WO2014073057A1 - チップ供給装置 - Google Patents
チップ供給装置 Download PDFInfo
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- WO2014073057A1 WO2014073057A1 PCT/JP2012/078873 JP2012078873W WO2014073057A1 WO 2014073057 A1 WO2014073057 A1 WO 2014073057A1 JP 2012078873 W JP2012078873 W JP 2012078873W WO 2014073057 A1 WO2014073057 A1 WO 2014073057A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
Definitions
- the technology disclosed in this specification relates to a chip supply device that supplies a chip to a mounting machine that mounts the chip on a substrate.
- Japanese Unexamined Patent Application Publication No. 2010-268015 discloses a chip supply device that supplies a chip to a mounting machine that mounts the chip on a substrate.
- the chip supply apparatus includes a wafer table that holds a wafer sheet at a position where the working head of the mounting machine can receive the chip.
- the wafer sheet as used in this specification refers to a wafer holding plate having an opening at the center and a dicing sheet on which a wafer diced into a desired chip shape is attached.
- the wafer sheet can be held by the same wafer table by setting the outer shape of the wafer holding plate to the same tray shape.
- the wafer sheet cannot be held by the same wafer table. Even when the wafer sheets have different sizes, a technique that can be held on the same wafer table is expected.
- the chip supply apparatus includes a wafer table that holds a wafer sheet at a position where the working head of the mounting machine can receive the chip.
- a wafer table is fixed to a frame, a front center of the frame, a stopper that contacts the front end of the wafer sheet, a pair that is supported by the frame and clamps both side edges of the wafer sheet.
- the clamping mechanism is provided. In the chip supply device, the position of the pair of clamp mechanisms in the left-right direction with respect to the frame can be changed in multiple stages.
- the wafer sheet is positioned in the front-rear direction and the left-right direction with respect to the wafer table by the front end of the wafer sheet coming into contact with the stopper and the both ends of the wafer sheet being clamped by a pair of clamping mechanisms. Held.
- wafer sheets of different sizes can be held on the same wafer table by changing the positions of the pair of clamp mechanisms in the left-right direction with respect to the frame.
- FIG. 1 is an external view of a chip supply device 10.
- FIG. It is sectional drawing which looked at the state which assembled
- FIG. 7 is an enlarged view showing details of AA in FIG. 6.
- FIG. 7 is an enlarged view showing details of BB in FIG. 6.
- the frame includes a front frame plate, a rear frame plate, and a side frame plate, and a clamp mechanism is supported by the front frame plate and the rear frame plate.
- a front engaging portion is formed in the vicinity
- a rear engaging portion is formed in the vicinity of the rear end
- a plurality of front engaged portions that can be engaged with the front engaging portion are formed on the front frame plate.
- the rear engaged portion that can be engaged with the rear engaging portion is formed on the rear frame plate at a position corresponding to the position of the front engaged portion.
- the position of the pair of clamp mechanisms in the left-right direction can be changed in multiple stages with a simple configuration.
- the clamp mechanism is disposed between the main block, the front block that contacts the rear surface of the front frame plate, the rear block that contacts the front surface of the rear frame plate, and the front block and the rear block.
- An intermediate block fixed to the main plate, and one of the front block and the rear block is supported to be slidable in the front-rear direction with respect to the main plate, and is connected to the intermediate block via an elastic body.
- the other of the front block and the rear block is fixed to the main plate, and the main plate is moved relative to the frame in the direction in which the elastic body is compressed, so that the front engagement portion and the front cover are moved.
- the engagement portion is disengaged, and the rear engagement portion and the rear engaged portion are disengaged.
- Door can be.
- the operator grips the main plate and moves the main plate relative to the frame in the direction in which the elastic body is compressed, thereby engaging the front engaging portion and the front engaged portion. Is released, and the engagement between the rear engaging portion and the rear engaged portion is released.
- the clamp mechanism can be locked at different positions by the operator moving the main plate in the left-right direction with respect to the frame in this state.
- the size of the wafer table can be changed by a simple operation without using a tool.
- the above chip supply device can be configured such that at least one of the front engaged portion and the rear engaged portion is provided with an anti-rattle plate supported by the frame via an elastic body.
- the above chip supply device can be configured such that an identification mark is provided on the upper surface of the main plate.
- the position of the clamp mechanism in the left-right direction is recognized by capturing the identification mark using the camera for capturing the wafer sheet and detecting the position by image processing. Can do.
