JP5974109B2 - チップ供給装置 - Google Patents
チップ供給装置 Download PDFInfo
- Publication number
- JP5974109B2 JP5974109B2 JP2014545490A JP2014545490A JP5974109B2 JP 5974109 B2 JP5974109 B2 JP 5974109B2 JP 2014545490 A JP2014545490 A JP 2014545490A JP 2014545490 A JP2014545490 A JP 2014545490A JP 5974109 B2 JP5974109 B2 JP 5974109B2
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- JP
- Japan
- Prior art keywords
- frame
- wafer
- plate
- block
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
Description
Claims (5)
- 基板にチップを実装する実装機にチップを供給するチップ供給装置であり、
実装機の作業ヘッドがチップを受け取ることが可能な位置で、ウエハシートを保持するウエハテーブルを備えており、
ウエハテーブルが、
フレームと、
フレームの前部中央に固定されており、ウエハシートの前端と当接するストッパと、
フレームに支持されており、ウエハシートの両側端をクランプする一対のクランプ機構を備えており、
一対のクランプ機構のフレームに対する左右方向の位置が、多段階に変更可能であるチップ供給装置。 - フレームが、前方フレームプレートと、後方フレームプレートと、一対の側方フレームプレートを備えており、
一対のクランプ機構のそれぞれが、前方フレームプレートと後方フレームプレートによって支持されており、
一対のクランプ機構のそれぞれの前端近傍に前方係合部が形成されており、後端近傍に後方係合部が形成されており、
前方フレームプレートに前方係合部と係合可能な前方被係合部が複数形成されており、
前方被係合部の位置と対応する位置で、後方フレームプレートに後方係合部と係合可能な後方被係合部が複数形成されている請求項1のチップ供給装置。 - 一対のクランプ機構のそれぞれが、
メインプレートと、
前方フレームプレートの後面と当接する前方ブロックと、
後方フレームプレートの前面と当接する後方ブロックと、
前方ブロックと後方ブロックの間に配置されており、メインプレートに固定された中間ブロックを備えており、
前方ブロックおよび後方ブロックの一方が、メインプレートに対して前後方向にスライド可能に支持されており、中間ブロックと弾性体を介して接続されており、
前方ブロックおよび後方ブロックの他方が、メインプレートに対して固定されており、
弾性体が圧縮される方向に、メインプレートをフレームに対して移動させることで、前方係合部と前方被係合部の係合が解除され、かつ後方係合部と後方被係合部の係合が解除される請求項2のチップ供給装置。 - 前方被係合部および後方被係合部の少なくとも一方に、弾性体を介してフレームに支持されたガタツキ防止プレートが設けられている請求項3のチップ供給装置。
- メインプレートの上面に、識別マークが設けられている請求項1から4の何れか一項のチップ供給装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/078873 WO2014073057A1 (ja) | 2012-11-07 | 2012-11-07 | チップ供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5974109B2 true JP5974109B2 (ja) | 2016-08-23 |
JPWO2014073057A1 JPWO2014073057A1 (ja) | 2016-09-08 |
Family
ID=50684195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014545490A Active JP5974109B2 (ja) | 2012-11-07 | 2012-11-07 | チップ供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9520317B2 (ja) |
EP (1) | EP2919260B1 (ja) |
JP (1) | JP5974109B2 (ja) |
CN (1) | CN104769706B (ja) |
WO (1) | WO2014073057A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9887111B2 (en) * | 2014-03-24 | 2018-02-06 | Fuji Machine Mfg. Co., Ltd. | Die mounting system and die mounting method |
US9352471B1 (en) * | 2015-01-21 | 2016-05-31 | Applied Materials, Inc. | Substrate gripper apparatus and methods |
TW201714718A (zh) * | 2015-10-21 | 2017-05-01 | Els System Technology Co Ltd | 定心裝置及具有該定心裝置的處理設備 |
CN106611737B (zh) * | 2015-10-26 | 2020-11-10 | 北京北方华创微电子装备有限公司 | 一种压环装置 |
JP2017112227A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社ディスコ | 加工装置 |
CN110164813B (zh) * | 2019-04-22 | 2021-01-26 | 湖北华威科智能股份有限公司 | 一种适用于多尺寸规格的晶圆夹持进给装置 |
