CN104769706B - 芯片供给装置 - Google Patents
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Abstract
本说明书公开一种向在基板上安装芯片的安装机供给芯片的芯片供给装置。该芯片供给装置具备晶圆工作台,该晶圆工作台在安装机的作业头能够接收芯片的位置保持晶圆片。在该芯片供给装置中,晶圆工作台具备:框架;止动件,固定于框架的前部中央,并与晶圆片的前端抵接;及一对夹紧机构,支撑于框架,用于夹紧晶圆片的两侧端。在该芯片供给装置中,能够多级地变更一对夹紧机构相对于框架在左右方向上的位置。
Description
技术领域
本说明书所公开的技术涉及一种向在基板上安装芯片的安装机供给芯片的芯片供给装置。
背景技术
在日本特开2010-268015号公报中,公开有向在基板上安装芯片的安装机供给芯片的芯片供给装置。该芯片供给装置具备晶圆工作台,该晶圆工作台在安装机的作业头能够接收芯片的位置保持晶圆片。此外,本说明书所指的晶圆片是通过在中央具有开口的晶圆保持板上安装切割片而成的,该切割片粘贴有被切割为所希望的芯片形状的晶圆。
发明内容
在芯片供给装置中,存在想要由不同尺寸的晶圆来供给芯片的情况。在现有技术的芯片供给装置中,即使在晶圆的尺寸不同的情况下,也能够通过预先将晶圆保持板的外形形状全部设为相同的托盘形状而利用相同的晶圆工作台来保持晶圆片。在现有技术的芯片供给装置中,在晶圆保持板的外形形状不同从而晶圆片的尺寸不同的情况下,无法利用相同的晶圆工作台来保持晶圆片。希望提供一种即使在晶圆片的尺寸不同的情况下也能够利用相同的晶圆工作台来进行保持的技术。
本说明书公开一种向在基板上安装芯片的安装机供给芯片的芯片供给装置。该芯片供给装置具备晶圆工作台,该晶圆工作台在安装机的作业头能够接收芯片的位置保持晶圆片。在该芯片供给装置中,晶圆工作台具备:框架;止动件,固定于框架的前部中央,并与晶圆片的前端抵接;及一对夹紧机构,支撑于框架,用于夹紧晶圆片的两侧端。在该芯片供给装置中,能够多级地变更一对夹紧机构相对于框架在左右方向上的位置。
在上述芯片供给装置中,晶圆片的前端与止动件抵接,晶圆片的两侧端由一对夹紧机构夹紧,从而晶圆片相对于晶圆工作台在前后方向与左右方向上定位并被保持。在上述芯片供给装置中,通过变更一对夹紧机构的相对于框架的左右方向上的位置,能够利用相同的晶圆工作台来保持不同尺寸的晶圆片。
附图说明
图1是表示芯片供给装置10的外观的图。
图2是从侧方观察将芯片供给装置10组装于安装机M的状态的剖视图。
图3是表示晶圆工作台38保持有6英寸的晶圆片W的状态的图。
图4是表示晶圆工作台38保持有8英寸的晶圆片W的状态的图。
图5是表示晶圆工作台38保持有12英寸的晶圆片W的状态的图。
图6是从下表面侧观察晶圆工作台38的图。
图7是表示图6的A-A的详情的放大图。
图8是表示图6的B-B的详情的放大图。
具体实施方式
上述芯片供给装置能够构成为,框架具备前方框架板、后方框架板及侧方框架板,夹紧机构由前方框架板和后方框架板支撑,在夹紧机构的前端附近形成有前方卡合部,在后端附近形成有后方卡合部,在前方框架板形成有多个能够与前方卡合部卡合的前方被卡合部,在与前方被卡合部的位置对应的位置,在后方框架板形成有多个能够与后方卡合部卡合的后方被卡合部。
根据上述芯片供给装置,能够利用简单的结构多级地变更一对夹紧机构相对于框架在左右方向上的位置。
上述芯片供给装置能够构成为,夹紧机构具备:主板;前方块,与前方框架板的后表面抵接;后方块,与后方框架板的前表面抵接;中间块,配置于前方块与后方块之间,且固定于主板,前方块及后方块中的一方被支撑为能够相对于主板沿前后方向滑动,并经由弹性体而与中间块连接,前方块及后方块中的另一方相对于主板被固定,通过使主板相对于框架向压缩弹性体的方向移动,将前方卡合部与前方被卡合部之间的卡合解除,并且将后方卡合部与后方被卡合部之间的卡合解除。
