JP5983819B2 - 熱硬化性樹脂組成物及び硬化膜 - Google Patents
熱硬化性樹脂組成物及び硬化膜 Download PDFInfo
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- JP5983819B2 JP5983819B2 JP2015105822A JP2015105822A JP5983819B2 JP 5983819 B2 JP5983819 B2 JP 5983819B2 JP 2015105822 A JP2015105822 A JP 2015105822A JP 2015105822 A JP2015105822 A JP 2015105822A JP 5983819 B2 JP5983819 B2 JP 5983819B2
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Description
(1)脂環式ジオール若しくは脂環式ジオールに由来する構成単位を有するポリカーボネートジオールを含むジオールと、イソシアネート基を有するポリイソシアネートとを反応させて、ウレタン結合を有するポリイソシアネートを得、これを酸無水物と反応させる。
(2)脂環式ジオール若しくは脂環式ジオールに由来する構成単位を有するポリカーボネートジオール、及びカルボキシル基を有するジヒドロキシ化合物を含むジオールと、イソシアネート基を有するポリイソシアネートとを反応させる。
OCN−X−NCO (4)
(a)数平均分子量(Mn)
Mn=Σ(NiMi)/ΣNi=ΣXiMi
(Xi=分子量Miの分子のモル分率=Ni/ΣNi)
(b)重量平均分子量(Mw)
Mw=Σ(NiMi 2)/ΣNiMi=ΣWiMi
(Wi=分子量Miの分子の重量分率=NiMi/ΣNiMi)
(c)分子量分布(分散度)
分散度=Mw/Mn
A=10×Vf×56.1/(Wp×I)・・・・・(I)
により酸価を算出する。式(I)中、Aは酸価(mgKOH/g)を示し、Vfは0.1NのKOH溶液の滴定量(mL)を示し、Wpはポリウレタン樹脂溶液の質量(g)を示し、Iはポリウレタン樹脂溶液の不揮発分の割合(質量%)を示す。
M1 8−xM2 x(OH)16CO3・nH2O (18)
Mg6Al2(OH)16CO3・4H2O
合成例1
上述の化学式(1B)で表され、R2として、1,4−シクロヘキサンジメタノールに由来する構成単位と1,6−ヘキササンジオールに由来する構成単位とを3:1のモル比で含み、nが平均4〜6の範囲であるポリカーボネートジオール(UM―CARB90(3/1)、宇部興産株式会社製、平均分子量:約900)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、上記ポリカーボネートジオール156.98g(0.175mol)と、4,4’−ジシクロヘキシルメタンジイソシアネートであるデスモジュール−W(住化バイエルウレタン株式会社製)91.70g(0.350mol)と、溶媒であるγ−ブチロラクトン(三菱化学株式会社製)165.80gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
上述の化学式(1B)で表され、R2として、1,4−シクロヘキサンジメタノールに由来する構成単位と1,6−ヘキササンジオールに由来する構成単位とを1:1のモル比で含み、nが平均4〜6の範囲であるポリカーボネートジオール(UM―CARB90(1/1)、宇部興産株式会社製、平均分子量:約900)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、上記ポリカーボネートジオール158.12g(0.175mol)と、デスモジュール−Wを91.70g(0.350mol)と、γ−ブチロラクトン166.55gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
上述の化学式(1B)で表され、R2として、1,4−シクロヘキサンジメタノールに由来する構成単位と1,6−ヘキササンジオールに由来する構成単位とを1:3のモル比で含み、nが平均4〜6の範囲であるポリカーボネートジオール(UM―CARB90(1/3)、宇部興産株式会社製、平均分子量:約900)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、上記ポリカーボネートジオール156.48g(0.175mol)と、デスモジュール−Wを91.70g(0.350mol)と、γ−ブチロラクトン166.55gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させた。
