KR102443652B1 - 히트 싱크 커넥터 핀 및 조립체 - Google Patents

히트 싱크 커넥터 핀 및 조립체 Download PDF

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Publication number
KR102443652B1
KR102443652B1 KR1020197012083A KR20197012083A KR102443652B1 KR 102443652 B1 KR102443652 B1 KR 102443652B1 KR 1020197012083 A KR1020197012083 A KR 1020197012083A KR 20197012083 A KR20197012083 A KR 20197012083A KR 102443652 B1 KR102443652 B1 KR 102443652B1
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South Korea
Prior art keywords
substrate
heat sink
fingers
sleeve
pin
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KR1020197012083A
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English (en)
Korean (ko)
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KR20190082204A (ko
Inventor
도날드 엘. 램버트
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B19/00—Bolts without screw-thread; Pins, including deformable elements; Rivets
    • F16B19/04—Rivets; Spigots or the like fastened by riveting
    • F16B19/08—Hollow rivets; Multi-part rivets
    • F16B19/10—Hollow rivets; Multi-part rivets fastened by expanding mechanically
    • F16B19/1027—Multi-part rivets
    • F16B19/1036—Blind rivets
    • F16B19/109—Temporary rivets, e.g. with a spring-loaded pin
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
    • F16B5/0266—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread using springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B21/00—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings
    • F16B21/10—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings by separate parts
    • F16B21/12—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings by separate parts with locking-pins or split-pins thrust into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dowels (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
KR1020197012083A 2016-11-28 2017-11-28 히트 싱크 커넥터 핀 및 조립체 Active KR102443652B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/362,064 2016-11-28
US15/362,064 US10117356B2 (en) 2016-11-28 2016-11-28 Heat sink connector pin and assembly
PCT/US2017/063367 WO2018098456A1 (en) 2016-11-28 2017-11-28 Heat sink connector pin and assembly

Publications (2)

Publication Number Publication Date
KR20190082204A KR20190082204A (ko) 2019-07-09
KR102443652B1 true KR102443652B1 (ko) 2022-09-15

Family

ID=57799449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197012083A Active KR102443652B1 (ko) 2016-11-28 2017-11-28 히트 싱크 커넥터 핀 및 조립체

Country Status (6)

Country Link
US (1) US10117356B2 (enExample)
EP (1) EP3327770B1 (enExample)
JP (1) JP7106536B2 (enExample)
KR (1) KR102443652B1 (enExample)
CN (1) CN109891581B (enExample)
WO (1) WO2018098456A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113251047A (zh) * 2021-04-29 2021-08-13 成都飞机工业（集团）有限责任公司 一种可单边操作的安全插销及其使用方法
US11758690B2 (en) * 2021-06-18 2023-09-12 Nanning Fulian Fugui Precision Industrial Co., Ltd. Heat-dissipation device allowing easy detachment from heat-generating component
US12471221B2 (en) * 2022-10-21 2025-11-11 Raytheon Company Clamping device with pivoting retainer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027038A1 (en) 2009-07-28 2011-02-03 Pen-Chun YU Heat sink anchoring apparatus
JP2011023491A (ja) * 2009-07-15 2011-02-03 Nec Corp 係止治具及び半導体装置

Family Cites Families (20)

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US4213642A (en) * 1979-02-12 1980-07-22 Hartwell Corporation Rotary latch and method of operation
US4760495A (en) * 1987-04-16 1988-07-26 Prime Computer Inc. Stand-off device
US5199733A (en) * 1991-09-09 1993-04-06 Delorme Glen E Safety hitch pin
US5517734A (en) * 1995-04-10 1996-05-21 Korpi; John G. Quick fastener
US5870286A (en) 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US6118659A (en) * 1998-03-09 2000-09-12 International Business Machines Corporation Heat sink clamping spring additionally holding a ZIF socket locked
KR100457220B1 (ko) 2002-02-27 2004-11-16 잘만테크 주식회사 칩셋 냉각용 히트싱크장치
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
JP3894070B2 (ja) 2002-08-06 2007-03-14 富士通株式会社 ヒートシンク、ヒートシンク装置、該ヒートシンクの固定方法及び該ヒートシンクを使用した電子装置
US20040238947A1 (en) 2003-05-28 2004-12-02 Intel Corporation Package and method for attaching an integrated heat spreader
WO2005036927A2 (en) 2003-10-03 2005-04-21 Aavid Thermalloy, Llc Lowered pressure point for heat sink retention hardware
TWM248206U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Clip for heat sink
US7516948B2 (en) * 2004-04-02 2009-04-14 Phd, Inc. Pin clamp accessories
JP4212511B2 (ja) * 2004-05-06 2009-01-21 富士通株式会社 半導体装置及び半導体装置の組立方法
US7489511B2 (en) * 2006-12-28 2009-02-10 Hon Hai Precision Industry Co., Ltd. Heat sink clip
US7852633B2 (en) * 2008-07-24 2010-12-14 Yamaichi Electronics Co., Ltd. Connector for connection to a module board
DE102009002992B4 (de) * 2009-05-11 2014-10-30 Infineon Technologies Ag Leistungshalbleitermodulanordnung mit eindeutig und verdrehsicher auf einem Kühlkörper montierbarem Leistungshalbleitermodul und Montageverfahren
JP3153773U (ja) * 2009-07-08 2009-09-17 本俊 游 放熱モジュール用固定部材
CN102146944A (zh) 2010-02-05 2011-08-10 鸿富锦精密工业（深圳）有限公司 固定装置及使用该固定装置的散热模组
KR101508467B1 (ko) 2014-09-23 2015-04-07 삼성전기주식회사 히트 싱크가 결합된 반도체 모듈

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023491A (ja) * 2009-07-15 2011-02-03 Nec Corp 係止治具及び半導体装置
US20110027038A1 (en) 2009-07-28 2011-02-03 Pen-Chun YU Heat sink anchoring apparatus

Also Published As

Publication number Publication date
EP3327770A1 (en) 2018-05-30
CN109891581A (zh) 2019-06-14
US10117356B2 (en) 2018-10-30
JP7106536B2 (ja) 2022-07-26
EP3327770B1 (en) 2019-03-06
CN109891581B (zh) 2022-12-30
KR20190082204A (ko) 2019-07-09
WO2018098456A1 (en) 2018-05-31
JP2020501354A (ja) 2020-01-16
US20180150114A1 (en) 2018-05-31

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