在上述芯片供给装置中,操作员把持主板而使主板相对于框架向压缩弹性体的方向移动,从而前方卡合部与前方被卡合部之间的卡合被解除,并且后方卡合部与后方被卡合部之间的卡合被解除。在该状态下,操作员使主板相对于框架沿左右方向移动,从而能够在不同的位置锁定夹紧机构。能够在不使用工具的情况下通过简易的操作来进行晶圆工作台的尺寸变更。
上述芯片供给装置能够构成为,在前方被卡合部及后方被卡合部中的至少一方设有防松动板,该防松动板经由弹性体而支撑于框架。
根据上述芯片供给装置,能够在设有防松动板的部位的卡合部与被卡合部之间防止松动产生。
上述芯片供给装置能够构成为,在主板的上表面设有识别标记。
根据上述芯片供给装置,通过使用用于拍摄晶圆片的相机拍摄识别标记并通过图像处理检测其位置,能够识别夹紧机构相对于框架在左右方向上的位置。
实施例
图1所示的芯片供给装置10对安装机供给芯片。安装机将从芯片供给装置10供给的芯片安装于从上游侧的生产装置搬入的基板,并将安装有芯片的基板向下游侧的生产装置搬出。芯片供给装置10具备料仓收容部12和晶圆搬运部14。此外,以下,在将芯片供给装置10组装于安装机的状态下,从芯片供给装置10观察,将安装机所处的方向称作前方,将与其相反的方向称作后方。另外,以下,左右方向、上下方向所指的意思是从芯片供给装置10观察而将安装机所处的方向设为前方的情况下的左右方向、上下方向。
图2表示将芯片供给装置10组装于安装机M的状态。如图2所示,在将芯片供给装置10组装于安装机M的状态下,晶圆搬运部14的前方的部分配置于安装机M的内部。
芯片供给装置10的料仓收容部12具备壳体20、料仓22及料仓升降机构24。
壳体20用于收容料仓22和料仓升降机构24。在壳体20的前表面形成有用于搬出收容于料仓22的晶圆片W的搬出口26。本实施例的晶圆片W是通过在中央具有大致圆形的开口的晶圆保持板上安装切割片而成的,该切割片粘贴有被切割为所希望的芯片形状的晶圆。另外,在壳体20的后表面形成有由操作员进行开闭的开闭盖20a。
料仓22具备收容晶圆片W的多个晶圆片收容部28。多个晶圆片收容部28在高度方向上层叠。在各晶圆片收容部28收容有晶圆片W。料仓22形成为前表面及后表面开口的方筒形状。芯片供给装置10的操作员能够通过打开壳体20的开闭盖20a而从料仓22的后表面向晶圆片收容部28补充晶圆片W。
料仓升降机构24具备:滚珠丝杠30;及马达32,使滚珠丝杠30旋转。与滚珠丝杠30卡合的螺母(未图示)固定于料仓22。因此,当通过马达32使滚珠丝杠30旋转时,料仓22在壳体20内沿上下方向移动。通过使料仓22沿上下方向移动,能够使料仓22的任意的晶圆片收容部28与壳体20的搬出口26的高度一致。由此,能够从晶圆片收容部28通过搬出口26向晶圆搬运部14搬出晶圆片W。
晶圆搬运部14具备:载物台34;载物台升降机构36,用于使载物台34升降;晶圆工作台38;及作业头40等。
载物台升降机构36使载物台34沿上下方向移动。载物台升降机构36具备:滚珠丝杠42;及马达44,使滚珠丝杠42旋转。与滚珠丝杠42卡合的螺母(未图示)固定于载物台34。因此,当通过马达44使滚珠丝杠42旋转时,载物台34沿上下方向移动。
晶圆工作台38被支撑为能够相对于载物台34沿前后方向滑动。晶圆工作台38能够保持从料仓22搬出的晶圆片W。通过驱动促动器(未图示),晶圆工作台38能够在位于晶圆搬运部14的后方的晶圆片供给位置38a与位于晶圆搬运部14的前方的芯片供给位置38b之间移动。另外,晶圆工作台38能够相对于载物台34绕铅垂轴转动。通过驱动马达(未图示),能够调整晶圆工作台38相对于载物台34的绕铅垂轴的角度。
作业头40被支撑为能够相对于载物台34沿前后方向、左右方向移动。通过驱动促动器(未图示),作业头40相对于载物台34沿前后方向及左右方向相对移动。作业头40搭载有晶圆取出机构46、吸嘴48及相机50。晶圆取出机构46从料仓收容部12的晶圆片收容部28取出晶圆片W,并向位于晶圆片供给位置38a的晶圆工作台38搬运。吸嘴48能够在晶圆工作台38位于晶圆片供给位置38a的状态下从晶圆片W吸附所希望的芯片。相机50在晶圆工作台38位于晶圆片供给位置38a的状态下从上表面拍摄被保持于晶圆工作台38的晶圆片W。根据相机50所拍摄到的图像,吸嘴48、后述的吸嘴N能够识别作为吸附对象的芯片的位置及姿势、晶圆工作台38的状态。