UM―CARB90(1/1)と、上述の式(2)で表され、Rが1,6−ヘキサンジオールに由来する構成単位であり、mが平均9.5〜11.5の範囲であるポリカーボネートジオールであるPCDL T−6001(旭化成ケミカルズ株式会社製)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を79.06g(0.088mol)及びPCDL T−6001を85.53g(0.088mol)と、デスモジュール−Wを91.70g(0.350mol)と、γ−ブチロラクトン170.86gとを加え、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
UM―CARB90(1/1)と、上述の式(2)で表され、Rが1,6−ヘキサンジオールに由来する構成単位であり、mが平均21.5〜23.5の範囲であるポリカーボネートジオールであるPCDL T−6002(旭化成ケミカルズ株式会社製)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を67.77g(0.075mol)及びPCDL T−6002を148.96g(0.075mol)と、デスモジュール−Wを78.60g(0.30mol)と、γ−ブチロラクトン196.89gとを加え、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(3/1)を91.52g(0.10mol)及びPCDL T−6002を99.51g(0.05mol)と、デスモジュール−Wを78.60g(0.30mol)と、γ−ブチロラクトン179.75gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を91.37g(0.10mol)及びPCDL T−6002を99.51g(0.05mol)と、デスモジュール−Wを78.60g(0.30mol)と、γ−ブチロラクトン179.65gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を161.44g(0.179mol)を入れ、4,4’−ジフェニルメタンジイソシアネートであるMILLIONATE MT(日本ポリウレタン工業株式会社製)53.65g(0.214mol)、及び、2,4−トリレンジイソシアネートと2,6−トリレンジイソシアネートとの質量比80:20の混合物であるコスモネートT−80(三井化学ポリウレタン株式会社製)24.89g(0.143mol)と、γ−ブチロラクトン159.93gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
UM―CARB90(1/1)と、上述の式(2)で表され、Rが1,6−ヘキサンジオールに由来する構成単位であり、mが平均21.5〜23.5の範囲であるポリカーボネートジオールであるPLACCEL CD−220(ダイセル化学工業株式会社製)を準備した。攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を71.79g(0.079mol)とPLACCEL CD−220を158.34g(0.079mol)とを入れ、MILLIONATE MTを47.72g(0.190mol)及びコスモネートT−80を22.14g(0.127mol)と、γ−ブチロラクトン200.00gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を158.12g(0.175mol)及びPLACCEL CD−220を348.76g(0.175mol)を入れ、MILLIONATE MTを105.11g(0.60mol)及びコスモネートT−80を48.76g(0.28mol)と、γ−ブチロラクトン440.50gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を121.47g(0.133mol)とPLACCEL CD−220を132.91g(0.067mol)を入れ、MILLIONATE MTを59.91g(0.239mol)及びコスモネートT−80を27.80g(0.160mol)と、γ−ブチロラクトン228.06gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器にUM―CARB90(1/1)を88.03g(0.096mol)とPCDL T−6002を191.17g(0.096mol)とを入れ、MILLIONATE MTを57.81g(0.231mol)及びコスモネートT−80を26.82g(0.154mol)と、γ−ブチロラクトン242.56gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、シクロヘキサンジメタノール(EASTMAN株式会社製)30.93g(0.215mol)と、PCDL T−6001を30.21g(0.031mol)と、PCDL T−6002を69.72g(0.035mol)とを入れ、MILLIONATE MTを84.24g(0.337mol)及びコスモネートT−80を39.08g(0.224mol)と、γ−ブチロラクトン169.45gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM−CARB90(1/1)を128.03(0.140mol)と、PLACCEL CD−220を141.28g(0.070mol)とを入れた。そこに、MILLIONATE MTを52.55g(0.210mol)及びコスモネートT−80を24.38g(0.140)と、γ−ブチロラクトン230.83gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
