JP2917758B2 - Printed circuit board housing box with vibration parts - Google Patents
Printed circuit board housing box with vibration partsInfo
- Publication number
- JP2917758B2 JP2917758B2 JP17534293A JP17534293A JP2917758B2 JP 2917758 B2 JP2917758 B2 JP 2917758B2 JP 17534293 A JP17534293 A JP 17534293A JP 17534293 A JP17534293 A JP 17534293A JP 2917758 B2 JP2917758 B2 JP 2917758B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- case
- lid
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、振動部品搭載プリント
基板収容箱に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board housing box for mounting a vibration component.
【0002】[0002]
【従来技術】ブザーを搭載するプリント基板を収容、保
持する収容箱(以下、振動部品搭載プリント基板収容
箱、又は単に収容箱ともいう)の従来技術の一例を図5
に示す。プリント基板100がケース102に圧入され
た後、ケース102の開口にカバー103が被着され
る。プリント基板100は、ケース102の内壁面及び
カバー103の内面にて挟圧される。101はコネクタ
である。2. Description of the Related Art FIG. 5 shows an example of the prior art of a housing box for housing and holding a printed circuit board on which a buzzer is mounted (hereinafter also referred to as a printed circuit board housing box mounting a vibration component or simply a housing box).
Shown in After the printed circuit board 100 is pressed into the case 102, the cover 103 is attached to the opening of the case 102. The printed circuit board 100 is sandwiched between the inner wall surface of the case 102 and the inner surface of the cover 103. 101 is a connector.
【0003】他の従来技術を図6に示す。プリント基板
200がケース202に圧入された後、ケース202の
開口にカバー203が被着される。プリント基板200
は、ケース202の内壁面にて挟圧される。201はコ
ネクタである。FIG. 6 shows another prior art. After the printed circuit board 200 is pressed into the case 202, the cover 203 is attached to the opening of the case 202. Printed circuit board 200
Is pressed by the inner wall surface of the case 202. 201 is a connector.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記し
た従来の振動部品搭載プリント基板収容箱では、プリン
ト基板100、200に搭載されたブザーの振動により
プリント基板100、200とケース102、202と
の間で不快なびびり振動が生じるという欠点があった。However, in the above-mentioned conventional printed circuit board storage box with a vibration component, the vibration between the printed circuit boards 100, 200 and the cases 102, 202 is caused by the vibration of the buzzer mounted on the printed circuit boards 100, 200. However, there is a disadvantage that unpleasant chatter vibration occurs.
【0005】このびびり発生の理由は、プリント基板1
00、200の周縁とケース102、202との間に微
小ギャップ(クリアランス)が存在し、プリント基板1
00、200が振動することにより、プリント基板10
0、200の周縁がケース102、202の内壁面に衝
接を繰り返すためである。もちろん、プリント基板10
0、200の周縁とケース102、202との間のクリ
アランスを殆ど0とし、強力な押し込み力にてプリント
基板100、200をケース102、202内に押し込
めば、プリント基板100、200はケース102、2
02の内壁面により強力に挟圧されることになり、びび
りは低減乃至防止されるであろう。しかし、このように
すると、プリント基板100、200の押し込み作業が
極めて困難となり、その採用は実際上不可能となる。The cause of the chatter is that the printed circuit board 1
There is a minute gap (clearance) between the periphery of 00, 200 and the case 102, 202, and the printed circuit board 1
The vibration of the printed circuit board 10
This is because the peripheral edges of 0 and 200 repeatedly contact the inner wall surfaces of the cases 102 and 202. Of course, the printed circuit board 10
When the clearance between the peripheral edge of 0, 200 and the case 102, 202 is almost 0, and the printed circuit boards 100, 200 are pushed into the cases 102, 202 with a strong pushing force, the printed circuit boards 100, 200 become 2
02 will be strongly pressed by the inner wall surface, and chatter will be reduced or prevented. However, in this case, the work of pushing the printed circuit boards 100 and 200 becomes extremely difficult, and the adoption thereof becomes practically impossible.
