JP5984199B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5984199B2 JP5984199B2 JP2011282673A JP2011282673A JP5984199B2 JP 5984199 B2 JP5984199 B2 JP 5984199B2 JP 2011282673 A JP2011282673 A JP 2011282673A JP 2011282673 A JP2011282673 A JP 2011282673A JP 5984199 B2 JP5984199 B2 JP 5984199B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- insulating layer
- ceramic ink
- emitting element
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
1a 輪郭線
1b ネジ止め部
1c 基板表面部分
2 絶縁層
2a 凹部
3,4 導電パターン
5 発光素子
6 封止枠
7 封止樹脂
10 大型基板
10a,10b 分割ライン
Claims (3)
- 分割ラインにより形成された輪郭線を有する金属基板と、
該金属基板の前記輪郭線の内側の表面上に形成された白色系のセラミックインクと、
前記金属基板の表面が露出する基板表面部分と、
前記セラミックインク上に配置された導電パターンと、
前記セラミックインク上にライン状に複数実装され且つワイヤーボンドにより前記導電パターンに接続されると共に互いに接続された発光素子と、
前記複数の発光素子を囲うように前記セラミックインク上に固着されたリング状の封止枠と、
前記発光素子を封止する封止樹脂と、
を備え、
前記金属基板は前記基板表面部分に分割ラインからその内側に向かって形成された半円形のネジ止め部を有することを特徴とする発光装置。 - 前記セラミックインクは前記発光素子を実装する位置に凹部を有し、該凹部の深さが前記発光素子のジャンクション面が前記セラミックインクの表面上に出る深さに設定されている請求項1記載の発光装置。
- 前記発光素子はそのジャンクション面が前記セラミックインクの表面上に出る埋め込み丈で前記セラミックインクに埋め込まれた状態に固着実装されている請求項1記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282673A JP5984199B2 (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
US13/726,986 US8835944B2 (en) | 2011-12-26 | 2012-12-26 | Lighting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282673A JP5984199B2 (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013135010A JP2013135010A (ja) | 2013-07-08 |
JP5984199B2 true JP5984199B2 (ja) | 2016-09-06 |
Family
ID=48653657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011282673A Active JP5984199B2 (ja) | 2011-12-26 | 2011-12-26 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8835944B2 (ja) |
JP (1) | JP5984199B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6519123B2 (ja) * | 2013-08-30 | 2019-05-29 | 日亜化学工業株式会社 | 発光素子搭載用基板及び該基板の固定方法 |
JP6371725B2 (ja) * | 2015-03-13 | 2018-08-08 | 株式会社東芝 | 半導体モジュール |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599982A (ja) | 1982-07-08 | 1984-01-19 | Sumitomo Electric Ind Ltd | 連続組立発光ダイオ−ド |
JP2006245336A (ja) * | 2005-03-03 | 2006-09-14 | Koito Mfg Co Ltd | 発光装置 |
JP2006351264A (ja) * | 2005-06-14 | 2006-12-28 | Alps Electric Co Ltd | 電子機能素子モジュール、および前記電子機能素子モジュールを備えた入力装置、ならびに前記入力装置を備えた電子機器。 |
TWI313943B (en) * | 2006-10-24 | 2009-08-21 | Chipmos Technologies Inc | Light emitting chip package and manufacturing thereof |
JP5220373B2 (ja) * | 2007-09-25 | 2013-06-26 | 三洋電機株式会社 | 発光モジュール |
JP5623062B2 (ja) * | 2009-11-13 | 2014-11-12 | シャープ株式会社 | 発光装置およびその製造方法 |
JP2011151248A (ja) * | 2010-01-22 | 2011-08-04 | Seiwa Electric Mfg Co Ltd | 発光装置及び発光装置の製造方法 |
JP2011192930A (ja) * | 2010-03-16 | 2011-09-29 | Toshiba Corp | 基板、基板の製造方法及び灯具 |
JP2011216588A (ja) * | 2010-03-31 | 2011-10-27 | Toshiba Corp | 発光素子モジュール基板、発光素子モジュール及び照明装置 |
-
2011
- 2011-12-26 JP JP2011282673A patent/JP5984199B2/ja active Active
-
2012
- 2012-12-26 US US13/726,986 patent/US8835944B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8835944B2 (en) | 2014-09-16 |
JP2013135010A (ja) | 2013-07-08 |
US20130161662A1 (en) | 2013-06-27 |
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