得られたアミド結合及びイミド結合を有するポリウレタン樹脂の数平均分子量は14100、分散度は3.20、固形分の酸価は13.3mgKOH/gであった。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM−CARB90(1/1)を238.88g(0.268mol)と、2,2−ジメチロールプロピオン酸(日本化成株式会社製)17.71g(0.132mol)と、デスモジュール−Wを110.04g(0.420mol)と、γ−ブチロラクトン370.67gとを仕込み、120℃ですべての原料を溶解させ、7.5時間反応させた。次いで、110℃まで降温し、2−ブタノンオキシム4.04gを加え、1時間反応させた後、反応を終了させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、PLACCEL CD220を628g及びPCDL T−6001を400gと、2,2−ジメチロールプロピオン酸(日本化成株式会社製)41gと、デスモジュール−Wを565g(2.16mol)と、γ−ブチロラクトン1090gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(3/1)を316.24gと、2,2−ジメチロールプロピオン酸20.12g(0.15mol)と、デスモジュール−Wを275.10g(1.05mol)と、γ−ブチロラクトン407.64gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、PCDL T−6001を171.1g(0.175mol)と、デスモジュール−Wを91.7g(0.350mol)と、γ−ブチロラクトン175.2gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、PLACCEL CD−220を687.86g(0.35mol)を入れ、MILLIONATE MTを105.11g(0.60mol)及びコスモネートT−80を48.76g(0.28mol)と、γ−ブチロラクトン561.15gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン結合を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM−CARB90(1/1)を171.58g(0.193mol)と、2,2−ジメチロールプロピオン酸(日本化成株式会社製)11.07g(0.083mol)と、デスモジュール−Wを151.31g(0.578mol)と、γ−ブチロラクトン222.64gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させ、70℃まで降温した。次いで、70℃で反応容器に2,2−ジメチロールプロピオン酸36.89g(0.909mol)とγ−ブチロラクトン153.76gを加え、120℃にて2.5時間反応させた。次いで、110℃まで降温し、2−ブタノンオキシム5.55gを加え、1時間反応させた後、反応を終了させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM−CARB90(1/1)を418.93g(0.470mol)と、2,2−ジメチロールプロピオン酸(日本化成株式会社製)4.02g(0.030mol)と、デスモジュール−Wを137.55g(0.525mol)と、γ−ブチロラクトン565.55gとを仕込み、120℃ですべての原料を溶解させ、9.5時間反応させた。次いで、110℃まで降温し、2−ブタノンオキシム5.05gを加え、1時間反応させた後、反応を終了させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、UM―CARB90(1/1)を225.89g(0.25mol)と、デスモジュール−Wを131.00g(0.50mol)と、γ−ブチロラクトン292.00gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン基を有するポリイソシアネートを生成させた。
攪拌装置、温度計、コンデンサーを備えた反応容器に、ETERNACOLL UM−90(1/1)を271.06(0.30mol)を入れ、MILLIONATE MT(日本ポリウレタン工業株式会社製)60.06(0.24mol)及びコスモネートT−80(三井化学ポリウレタン株式会社製)27.87g(0.16mol)と、γ−ブチロラクトン382.60gとを仕込み、150℃ですべての原料を溶解させ、4時間反応させて、ウレタン基を有するポリイソシアネートを生成させた。次いで、反応液の温度を60℃まで下げ、無水トリメリット酸19.21g(0.10mol)を加え完全に溶解させた後、120℃に昇温してすべての原料を溶解させ、1時間反応させた。