【0006】その他、プリント基板100、200をケ
ース102、202に設けた螺子穴に螺子にて結合する
ことも考えられるが、構造及び工程及び材料費の増大を
招く不利が生ずる。本発明は上記問題点に鑑みなされた
ものであり、構造及び工程の複雑化を回避しつつ、振動
部品搭載のプリント基板とそれを収容、支持するケース
との間でのびびり発生を抑止可能な振動部品搭載プリン
ト基板収容箱を提供することを、その目的としている。[0006] In addition, it is conceivable to connect the printed boards 100 and 200 to the screw holes provided in the cases 102 and 202 with screws, but there is a disadvantage in that the structure, the process and the material cost are increased. The present invention has been made in view of the above problems, and can prevent chatter between a printed circuit board on which a vibration component is mounted and a case for accommodating and supporting the printed circuit board while avoiding complicated structures and processes. It is an object of the present invention to provide a printed circuit board housing box equipped with a vibration component.
【0007】[0007]
【課題を解決するための手段】第1発明の振動部品搭載
プリント基板収容箱は、振動部品を搭載するプリント基
板の周縁を内壁面にて保持するとともに、前記プリント
基板の主面の厚さ方向に向けて前記プリント基板収容の
ためのプリント基板収容孔を有するケースと、前記プリ
ント基板収容孔を閉鎖する蓋とを備える振動部品搭載プ
リント基板収容箱において、前記ケースの前記内壁面か
ら前記プリント基板の面方向へ突設されて前記プリント
基板の周縁に圧接されるか又は前記プリント基板の周縁
から前記プリント基板の面方向へ突設されて前記ケース
の前記内壁面に圧接される先細形状で複数の支持突起
と、前記ケースから突設されて前記プリント基板の一主
面に当接する先細形状で複数の支持突起と、前記ケース
に脱着可能に設けられる前記蓋から突設されて前記プリ
ント基板の他主面に当接する先細形状で複数の支持突起
と、を備えることを特徴としている。According to a first aspect of the present invention, there is provided a printed circuit board storage box for mounting a vibration component , wherein a peripheral edge of the printed circuit board on which the vibration component is mounted is held on an inner wall surface and the printed board is mounted.
Of the printed circuit board housing in the thickness direction of the main surface of the circuit board.
A case having a printed circuit board accommodation hole for, before Symbol printed vibration component mounting printed circuit board accommodating box and a lid for closing the substrate accommodation hole, projecting from the inner wall surface of the case to the surface direction of the printed circuit board periphery of or the printed circuit board is pressed against the peripheral edge of the printed circuit board Te
Projecting in the direction of the surface of the printed circuit board from the case
A plurality of support protrusions having a tapered shape pressed against the inner wall surface of the printed circuit board;
A plurality of support protrusions having a tapered shape in contact with a surface;
Protruding from the lid provided detachably on the
Tapered shape that contacts the other main surface of the printed circuit board
And characterized in that:
【0008】[0008]
【0009】第2発明の振動部品搭載プリント基板収容
箱は、請求項1記載の振動部品搭載プリント基板収容箱
において、前記蓋の周縁から突設されて前記ケースの前
記内壁面に当接する先細形状で複数の支持突起を備える
ことを特徴としている。 A printed circuit board mounted with a vibration component according to the second invention.
The box is a printed circuit board housing box according to claim 1.
At the front of the case projecting from the periphery of the lid
Equipped with a plurality of support projections with a tapered shape that contacts the inner wall surface
It is characterized by:
【0010】[0010]
【作用及び発明の効果】本発明では、振動部品を搭載す
るプリント基板の周縁は、ケースの内壁面から突設され
る先細形状で複数の支持突起で圧接される。もしくは、
振動部品を搭載するプリント基板の周縁から突設される
先細形状で複数の支持突起はケースの内壁面に圧接され
る。According to the present invention, the periphery of the printed circuit board on which the vibrating component is mounted is pressed into contact with a plurality of support projections having a tapered shape projecting from the inner wall surface of the case. Or
A plurality of support projections having a tapered shape projecting from the periphery of the printed board on which the vibration component is mounted are pressed against the inner wall surface of the case.
