that seals the semiconductor element and the mounting portion.
The cooling jacket has a fixing part having an insertion port,
A first extending portion of the base plate extending laterally from the mounting portion is inserted into the insertion port of the fixing portion;
Wherein a second elongated portion of said base plate extending in the opposite direction is fixed to the cooling jacket from said first extending portion from the mounting portion.
前記突起が前記第１の延設部を押さえ付けていることを特徴とする請求項７〜９の何れか１項に記載の半導体装置。 A protrusion is provided on a contact surface of the fixed portion with the first extending portion,
The semiconductor device according to claim 7, wherein the protrusion presses the first extending portion.
外付け部品と、
前記冷却ジャケットに前記外付け部品により取り付けられた半導体モジュールとを備え、
前記半導体モジュールは、ベース板を含む冷却フィンと、前記ベース板の実装部上に実装された半導体素子と、前記半導体素子と前記実装部を封止する樹脂とを有し、
前記実装部から横方向に延びる前記ベース板の延設部が前記外付け部品により前記冷却ジャケットに押し付けられて固定されていることを特徴とする半導体装置。 A cooling jacket,
With external parts,
A semiconductor module attached to the cooling jacket by the external component;
The semiconductor module includes a cooling fin including a base plate, a semiconductor element mounted on a mounting portion of the base plate, and a resin that seals the semiconductor element and the mounting portion.
An extended portion of the base plate extending in a lateral direction from the mounting portion is fixed by being pressed against the cooling jacket by the external component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012271420A JP5974880B2 (en) | 2012-12-12 | 2012-12-12 | Semiconductor device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012271420A JP5974880B2 (en) | 2012-12-12 | 2012-12-12 | Semiconductor device and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014116546A JP2014116546A (en) | 2014-06-26 |
| JP2014116546A5 true JP2014116546A5 (en) | 2015-01-15 |
| JP5974880B2 JP5974880B2 (en) | 2016-08-23 |
Family
ID=51172229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012271420A Expired - Fee Related JP5974880B2 (en) | 2012-12-12 | 2012-12-12 | Semiconductor device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5974880B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426940B (en) * | 2016-05-24 | 2019-04-30 | 上汽通用五菱汽车股份有限公司 | A kind of automobile-used DC/DC converter heat dissipating method |
| EP4095900B1 (en) | 2021-05-28 | 2024-01-31 | Hitachi Energy Ltd | Clamping element and method for producing a power semiconductor device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56154054U (en) * | 1980-04-14 | 1981-11-18 | ||
| JP2000082774A (en) * | 1998-06-30 | 2000-03-21 | Sumitomo Electric Ind Ltd | Power module and substrate therefor |
| JP3864282B2 (en) * | 1998-09-22 | 2006-12-27 | 三菱マテリアル株式会社 | Power module substrate, method for manufacturing the same, and semiconductor device using the substrate |
| JP2005302882A (en) * | 2004-04-08 | 2005-10-27 | Nissan Motor Co Ltd | Semiconductor device |
| JP4396366B2 (en) * | 2004-04-08 | 2010-01-13 | 日産自動車株式会社 | Semiconductor device |
| JP2008270295A (en) * | 2007-04-16 | 2008-11-06 | Sumitomo Electric Ind Ltd | Semiconductor device |
-
2012
- 2012-12-12 JP JP2012271420A patent/JP5974880B2/en not_active Expired - Fee Related
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