上記の合成例、比較合成例で得られたポリウレタン樹脂と、エポキシ樹脂(テトラグリシジルジアミノジフェニルメタン)であるエポトートYH−434L(東都化成株式会社製)と、ブロックイソシアネートであるBL−3175(住友バイエルウレタン株式会社製)と、γ−ブチロラクトン(三菱化学株式会社製)と、消泡剤としてのBYK−A555(ビッケミー社製、商品名)0.3重量部とをフラスコ内で混合し、U字羽根で混練して、熱硬化性樹脂組成物を調整した。各成分の比率(重量部)を表6、7に示す。
(1)絶縁信頼性
HHBT(High temperature High humidity Bias Test)
厚さ38μmのポリイミドフィルムと、厚さ8μmの銅箔(スパッタ銅)及び銅箔上に形成された厚さ0.2〜0.3μmのSnめっき層を有する櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(銅配線幅/銅配線間幅=15μm/15μm)を準備した。このフレキシブル銅張り積層板に、各熱硬化性樹脂組成物を、SUS200メッシュ板を用いてスクリーン印刷により乾燥膜厚が10μmになるように塗布した。塗布された熱硬化性樹脂組成物を120℃で1時間の加熱により硬化させ、その後、未硬化を防ぐために125℃で7.5時間更に加熱して、保護膜を形成させた。保護膜が形成された基板を65℃、相対湿度95%の雰囲気下において100Vのバイアス電圧を印加し、以下の基準でHHBT抵抗値を評価した。以下の値は、測定開始から100時間経過までの抵抗値の平均値である。
A:1.0×1012Ω以上
B:5.0×1011Ω以上1.0×1012Ω未満
C:1.0×1011Ω以上5.0×1011Ω未満
D:5.0×1010Ω以上1.0×1011Ω未満
E:1.0×1010Ω以上5.0×1010Ω未満
F:1.0×1010Ω未満
厚さ38μmのポリイミドフィルムと、厚さ8μmの銅箔(スパッタ銅)及び銅箔上に形成された厚さ0.2〜0.3μmのSnめっき層を有する櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(銅配線幅/銅配線間幅=12.5μm/12.5μm)を準備した。このフレキシブル銅張り積層板に、各熱硬化性樹脂組成物を、SUS200メッシュ版を用いてスクリーン印刷により乾燥膜厚が10μmになるように塗布した。塗布された熱硬化性樹脂組成物を120℃で1時間の加熱により硬化させて、保護膜を形成させた。保護膜が形成された基板を120℃、相対湿度85%の雰囲気下において100Vのバイアス電圧を印加し、マイグレーション発生までの時間を測定して、以下の基準で絶縁信頼性を評価した。
A:300時間以上
B:200時間以上300時間未満
C:150時間以上200時間未満
D:100時間以上150時間未満
E:50時間以上100時間未満
F:50時間未満
厚さ38μmのポリイミドフィルムと、厚さ8μmの銅箔(スパッタ銅)及び銅箔上に形成された厚さ0.2〜0.3μmのSnめっき層を有する銅配線(配線パターン)とから構成されるフレキシブル銅張り配線板(縦48mm、横35mm)を準備した。このフレキシブル銅張り配線板に、各熱硬化性樹脂組成物を、硬化後の厚みが10μmとなる膜厚で塗布した。塗布された熱硬化性樹脂組成物を、120℃で60分間と、その後の150℃で4時間の加熱により硬化させて、保護膜を形成させた。保護膜が形成されたフレキシブル銅張り配線板を、保護膜の面を下にして定盤上に置き、定盤からフレキシブル銅張り配線板の反りの頂点までの距離(mm)を測定し、その値を反り高さとした。測定された反り高さに基づいて、反り性を以下の2段階で評価した。
A:4.0mm未満
B:4.0mm以上6.0mm未満
C:6.0mm以上8.0mm未満
D:8.0mm以上
各熱硬化性樹脂組成物を離型PETフィルムにアプリケータで塗布し、120℃、60分間の加熱により硬化した。硬化した塗膜(膜厚:約30μm)をカミソリで4mm×20mmの大きさに切断してから、離型PETフィルムより剥離した。得られた試験片を用い、熱機械分析装置(TMA)を用いて、下記条件でガラス転移温度を測定した。
チャック間長さ:10mm
昇温速度:10℃/分
荷重:3gf
以下の手順で吸水率を測定した。
i)ガラス板(100mm×100mm)をアセトン中で超音波洗浄し、その質量(W1)を精密天秤で精秤する。
ii)ガラス板(75mm×75mm)の端5mmをマスキングし、ガラス板に熱硬化性樹脂組成物を乾燥膜厚20μmになるように塗布する。塗布後、マスキングを取り外し、120℃、60分間の加熱により塗膜を硬化して、試験片を得る。試験片の質量(W2)を精密天秤により精秤する。
iii)上記試験片をイオン交換水中に25℃で24時間浸漬し、イオン交換水から取り出された試験片に付着している水分を除去してから、試験片の質量(W3)を精秤する。