【0011】このようにすれば、以下の作用効果を奏す
る。まず第一に、従来のようにケースの内壁面全体にプ
リント基板の周縁を接しさせながらプリント基板を押し
込む場合に比べて、プリント基板の周縁を先細形状の支
持突起にだけ接しさせながらプリント基板を押し込むの
で、支持突起とプリント基板の周縁との間のクリアラン
スがなくても支持突起の弾性変形又は塑性変形によりプ
リント基板をケース内部に押し込むことができる。この
場合、全体としての押し込み力が比較的小さくても支持
突起に掛かる面圧は大きく、上記した支持突起の弾性変
形又は塑性変形が実現し、強固にプリント基板を支持す
ることができ、また、クリアランスがないので、押し込
み後のプリント基板の振動を低減し、しかも、プリント
基板の振動によりプリント基板の周縁がケースの内壁面
に衝接してびびり音が発生するのも防止することができ
る。According to this configuration, the following operation and effect can be obtained. First of all, compared with the conventional case where the printed circuit board is pushed in while the peripheral surface of the printed circuit board is in contact with the entire inner wall surface of the case, the printed circuit board is contacted with the peripheral edge of the printed circuit board only in contact with the tapered support protrusions. Since the pushing is performed, the printed board can be pushed into the case by the elastic deformation or the plastic deformation of the supporting projection even if there is no clearance between the supporting projection and the peripheral edge of the printed board. In this case, even if the pressing force as a whole is relatively small, the surface pressure applied to the support protrusion is large, and the above-described elastic deformation or plastic deformation of the support protrusion is realized, and the printed board can be strongly supported, Since there is no clearance, it is possible to reduce vibration of the printed board after being pushed in, and to prevent chattering noise from being generated due to the periphery of the printed board coming into contact with the inner wall surface of the case due to the vibration of the printed board.
【0012】また、振動部品の駆動によりプリント基板
が振動してもその振動エネルギは小面積の支持突起を通
じてケースに伝達されるのみであるので、振動エネルギ
のケースへの伝達効率が低く、ケースのびびり共振によ
り外部に大きな騒音が漏出することを良好に防止するこ
とができる。プリント基板の周縁側に支持突起を設けた
場合も作用効果は上記と同じである。In addition, even if the printed circuit board vibrates due to the driving of the vibrating parts, the vibration energy is only transmitted to the case through the small-sized support protrusions. The transmission efficiency is low, and it is possible to satisfactorily prevent large noise from leaking to the outside due to chatter resonance of the case. The support projections provided on the peripheral edge of the PCB
If the work for the effect is the same as above.
【0013】また、支持突起の先端部は、弾頭形状又は
かまぼこ形状を有してプリント基板に略点接触又は略線
接触している。このようにすれば、プリント基板又はケ
ースの内壁面に接する支持突起を全体として強固に形成
しても支持突起の先端部の接触面積が低減できる。更
に、ケースはプリント基板の一主面に当接する先細形状
で複数の支持突起を有し、蓋はプリント基板の他主面に
当接する先細形状で複数の支持突起を有する。このよう
にすれば、プリント基板は両主面及び周縁を全て支持突
起に圧接されることになり、上記した各理由と同じ理由
で優れたびびり低減効果を奏する。The tip of the support projection has a warhead shape or a semi-cylindrical shape and is substantially in point or line contact with the printed circuit board. With this configuration, even if the support protrusions that are in contact with the inner wall surface of the printed circuit board or the case are formed firmly as a whole, the contact area of the distal end portions of the support protrusions can be reduced. To a further <br/>, to case the print has a plurality of support projections in tapered contact on one main surface of the substrate, lid plurality of support projections in tapered contact the other main surface of the printed circuit board Having. With this configuration, the printed circuit board is pressed against both the main surface and the entire periphery by the support protrusions, and the excellent chatter reduction effect is exhibited for the same reasons as described above.
【0014】[0014]
【実施例】以下、実施例により具体的に説明する。図1
は、この実施例の振動部品搭載プリント基板収容箱(収
容箱)を、蓋なし状態でケースのプリント基板収容孔側
から見た平面図であり、図2は収容箱を、ケースの底部
側から見た一部破断平面図であり、図3は縦断面図であ
り、図4はケースに蓋を嵌入した状態を示す平面図であ
る。The present invention will be specifically described below with reference to examples. FIG.
FIG. 2 is a plan view of the printed circuit board housing box (housing box) of this embodiment when viewed from the printed circuit board housing hole side of the case without a cover. FIG. 2 shows the housing box from the bottom side of the case. FIG. 3 is a longitudinal sectional view, and FIG. 4 is a plan view showing a state where a lid is fitted in a case.
