JP2015023087A5 - Substrate fixing structure and electronic device to which the substrate fixing structure is applied - Google Patents

Substrate fixing structure and electronic device to which the substrate fixing structure is applied Download PDF

Info

Publication number
JP2015023087A5
JP2015023087A5 JP2013148457A JP2013148457A JP2015023087A5 JP 2015023087 A5 JP2015023087 A5 JP 2015023087A5 JP 2013148457 A JP2013148457 A JP 2013148457A JP 2013148457 A JP2013148457 A JP 2013148457A JP 2015023087 A5 JP2015023087 A5 JP 2015023087A5
Authority
JP
Japan
Prior art keywords
substrate
fixing structure
substrate fixing
housing member
boss portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013148457A
Other languages
Japanese (ja)
Other versions
JP6076217B2 (en
JP2015023087A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2013148457A priority Critical patent/JP6076217B2/en
Priority claimed from JP2013148457A external-priority patent/JP6076217B2/en
Priority to CN201420390704.XU priority patent/CN204229069U/en
Publication of JP2015023087A publication Critical patent/JP2015023087A/en
Publication of JP2015023087A5 publication Critical patent/JP2015023087A5/en
Application granted granted Critical
Publication of JP6076217B2 publication Critical patent/JP6076217B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (5)

筐体部材に基板を締結して固定する基板固定構造であって、
前記筐体部材の前記基板の取り付け面から突出して設けられた複数の第1のボス部と、
前記筐体部材の前記基板の取り付け面における前記第1のボス部間に設けられて、当該取り付け面から前記第1のボス部よりも低く突出した第2のボス部とを備え、
前記基板を前記第2のボス部の端面に締結することを特徴とする基板固定構造。
A substrate fixing structure for fastening and fixing a substrate to a housing member,
A plurality of first boss portions provided to protrude from the mounting surface of the substrate of the housing member;
A second boss portion provided between the first boss portions on the mounting surface of the substrate of the housing member and projecting lower than the first boss portion from the mounting surface;
A substrate fixing structure, wherein the substrate is fastened to an end face of the second boss portion.
前記基板を前記第2のボス部の端面に締結したときに前記基板が圧接する前記第1のボス部の端部を接地したことを特徴とする請求項1記載の基板固定構造。   2. The substrate fixing structure according to claim 1, wherein when the substrate is fastened to an end surface of the second boss portion, the end portion of the first boss portion to which the substrate is pressed is grounded. 前記複数の第1のボス部の一部の端面および前記基板に設けられ、前記筐体部材に前記基板を配置したときに互いに係合して前記筐体部材に対する前記基板の位置決めを行う位置決め用係合部を備えることを特徴とする請求項1または請求項2記載の基板固定構造。   Positioning for positioning the substrate with respect to the housing member by being engaged with each other when the substrate is disposed on the housing member, provided on a part of end surfaces of the plurality of first boss portions and the substrate. The board fixing structure according to claim 1, further comprising an engaging portion. 前記第1のボス部の端部は、前記基板に点接触して圧接する形状であることを特徴とする請求項2記載の基板固定構造。   The substrate fixing structure according to claim 2, wherein an end portion of the first boss portion has a shape that makes point contact with the substrate and press-contacts. 筐体部材と基板とを有する電子機器において、In an electronic device having a housing member and a substrate,
前記筐体部材に前記基板を締結して固定する請求項1から請求項4のうちのいずれか1項記載の基板固定構造を備えたことを特徴とする電子機器。An electronic apparatus comprising the substrate fixing structure according to claim 1, wherein the substrate is fastened and fixed to the casing member.
JP2013148457A 2013-07-17 2013-07-17 Substrate fixing structure and electronic device to which the substrate fixing structure is applied Active JP6076217B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013148457A JP6076217B2 (en) 2013-07-17 2013-07-17 Substrate fixing structure and electronic device to which the substrate fixing structure is applied
CN201420390704.XU CN204229069U (en) 2013-07-17 2014-07-15 Electronic equipment and substrate fixture construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013148457A JP6076217B2 (en) 2013-07-17 2013-07-17 Substrate fixing structure and electronic device to which the substrate fixing structure is applied

Publications (3)

Publication Number Publication Date
JP2015023087A JP2015023087A (en) 2015-02-02
JP2015023087A5 true JP2015023087A5 (en) 2015-11-12
JP6076217B2 JP6076217B2 (en) 2017-02-08

Family

ID=52487311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013148457A Active JP6076217B2 (en) 2013-07-17 2013-07-17 Substrate fixing structure and electronic device to which the substrate fixing structure is applied

Country Status (2)

Country Link
JP (1) JP6076217B2 (en)
CN (1) CN204229069U (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019068612A (en) * 2017-09-29 2019-04-25 日本電産株式会社 Motor and substrate mounting structure
JP7148274B2 (en) * 2018-05-25 2022-10-05 株式会社Soken electrical equipment
JP6657457B1 (en) * 2019-03-25 2020-03-04 株式会社ケーヒン Power converter
JPWO2022172900A1 (en) * 2021-02-12 2022-08-18

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5843782Y2 (en) * 1978-10-12 1983-10-04 株式会社東芝 Vibration isolation device for flexible PC board
JPS60129183U (en) * 1984-02-09 1985-08-30 光洋電子工業株式会社 Housing for electronic equipment
JPH05102678A (en) * 1991-10-09 1993-04-23 Fujitsu Ltd Protective spacer of printed board
JPH069190U (en) * 1992-07-06 1994-02-04 株式会社ケンウッド PCB mounting structure
JP2917758B2 (en) * 1993-07-15 1999-07-12 アンデン株式会社 Printed circuit board housing box with vibration parts
JP4267904B2 (en) * 2002-12-05 2009-05-27 株式会社平和 Circuit equipment
JP2004327784A (en) * 2003-04-25 2004-11-18 Toyota Industries Corp Printed board and grounding method thereof
JP4241854B2 (en) * 2007-05-22 2009-03-18 船井電機株式会社 Board mounting structure
JP2009111171A (en) * 2007-10-30 2009-05-21 Hitachi Ltd Circuit board supporting structure of electronic apparatus

Similar Documents

Publication Publication Date Title
JP2013525918A5 (en)
JP2016188975A5 (en)
WO2013175212A3 (en) Electronic reading devices
GB2490073A (en) Component assembly
TWM484902U (en) Heat dissipation apparatus of portable electronic device
WO2015053906A8 (en) Event model for correlating system component states
JP2014206814A5 (en)
JP2014179457A5 (en)
JP2015023087A5 (en) Substrate fixing structure and electronic device to which the substrate fixing structure is applied
JP2013019825A5 (en)
ATE545324T1 (en) HOLDING ELEMENT FOR CIRCUIT BOARD
JP2013130567A5 (en)
JP2016048649A5 (en)
WO2014191893A3 (en) Electrical machine
WO2014095316A3 (en) Electronic device and method for producing an electronic device
JP2014033389A5 (en)
MY175136A (en) Substrate reinforcing structure
JP2016063203A5 (en)
JP2013036810A5 (en)
WO2015158688A3 (en) Electrical grounding component and corresponding electronic board and electronic device
JP2013084476A5 (en)
JP2016051809A5 (en)
JP2016505895A5 (en)
WO2015047974A3 (en) Systems and methods for improving service life of circuit boards
PH12016000026A1 (en) Motor control device