CN112687581B (zh) * | 2020-12-10 | 2024-02-02 | 宁波市甬粤芯微电子科技有限公司 | 一种芯片光刻加工设备及芯片加工工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283293A (ja) * | 1994-04-06 | 1995-10-27 | Toshiba Corp | 半導体装置の製造方法 |
JP2005268274A (ja) * | 2004-03-16 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 回転テーブル機構 |
JP2011211055A (ja) * | 2010-03-30 | 2011-10-20 | Lintec Corp | エキスパンド装置 |
JP2012043930A (ja) * | 2010-08-18 | 2012-03-01 | Fuji Mach Mfg Co Ltd | ウェハ供給装置およびチップボンディング装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US5046909A (en) * | 1989-06-29 | 1991-09-10 | Applied Materials, Inc. | Method and apparatus for handling semiconductor wafers |
IL119213A (en) * | 1996-09-06 | 2000-08-31 | Orbot Instr Ltd | Universal chuck for holding plates of various sizes |
US6986636B2 (en) * | 2000-06-09 | 2006-01-17 | Brooks Automation, Inc. | Device for positioning disk-shaped objects |
CN100337164C (zh) * | 2002-12-06 | 2007-09-12 | 精工爱普生株式会社 | 成像装置 |
US7886449B2 (en) * | 2007-02-20 | 2011-02-15 | Electro Scientific Industries, Inc. | Flexure guide bearing for short stroke stage |
US8296937B2 (en) * | 2008-08-19 | 2012-10-30 | Silverbrook Research Pty Ltd | Wafer positioning system |
TW201013835A (en) * | 2008-09-26 | 2010-04-01 | Gudeng Prec Industral Co Ltd | Sheet clamping apparatus |
JP5410388B2 (ja) * | 2010-09-02 | 2014-02-05 | 富士機械製造株式会社 | チップ保持装置,チップ供給装置およびチップ搭載機 |
JP5582646B2 (ja) * | 2010-11-04 | 2014-09-03 | 富士機械製造株式会社 | 部品実装機の廃棄テープ回収装置 |
US8567837B2 (en) * | 2010-11-24 | 2013-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reconfigurable guide pin design for centering wafers having different sizes |
-
2012
- 2012-11-07 WO PCT/JP2012/078873 patent/WO2014073057A1/ja active Application Filing
- 2012-11-07 CN CN201280076903.7A patent/CN104769706B/zh active Active
- 2012-11-07 JP JP2014545490A patent/JP5974109B2/ja active Active
- 2012-11-07 EP EP12887866.7A patent/EP2919260B1/en active Active
- 2012-11-07 US US14/441,305 patent/US9520317B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07283293A (ja) * | 1994-04-06 | 1995-10-27 | Toshiba Corp | 半導体装置の製造方法 |
JP2005268274A (ja) * | 2004-03-16 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 回転テーブル機構 |
JP2011211055A (ja) * | 2010-03-30 | 2011-10-20 | Lintec Corp | エキスパンド装置 |
JP2012043930A (ja) * | 2010-08-18 | 2012-03-01 | Fuji Mach Mfg Co Ltd | ウェハ供給装置およびチップボンディング装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104769706B (zh) | 2017-12-05 |
CN104769706A (zh) | 2015-07-08 |
US9520317B2 (en) | 2016-12-13 |
EP2919260B1 (en) | 2016-08-03 |
EP2919260A4 (en) | 2015-10-28 |
EP2919260A1 (en) | 2015-09-16 |
JPWO2014073057A1 (ja) | 2016-09-08 |
US20150287627A1 (en) | 2015-10-08 |
WO2014073057A1 (ja) | 2014-05-15 |
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