JP5987347B2 - 電子デバイスの製造方法 - Google Patents
電子デバイスの製造方法 Download PDFInfo
- Publication number
- JP5987347B2 JP5987347B2 JP2012038376A JP2012038376A JP5987347B2 JP 5987347 B2 JP5987347 B2 JP 5987347B2 JP 2012038376 A JP2012038376 A JP 2012038376A JP 2012038376 A JP2012038376 A JP 2012038376A JP 5987347 B2 JP5987347 B2 JP 5987347B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- metal layer
- recess
- bonding material
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 111
- 239000002184 metal Substances 0.000 claims description 111
- 239000000758 substrate Substances 0.000 claims description 109
- 239000000463 material Substances 0.000 claims description 84
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 135
- 239000000919 ceramic Substances 0.000 description 36
- 239000010953 base metal Substances 0.000 description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- 238000000034 method Methods 0.000 description 25
- 239000010949 copper Substances 0.000 description 19
- 239000010931 gold Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 13
- 230000005284 excitation Effects 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011651 chromium Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- -1 silver halide Chemical class 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013175542A JP2013175542A (ja) | 2013-09-05 |
| JP2013175542A5 JP2013175542A5 (enrdf_load_stackoverflow) | 2015-03-19 |
| JP5987347B2 true JP5987347B2 (ja) | 2016-09-07 |
Family
ID=49268215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012038376A Expired - Fee Related JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5987347B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018102998A1 (zh) * | 2016-12-07 | 2018-06-14 | 东莞市国瓷新材料科技有限公司 | 一种带镀铜围坝的陶瓷封装基板制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151813A (ja) * | 1987-12-09 | 1989-06-14 | Seiko Electronic Components Ltd | 小型水晶振動子 |
| JP2004288737A (ja) * | 2003-03-19 | 2004-10-14 | Kyocera Corp | 電子部品搭載用基板およびそれを用いた電子装置 |
| JP2005079558A (ja) * | 2003-09-04 | 2005-03-24 | Miyota Kk | 圧電デバイスの製造方法 |
| JP2005216932A (ja) * | 2004-01-27 | 2005-08-11 | Kyocera Corp | 配線基板及びその製造方法並びに電気部品 |
| JP2012049252A (ja) * | 2010-08-25 | 2012-03-08 | Citizen Finetech Miyota Co Ltd | 電子部品パッケージ |
-
2012
- 2012-02-24 JP JP2012038376A patent/JP5987347B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013175542A (ja) | 2013-09-05 |
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