- the mounting machine mounts the chip supplied from the chip supply device 10 on the substrate carried in from the upstream production apparatus, and carries the substrate on which the chip is mounted to the downstream production apparatus.
- the chip supply apparatus 10 includes a magazine storage unit 12 and a wafer transfer unit 14.
- the direction in which the mounting machine is located when viewed from the chip supply device 10 in a state where the chip supply device 10 is assembled to the mounting machine is referred to as the front, and the opposite direction is referred to as the rear.
- the left and right direction and the up and down direction mean the left and right direction and the up and down direction when the direction in which the mounting machine is located as viewed from the chip supply device 10 is the front.
- FIG. 2 shows a state in which the chip supply device 10 is assembled to the mounting machine M.
- the front portion of the wafer transfer unit 14 is disposed inside the mounting machine M.
- the magazine housing portion 12 of the chip supply device 10 includes a housing 20, a magazine 22, and a magazine lifting mechanism 24.
- the housing 20 accommodates a magazine 22 and a magazine lifting mechanism 24.
- a carry-out port 26 for carrying out the wafer sheet W accommodated in the magazine 22 is formed on the front surface of the housing 20, a carry-out port 26 for carrying out the wafer sheet W accommodated in the magazine 22 is formed.
- the wafer sheet W of the present embodiment refers to a wafer holding plate having a substantially circular opening at the center and a dicing sheet on which a wafer diced into a desired chip shape is attached.
- An opening / closing lid 20a that is opened and closed by an operator is formed on the rear surface of the housing 20.
- the magazine 22 includes a plurality of wafer sheet storage portions 28 for storing wafer sheets W.
- the plurality of wafer sheet accommodating portions 28 are stacked in the height direction.
- Each wafer sheet storage unit 28 stores a wafer sheet W.
- the magazine 22 is formed in a rectangular tube shape with an open front and rear surface. An operator of the chip supply device 10 can open the opening / closing lid 20 a of the housing 20 and supply the wafer sheet W to the wafer sheet storage unit 28 from the rear surface of the magazine 22.
- the magazine lifting mechanism 24 has a ball screw 30 and a motor 32 that rotates the ball screw 30.
- a nut (not shown) that engages with the ball screw 30 is fixed to the magazine 22. For this reason, when the ball screw 30 is rotated by the motor 32, the magazine 22 moves up and down in the housing 20. By moving the magazine 22 in the vertical direction, an arbitrary wafer sheet accommodating portion 28 of the magazine 22 can be made to coincide with the height of the carry-out port 26 of the housing 20. As a result, the wafer sheet W can be unloaded from the wafer sheet storage unit 28 to the wafer transfer unit 14 through the unloading port 26.
- the wafer transfer unit 14 includes a stage 34, a stage elevating mechanism 36 that elevates and lowers the stage 34, a wafer table 38, a work head 40, and the like.
- the stage elevating mechanism 36 moves the stage 34 up and down.
- the stage elevating mechanism 36 includes a ball screw 42 and a motor 44 that rotates the ball screw 42.
- a nut (not shown) that engages with the ball screw 42 is fixed to the stage 34. For this reason, when the ball screw 42 is rotated by the motor 44, the stage 34 moves in the vertical direction.
- the wafer table 38 is supported so as to be slidable in the front-rear direction with respect to the stage 34.
- the wafer table 38 can hold the wafer sheet W carried out of the magazine 22.
- the wafer table 38 is moved between a wafer sheet supply position 38a positioned behind the wafer transfer section 14 and a chip supply position 38b positioned in front of the wafer transfer section 14 by driving an actuator (not shown). Is possible.
- the wafer table 38 can be rotated around the vertical axis with respect to the stage 34.
- the wafer table 38 can adjust the angle around the vertical axis with respect to the stage 34 by driving a motor (not shown).
- the work head 40 is supported with respect to the stage 34 so as to be movable in the front-rear direction and the left-right direction.
- the work head 40 moves relative to the stage 34 in the front-rear direction and the left-right direction by driving an actuator (not shown).
- the work head 40 is equipped with a wafer pulling mechanism 46, a suction nozzle 48, and a camera 50.
- the wafer pulling mechanism 46 pulls out the wafer sheet W from the wafer sheet storage unit 28 of the magazine storage unit 12 and conveys it to the wafer table 38 at the wafer sheet supply position 38a.