iV)下記、計算式により吸水率を算出し、以下の4段階で評価した。
計算式:吸水率[%]={(W3−W2)/(W2−W1)}×100
A:1.0%未満
B:1.0%以上1.5%未満
C:1.5%以上2.0%未満
D:2.0%以上
熱硬化性樹脂組成物を離型PETフィルムにアプリケータで塗布し、120℃、60分間の加熱により硬化させた。硬化した塗膜(膜厚:約30μm)をカミソリで10mm幅(長さは約60mm)の短冊状に切断してから、離型PETフィルムより剥離した。得られた試験片に関して精密万能試験機(オートグラフ、島津製作所社製、型番:「AGS−5KNG」)を用いて下記条件で引張り試験を行い、引張り弾性率および伸び率を測定した。
引張り条件:チャック間長さ20mm
引張り速度:5mm/分
厚さ38μmのポリイミドフィルムと、厚さ8μmの銅箔(スパッタ銅)及び銅箔上に形成された厚さ0.2〜0.3μmのSnめっき層を有する櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(縦48mm、横35mm、銅配線幅/銅配線間幅=15μm/15μm)を準備した。このフレキシブル銅張り積層板の基板に、SUS200メッシュ版を用いてスクリーン印刷により乾燥膜厚が10μmになるように塗布し、120℃で1時間と、その後の125℃で7.5時間の加熱により硬化して、図1に示される形態の試験片を得た。硬化後の試験片に対して、MIT試験機を用いて下記条件にてAの位置で保護膜を内側にして折り曲げを繰り返し実施し、導通がとれなくなるサイクル数を求めた。屈曲性は以下の5段階で評価した。
耐MIT試験条件
荷重:100gf
角度:角対向135°
速度:175回/分
先端:R0.38mm円筒
評価基準
A:80回以上
B:60回以上80回未満
C:50回以上60回未満
D:40回以上50回未満
E:40回未満
厚さ38μmのポリイミドフィルムと、厚さ8μmの銅箔(スパッタ銅)及び銅箔上に形成された厚さ0.2〜0.3μmのSnめっき層を有する櫛形の銅配線(配線パターン)とから構成されるフレキシブル銅張り積層板(縦48mm、横35mm、銅配線幅/銅配線間幅=12.5μm/12.5μm)を準備した。このフレキシブル銅張り積層板の基板に、SUS200メッシュ版を用いてスクリーン印刷により乾燥膜厚が10μmになるように塗布し、120℃で1時間と、その後の125℃で7.5時間の加熱により硬化して、図1に示される形態の試験片を得た。硬化後の試験片に対して、MIT試験機を用いて下記条件にてAの位置で保護膜を内側にして折り曲げを繰り返し実施し、導通がとれなくなるサイクル数を求めた。屈曲性は以下5段階で評価した。
耐MIT試験条件
荷重:100gf
角度:角対向135°
速度:175回/分
先端:R1.0mm円筒
評価基準
A:200回以上
B:150回以上200回未満
C:100回以上150回未満
D:80回以上100回未満
E:80回未満
フレキシブル銅張り積層板の基板(銅配線幅/銅配線間幅=15μm/15μm)に、SUS200メッシュ版を用いてスクリーン印刷により乾燥膜厚が10μm、縦15mm×横40mmになるように塗布し、120℃で1時間の加熱により硬化した。硬化後、試料面のクロスカット試験を行い、硬化膜の剥離の度合いを評価した。クロスカット試験は、碁盤目試験は、JIS K5600に準じて100個のマス目に対して残存した目の個数を表記する碁盤目試験により行った。以下3段階で密着性を評価した。
A:100/100(剥離なし=密着性良好)
B:99/100〜95/100
C:<95/100
熱硬化性樹脂組成物を、SUS200メッシュ版で、幅50mmポリイミドフィルムにスクリーン印刷により乾燥膜厚が10μm、塗膜が縦15mm×横40mmになるように塗膜間隔5cmで連続印刷した。印刷後のフィルムを120℃で1時間の加熱により硬化した。連続印刷したポリイミドフィルムを、500gの荷重を加えながら、ロールで巻き取った。25℃、相対湿度60%の雰囲気下において、48時間放置し、熱硬化性樹脂組成物の印刷面とポリイミドフィルムの裏面との接触面の張り付き荷重について以下の基準で評価した。張り付き荷重は、熱硬化性樹脂組成物の印刷面からポリイミドフィルムが剥がれる荷重を測定し、以下3段階で評価した。
張り付き荷重
A:0.23g以下
B:0.23g超1.00g以下
C:1.00g超
フレキシブル銅張り積層板の櫛形基板(銅配線幅/銅配線間幅=15μm/15μm)に、SUS200メッシュ版を用いてスクリーン印刷により乾燥膜厚が10μm、縦15mm×横40mmになるように塗布し、120℃で1時間の加熱により硬化した。硬化後の試験片をオートクレーブにより、121℃、0.2MPa(飽和蒸気圧)の条件で処理し、100時間後の塗膜外観を観察した。以下3段階で塗膜外観を評価した。
A:膨れ、割れ、表面の荒れなし(良好)
B:表面の荒れあり
C:膨れ、割れあり
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