【0015】プリント基板1は、樹脂からなる薄肉で浅
底角箱形状のケース2に、その底部22と平行かつ底部
22から所定距離離れて保持、収容されている。なお、
該プリント基板1には、IC、レジスタ、コンデンサ、
ダイオードなどの半導体部品や、ブザー(本発明でいう
振動部品)9が装着されている。そして、このブザー9
によって出力される音響振動は、ケース2に開けられた
放音孔(図示されない)から外部に出力される。The printed circuit board 1 is held and accommodated in a thin, shallow, rectangular box-shaped case 2 made of resin at a predetermined distance from the bottom 22 in parallel with the bottom 22. In addition,
The printed circuit board 1 includes an IC, a resistor, a capacitor,
A semiconductor component such as a diode and a buzzer (vibrating component in the present invention) 9 are mounted. And this buzzer 9
The acoustic vibration output from the case 2 is output to the outside through a sound emission hole (not shown) opened in the case 2.
【0016】蓋3は、樹脂からなる正方形状の平薄板か
らなり、その対向2辺に嵌合用の爪31が各2個づつ形
成されている。この爪31は図3に示すようにケース2
の壁部21に開口された受入れ孔23に嵌め込まれて蓋
3がケース2へ止着される。蓋3の周縁をなす4辺には
その面方向へ適数個の支持突起32が突設されており、
支持突起32はケース2の内壁面に圧接されて、蓋3を
固定している。支持突起32の高さは約0.5mm程度
であり、ケース2及び蓋3の共鳴振動による蓋3の周縁
とケース2の内壁面との衝接防止に充分な寸法となって
いる。The lid 3 is made of a square flat thin plate made of resin, and two fitting claws 31 are formed on two opposite sides thereof. As shown in FIG.
The cover 3 is fixed to the case 2 by being fitted into the receiving hole 23 opened in the wall portion 21 of FIG. An appropriate number of support protrusions 32 are provided on four sides forming a peripheral edge of the lid 3 in a surface direction thereof,
The support projection 32 is pressed against the inner wall surface of the case 2 to fix the lid 3. The height of the support projection 32 is about 0.5 mm, which is a size sufficient to prevent the peripheral edge of the lid 3 from contacting the inner wall surface of the case 2 due to the resonance vibration of the case 2 and the lid 3.
【0017】次に、プリント基板1の支持構造を説明す
る。ケース2の内壁面からプリント基板1の周縁をなす
4辺それぞれへ向けて適数個の支持突起4が突設されて
おり、各支持突起4の先端部はプリント基板1の周縁に
圧接されている。また図3に示すように、各支持突起4
の直下に位置してケース2の底部22からリブ状の支持
突起5がケース2の内壁面に沿って膨設されており、各
支持突起5の先端部はプリント基板1の内主面15に圧
接されている。Next, the support structure of the printed circuit board 1 will be described. An appropriate number of support protrusions 4 project from the inner wall surface of the case 2 to each of the four sides forming the periphery of the printed circuit board 1, and the tips of the support protrusions 4 are pressed against the periphery of the printed circuit board 1. I have. Further, as shown in FIG.
The rib-shaped support protrusions 5 are bulged from the bottom 22 of the case 2 along the inner wall surface of the case 2, and the tips of the support protrusions 5 are located on the inner main surface 15 of the printed circuit board 1. It is pressed.
【0018】更に図3に示すように、プリント基板1を
挟んで各支持突起5の直上に位置して蓋3の裏主面から
円錐形状の支持突起6が垂設されており、蓋3をケース
2に止着すれば、支持突起5、6の両先端によりプリン
ト基板1の両面を挟圧する構成となっている。なお、こ
の挟圧方向において支持突起5、6の両先端間のクリア
ランスはプリント基板1の厚さ以下となっており、挟圧
時に蓋3又はケース2の弾性変形が生じるようになって
いる。Further, as shown in FIG. 3, a conical support projection 6 is vertically provided from the back main surface of the lid 3 immediately above each support projection 5 with the printed circuit board 1 interposed therebetween. When the printed circuit board 1 is fixed to the case 2, both ends of the support protrusions 5 and 6 are pressed against both sides of the printed circuit board 1. Note that the clearance between both ends of the support protrusions 5 and 6 in the pinching direction is equal to or less than the thickness of the printed circuit board 1, and the lid 3 or the case 2 is elastically deformed during pinching.