- the suction nozzle 48 can suck a desired chip from the wafer sheet W in a state where the wafer table 38 is at the wafer sheet supply position 38a.
- the camera 50 images the wafer sheet W held on the wafer table 38 from the upper surface in a state where the wafer table 38 is at the wafer sheet supply position 38a. From the image captured by the camera 50, the position and posture of the chip targeted by the suction nozzle 48 and the suction nozzle N, which will be described later, and the state of the wafer table 38 can be recognized.
- the mounting machine M includes a mounting head H.
- the mounting head H has a suction nozzle N and a camera C.
- the suction nozzle N can suck a desired chip from the wafer sheet W in a state where the wafer table 38 is at the chip supply position 38b.
- the suction nozzle N operates based on the position and orientation of the chip recognized from the image captured by the camera 50, but may be operated by recognizing the position and orientation of the chip from the image captured by the camera C.
- the mounting head H can move in the front-rear direction and the left-right direction inside the mounting machine M, and the chip sucked by the suction nozzle N can be mounted on the substrate.
- the stage 34 peels the chip from the dicing sheet by pushing up the wafer sheet W from below the wafer table 38.
- a push-up mechanism that facilitates operation
- a pod changer that replaces the pod of the push-up mechanism
- a nozzle changer that replaces the suction nozzle 48, and the like.
- the wafer table 38 of this embodiment can hold wafer sheets of various sizes such as 6 inches, 8 inches, or 12 inches.
- FIG. 3 shows a case where the wafer table 38 holds a 6-inch wafer sheet W.
- FIG. 4 shows a case where the wafer table 38 holds an 8-inch wafer sheet W.
- FIG. 5 shows a case where the wafer table 38 holds a 12-inch wafer sheet W.
- the wafer table 38 includes a frame 60, a stopper 62, and a pair of clamp mechanisms 64 and 66.
- the frame 60 is formed in a rectangular frame shape having an opening in the center.
- the frame 60 includes a front frame plate 60a, a rear frame plate 60b, and a pair of side frame plates 60c and 60d.
- a stopper 62 is provided on the upper surface of the center portion of the front frame plate 60a. When the front end of the wafer sheet W comes into contact with the stopper 62, the wafer sheet W is positioned in the front-rear direction with respect to the wafer table 38.
- the clamp mechanisms 64 and 66 include main plates 68 and 70 and sub-plates 72 and 74, respectively.
- One clamp mechanism 64 includes a side plate 76
- the other clamp mechanism 66 includes a side stopper 78.
- the main plates 68 and 70 are supported by the front frame plate 60a and the rear frame plate 60b so as to span the opening of the frame 60 in the front-rear direction.
- the main plates 68 and 70 extend so as to overlap the upper surface of the front frame plate 60a.
- the main plates 68 and 70 extend so as to overlap the upper surface of the rear frame plate 60b.
- the main plates 68 and 70 are supported so as to be slidable in the left-right direction with respect to the frame 60.
- the main plates 68 and 70 are locked with respect to the frame 60 at positions set in advance according to the size of the wafer sheet W to be held.
- the wafer sheet W pulled out by the wafer pulling mechanism 46 is moved forward until the front end abuts against the stopper 62 with both side ends being placed on the upper surfaces of the main plates 68 and 70.
- the side stopper 78 is disposed between the main plate 70 and the sub plate 74.
- the side stopper 78 is fixed to the main plate 70.
- the side stopper 78 guides the forward movement of the wafer sheet W and positions the side edge of the wafer sheet W.
- the side plate 76 is disposed between the main plate 68 and the sub plate 72.
- the side plate 76 is supported so as to be slidable in the left-right direction with respect to the main plate 68, and slides in the left-right direction by driving the air cylinder.
- the side plate 76 is slid toward the side stopper 78.
- the wafer sheet W is sandwiched from the left and right by the side stopper 78 and the side plate 76, and the wafer sheet W is positioned in the left-right direction with respect to the wafer table 38.
- the sub plates 72 and 74 are supported so as to be movable in the vertical direction with respect to the main plates 68 and 70, and are moved in the vertical direction by driving the air cylinder.
- the sub plates 72 and 74 are directed toward the main plates 68 and 70. To move.
- the side edge of the wafer sheet W is sandwiched from above and below by the main plates 68 and 70 and the sub plates 72 and 74.
- the side edge of the wafer sheet W is clamped, and the wafer sheet W is held on the wafer table 38.
- identification marks 68a and 70a are provided on the upper surfaces of the main plates 68 and 70, respectively. Recognizing the size of the wafer sheet W that can be held by the wafer table 38 by detecting the positions of the identification marks 68a and 70a in images taken by the camera 50 of the wafer transfer unit 14 and the camera C of the mounting machine M. Can do.
- FIG. 6 is a view of the wafer table 38 as viewed from the lower surface side.
- FIG. 7 is an enlarged view of the AA portion of FIG. 6, and
- FIG. 8 is an enlarged view of the BB portion of FIG.
- a front block 80 that abuts the rear surface of the front frame plate 60a is provided in front of the lower surface side of the main plate 68.
- the front block 80 is fixed to the main plate 68.
- the front block 80 is formed with an engaging claw 84 that engages with an engaging groove 82 formed on the lower surface side of the front frame plate 60a.
- the engaging claw 84 is formed in a trapezoidal shape whose width is narrowed toward the tip, and the engaging groove 82 is also formed in a trapezoidal shape whose width is narrowed toward the back. As a result, the engagement claw 84 can be easily engaged and disengaged from the engagement groove 82.
- a plurality of engaging grooves 82 are formed at positions corresponding to the size of the wafer sheet W held by the wafer table 38.
- a rear block 86 that contacts the front surface of the rear frame plate 60b, and an intermediate block 90 connected to the rear block 86 via a spring 88. Yes.
- the intermediate block 90 is fixed to the main plate 68 at a position between the front block 80 and the rear block 86.
- the rear block 86 is supported so as to be slidable in the front-rear direction with respect to the main plate 68.
- the rear block 86 is formed with a flange 92 extending so as to overlap the lower surface of the rear frame plate 60b.
- a positioning pin 96 that is engaged with a positioning groove 94 formed outside the rear frame plate 60b is fixed to the rear end of the lower surface side of the main plate 68. As shown in FIG. 8, a plurality of positioning grooves 94 are formed at positions corresponding to the size of the wafer sheet W held by the wafer table 38. The position where the positioning groove 94 is formed in the rear frame plate 60b and the position where the engagement groove 82 is formed in the front frame plate 60a correspond to each other.
- the spring 88 is compressed, and an elastic restoring force acting in a direction away from each other acts on the rear block 86 and the intermediate block 90.
- the rear block 86 is pressed against the front surface of the rear frame plate 60b, and the front block 80 is pressed against the rear surface of the front frame plate 60a.
- the engaging claws 84 are reliably engaged with the engaging grooves 82, and the positioning pins 96 are securely engaged with the positioning grooves 94, and the clamp mechanism 64 is locked with respect to the frame 60.
- the operator When the clamp mechanism 64 is slid in the left-right direction with respect to the frame 60, the operator first holds the main plate 68 and pulls the main plate 68 backward with respect to the frame 60. As a result, the spring 88 is compressed, the entire main plate 68 slides backward, the engaging claw 84 of the front block 80 is disengaged from the engaging groove 82, and the positioning pin 96 is disengaged from the positioning groove 94. The operator slides the main plate 68 in the left-right direction with respect to the frame 60 while maintaining this state.
- the elastic restoring force of the spring 88 causes the engagement of the front block 80.
- the claw 84 engages with the engaging groove 82 and the positioning pin 96 engages with the positioning groove 94.
- a backlash prevention plate 98 is provided on the lower surface side of the rear frame plate 60b.
- the rattle prevention plate 98 is supported so as to be slidable slightly with respect to the rear frame plate 60b in the left-right direction (specifically, within a range smaller than the width of the positioning groove 94).
- a guide groove 100 having substantially the same shape as the positioning groove 94 is formed in the rattle prevention plate 98.
- the rattle prevention plate 98 is connected via a spring 102 to a block 104 fixed to the rear frame plate 60b.
- the spring 102 is attached in a compressed state, and biases the rattling prevention plate 98 toward the outside in the left-right direction.
- the positioning pin 96 When the positioning pin 96 is engaged with the positioning groove 94, the positioning pin 96 is pushed in while abutting against the guide groove 100, and the rattle prevention plate 98 is inward in the left-right direction against the bias from the spring 102. Slide. In a state where the positioning pin 96 is engaged with the positioning groove 94, the positioning pin 96 is pressed against the positioning groove 94 outward in the left-right direction by the rattle prevention plate 98 biased by the spring 102. As a result, rattling in the positioning groove 94 of the positioning pin 96 is prevented.