【0019】ここで重要な第一のことは、プリント基板
1の面方向に突出する各支持突起4の先端部41がかま
ぼこ状(半円柱状や3角柱状も含む)に形成されてお
り、このために支持突起4の先端面はプリント基板1の
周縁に垂直方向へ線接触することである。微視的には支
持突起4の先端面の変形により面接触であるが、巨視的
には線接触とみなせる。The first important point here is that the tip 41 of each support projection 4 projecting in the surface direction of the printed board 1 is formed in a semi-cylindrical shape (including a semi-cylindrical shape and a triangular prism shape). For this reason, the tip surface of the support protrusion 4 comes into line contact with the peripheral edge of the printed circuit board 1 in the vertical direction. Microscopically, surface contact occurs due to deformation of the distal end surface of the support projection 4, but macroscopically, it can be regarded as line contact.
【0020】このようにすることにより、上記説明した
びびり低減効果を奏することができる。次に重要な第二
のことは、プリント基板1の面と直角方向に突出する各
支持突起5の先端部51がかまぼこ状(半円柱状や3角
柱状も含む)に形成されており、このために支持突起5
の先端面はプリント基板1の面15に水平方向へ線接触
することである。微視的には支持突起5の先端面の変形
により面接触であるが、巨視的には線接触とみなせる。By doing so, the effect of reducing chatter described above can be obtained. The second important thing is that the tip 51 of each support projection 5 projecting in the direction perpendicular to the surface of the printed circuit board 1 is formed in a semi-cylindrical shape (including a semi-cylindrical shape and a triangular prism shape). Support projections 5
Is in line contact with the surface 15 of the printed circuit board 1 in the horizontal direction. Microscopically, surface contact occurs due to deformation of the distal end surface of the support protrusion 5, but macroscopically, it can be regarded as line contact.
【0021】このようにすることにより、上記説明した
びびり低減効果を奏することができる。次に重要な第三
のことは、支持突起5の上部に支持突起5と一体に支持
突起4が形成されることである。このようにすれば、金
型加工、成形後の離型が容易となる。By doing so, the effect of reducing chatter described above can be obtained. A third important point is that the support projection 4 is formed integrally with the support projection 5 on the support projection 5. This facilitates mold processing and mold release after molding.
【0022】次に重要な第四のことは、蓋3から垂設さ
れる円錐形状の支持突起6の先端部がプリント基板1の
面16に圧接されることであり、支持突起6の先端面は
プリント基板1に略点接触となることである。このよう
にすることにより、上記説明したびびり低減効果を奏す
ることができる。A fourth important point is that the tip of the conical support projection 6 suspended from the lid 3 is pressed against the surface 16 of the printed circuit board 1. Means that the printed circuit board 1 is substantially in point contact. By doing so, the above-described chatter reduction effect can be achieved.
【0023】なお上記実施例では、支持突起4、5の先
端部41、51はかまぼこ状としたが弾頭状(角錐状、
円錐状、半球状を含意する)としてもよい。また、支持
突起4は、プリント基板2の周縁側に設けてもよい。In the above embodiment, the tip portions 41 and 51 of the support projections 4 and 5 are formed in a semicylindrical shape.
Conical or hemispherical). Further, the support protrusion 4 may be provided on the peripheral side of the printed circuit board 2.
【図1】本実施例の振動部品搭載プリント基板収容箱の
蓋なし状態でケースのプリント基板収容孔側から見た平
面図である。FIG. 1 is a plan view of a case in which a printed circuit board housing box with a vibration component according to the present embodiment is viewed from a printed circuit board housing hole side without a lid.
【図2】図1の収容箱のケースの底部側から見た一部破
断平面図である。FIG. 2 is a partially broken plan view of the case of the storage box of FIG. 1 as viewed from the bottom side.
【図3】図1の収容箱の縦断面図である。FIG. 3 is a longitudinal sectional view of the storage box of FIG. 1;
【図4】ケースに蓋を嵌入した状態を示す平面図であ
る。FIG. 4 is a plan view showing a state where a lid is fitted into a case.
【図5】従来の振動部品搭載プリント基板収容箱の斜視
組立図である。FIG. 5 is a perspective assembly view of a conventional printed circuit board housing box mounted with vibration components.