- the operator can change the position of the clamp mechanism in the left-right direction without using a tool.
- the wafer table 38 can be resized very easily.
- the wafer sheet W of any size is positioned with respect to the wafer table 38 with reference to the front end center.
- any size wafer sheet W can be held at a position closest to the mounting machine M.
- the moving distance of the mounting head H of the mounting machine M can be reduced.
- the wafer sheet W can be configured to handle wafers of different sizes without changing the size of the wafer table 38 by mounting wafers of different sizes on the same tray-shaped wafer holding plate. .
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Abstract
Description
Claims (5)
- 基板にチップを実装する実装機にチップを供給するチップ供給装置であり、
実装機の作業ヘッドがチップを受け取ることが可能な位置で、ウエハシートを保持するウエハテーブルを備えており、
ウエハテーブルが、
フレームと、
フレームの前部中央に固定されており、ウエハシートの前端と当接するストッパと、
フレームに支持されており、ウエハシートの両側端をクランプする一対のクランプ機構を備えており、
一対のクランプ機構のフレームに対する左右方向の位置が、多段階に変更可能であるチップ供給装置。 - フレームが、前方フレームプレートと、後方フレームプレートと、一対の側方フレームプレートを備えており、
一対のクランプ機構のそれぞれが、前方フレームプレートと後方フレームプレートによって支持されており、
一対のクランプ機構のそれぞれの前端近傍に前方係合部が形成されており、後端近傍に後方係合部が形成されており、
前方フレームプレートに前方係合部と係合可能な前方被係合部が複数形成されており、
前方被係合部の位置と対応する位置で、後方フレームプレートに後方係合部と係合可能な後方被係合部が複数形成されている請求項1のチップ供給装置。 - 一対のクランプ機構のそれぞれが、
メインプレートと、
前方フレームプレートの後面と当接する前方ブロックと、
後方フレームプレートの前面と当接する後方ブロックと、
前方ブロックと後方ブロックの間に配置されており、メインプレートに固定された中間ブロックを備えており、
前方ブロックおよび後方ブロックの一方が、メインプレートに対して前後方向にスライド可能に支持されており、中間ブロックと弾性体を介して接続されており、
前方ブロックおよび後方ブロックの他方が、メインプレートに対して固定されており、
弾性体が圧縮される方向に、メインプレートをフレームに対して移動させることで、前方係合部と前方被係合部の係合が解除され、かつ後方係合部と後方被係合部の係合が解除される請求項2のチップ供給装置。 - 前方被係合部および後方被係合部の少なくとも一方に、弾性体を介してフレームに支持されたガタツキ防止プレートが設けられている請求項3のチップ供給装置。
- メインプレートの上面に、識別マークが設けられている請求項1から4の何れか一項のチップ供給装置。
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CN201280076903.7A CN104769706B (zh) | 2012-11-07 | 2012-11-07 | 芯片供给装置 |
EP12887866.7A EP2919260B1 (en) | 2012-11-07 | 2012-11-07 | Chip supply apparatus |
US14/441,305 US9520317B2 (en) | 2012-11-07 | 2012-11-07 | Chip supplying apparatus |
JP2014545490A JP5974109B2 (ja) | 2012-11-07 | 2012-11-07 | チップ供給装置 |
PCT/JP2012/078873 WO2014073057A1 (ja) | 2012-11-07 | 2012-11-07 | チップ供給装置 |
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CN106611737B (zh) * | 2015-10-26 | 2020-11-10 | 北京北方华创微电子装备有限公司 | 一种压环装置 |
CN110164813B (zh) * | 2019-04-22 | 2021-01-26 | 湖北华威科智能股份有限公司 | 一种适用于多尺寸规格的晶圆夹持进给装置 |
CN112687581B (zh) * | 2020-12-10 | 2024-02-02 | 宁波市甬粤芯微电子科技有限公司 | 一种芯片光刻加工设备及芯片加工工艺 |
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US20150287627A1 (en) | 2015-10-08 |
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EP2919260A4 (en) | 2015-10-28 |
CN104769706A (zh) | 2015-07-08 |
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JP5974109B2 (ja) | 2016-08-23 |
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