【図6】従来の振動部品搭載プリント基板収容箱の斜視
組立図である。FIG. 6 is a perspective assembly view of a conventional printed circuit board housing box mounted with vibration components.
1はプリント基板、2はケース、3は蓋、4、5、6は
支持突起、9はブザー(振動部品)。1 is a printed circuit board, 2 is a case, 3 is a cover, 4, 5, and 6 are support projections, and 9 is a buzzer (vibrating part).
Claims (2)
内壁面にて保持するとともに、前記プリント基板の主面
の厚さ方向に向けて前記プリント基板収容のためのプリ
ント基板収容孔を有するケースと、前記プリント基板収
容孔を閉鎖する蓋とを備える振動部品搭載プリント基板
収容箱において、 前記ケースの前記内壁面から前記プリント基板の面方向
へ突設されて前記プリント基板の周縁に圧接されるか又
は前記プリント基板の周縁から前記プリント基板の面方
向へ突設されて前記ケースの前記内壁面に圧接される先
細形状で複数の支持突起と、前記ケースから突設されて前記プリント基板の一主面に
当接する先細形状で複数の支持突起と、 前記ケースに脱着可能に設けられる前記蓋から突設され
て前記プリント基板の他主面に当接する先細形状で複数
の支持突起と、 を備えることを特徴とする振動部品搭載プリント基板収
容箱。1. A printed circuit board on which a vibration component is mounted
Hold on inner wallTogether with the main surface of the printed circuit board
Pre-printing for accommodating the printed circuit board in the thickness direction of
With a printed circuit board accommodation holeCase and,PreviousPrinted circuit board
Vibrating component mounted printed circuit board having a lid for closing the hole
In the storage box, a surface direction of the printed circuit board from the inner wall surface of the case
Projected tohandPressed against the periphery of the printed circuit boardKamata
Is the side of the printed circuit board from the periphery of the printed circuit board
And is pressed against the inner wall surface of the case.Destination
A plurality of support projections in a thin shape,Protruding from the case and on one main surface of the printed circuit board
A plurality of support protrusions with a tapered shape to abut, Projecting from the lid detachably provided on the case;
To make contact with the other main surface of the printed circuit board.
Support projections, A printed circuit board mounted with vibration components characterized by having
Box.
収容箱において、 前記蓋の周縁から突設されて前記ケースの前記内壁面に
当接する先細形状で複数の支持突起を備えることを特徴
とする振動部品搭載プリント基板収容箱。 2. The printed circuit board according to claim 1, wherein
In the storage box, the inner wall surface of the case is provided so as to protrude from the peripheral edge of the lid.
Features a plurality of support projections with a tapered shape that abuts
Printed circuit board housing box with vibration components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17534293A JP2917758B2 (en) | 1993-07-15 | 1993-07-15 | Printed circuit board housing box with vibration parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17534293A JP2917758B2 (en) | 1993-07-15 | 1993-07-15 | Printed circuit board housing box with vibration parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0730265A JPH0730265A (en) | 1995-01-31 |
JP2917758B2 true JP2917758B2 (en) | 1999-07-12 |
Family
ID=15994390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17534293A Expired - Fee Related JP2917758B2 (en) | 1993-07-15 | 1993-07-15 | Printed circuit board housing box with vibration parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2917758B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3602185B2 (en) * | 1995-02-16 | 2004-12-15 | ティーオーエー株式会社 | Electrical equipment case |
JP3977322B2 (en) * | 2003-12-01 | 2007-09-19 | 古河電気工業株式会社 | Circuit board housing structure in housing with cover |
JP5402279B2 (en) | 2008-06-27 | 2014-01-29 | 株式会社リコー | Electrophotographic photoreceptor, method for producing the same, and image forming apparatus using the same |
JP5363794B2 (en) | 2008-12-12 | 2013-12-11 | カルソニックカンセイ株式会社 | Substrate support structure |
JP6076217B2 (en) * | 2013-07-17 | 2017-02-08 | 三菱電機株式会社 | Substrate fixing structure and electronic device to which the substrate fixing structure is applied |
JP6645057B2 (en) * | 2015-07-17 | 2020-02-12 | Tdk株式会社 | Converter device and converter device manufacturing method |
-
1993
- 1993-07-15 JP JP17534293A patent/JP2917758B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0730265A (en) | 1995-01-31 |
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