在晶圆工作台38的芯片供给位置38b的上方,晶圆搬运部14的上部开口。因此,能够在晶圆工作台38位于芯片供给位置38b的状态下从安装机M接触被保持于晶圆工作台38的晶圆片W。安装机M具备安装头H。安装头H具有吸嘴N和相机C。吸嘴N能够在晶圆工作台38位于芯片供给位置38b的状态下从晶圆片W吸附所希望的芯片。吸嘴N基于根据相机50所拍摄到的图像识别出的芯片的位置及姿势来进行动作,但是也可以根据相机C所拍摄到的图像识别芯片的位置及姿势来进行动作。安装头H能够在安装机M的内部沿前后方向及左右方向移动,从而能够将吸嘴N所吸附的芯片安装于基板。
此外,在载物台34还搭载有顶起机构、更换顶起机构的盒的盒更换器、更换吸嘴48的吸嘴更换器等,该顶起机构在晶圆搬运部14的吸嘴48、安装机M的吸嘴N吸附芯片时从晶圆工作台38的下方顶起晶圆片W,从而容易地从切割片剥离芯片。
本实施例的晶圆工作台38能够保持6英寸、8英寸或12英寸这样的各种尺寸的晶圆片。图3表示晶圆工作台38保持6英寸的晶圆片W的情况。图4表示晶圆工作台38保持8英寸的晶圆片W的情况。图5表示晶圆工作台38保持12英寸的晶圆片W的情况。
如图3~图5所示,晶圆工作台38具备框架60、止动件62及一对夹紧机构64、66。
框架60形成为在中央具有开口的长方形的框形状。框架60具备前方框架板60a、后方框架板60b及一对侧方框架板60c、60d。在前方框架板60a的中央部的上表面设有止动件62。通过使晶圆片W的前端与止动件62抵接,晶圆片W相对于晶圆工作台38在前后方向上被定位。
夹紧机构64具备主板68和辅助板72,夹紧机构66具备主板70和辅助板74。另外,一方的夹紧机构64具备侧板76,另一方的夹紧机构66具备侧止动件78。
主板68、70以沿前后方向架设于框架60的开口的方式由前方框架板60a和后方框架板60b支撑。在主板68、70的前方侧,主板68、70以与前方框架板60a的上表面重叠的方式延伸。在主板68、70的后方侧,主板68、70以与后方框架板60b的上表面重叠的方式延伸。主板68、70被支撑为能够相对于框架60沿左右方向滑动。主板68、70在根据所保持的晶圆片W的大小而预先设定的位置相对于框架60被锁定。由晶圆取出机构46取出的晶圆片W在两侧端载置于主板68、70的上表面的状态下向前方移动直到前端与止动件62抵接为止。
侧止动件78配置于主板70与辅助板74之间。侧止动件78相对于主板70被固定。侧止动件78引导晶圆片W向前方移动,并且进行晶圆片W的侧端的定位。侧板76配置于主板68与辅助板72之间。侧板76被支撑为能够相对于主板68沿左右方向滑动,且通过气缸的驱动沿左右方向滑动。在晶圆工作台38中,当晶圆片W在主板68、70上向前方移动且晶圆片W的前端与止动件62抵接时,使侧板76向侧止动件78滑动。由此,晶圆片W由侧止动件78和侧板76从左右夹持,晶圆片W相对于晶圆工作台38在左右方向上被定位。
辅助板72被支撑为能够相对于主板68沿上下方向移动,辅助板74被支撑为能够相对于主板70沿上下方向移动,且均通过气缸的驱动沿上下方向移动。在晶圆工作台38中,当晶圆片W的前端与止动件62抵接进而晶圆片W由侧止动件78和侧板76从左右夹持时,使辅助板72向主板68移动,使辅助板74向主板70移动。由此,晶圆片W的侧端部由主板68和辅助板72、主板70和辅助板74从上下夹持。由此,晶圆片W的侧端部被夹紧,晶圆片W被保持于晶圆工作台38。
此外,在主板68的上表面设有识别标记68a,在主板70的上表面设有识别标记70a。在晶圆搬运部14的相机50、安装机M的相机C所拍摄到的图像中,通过检测识别标记68a、70a的位置,能够识别晶圆工作台38可保持的晶圆片W的尺寸。
以下,参照图6~图8,以夹紧机构64为例说明变更晶圆工作台38所保持的晶圆片W的尺寸时的尺寸变更。夹紧机构66也与夹紧机构64相同。图6是从下表面侧观察晶圆工作台38的图。另外,图7是图6的A-A部的放大图,图8是图6的B-B部的放大图。
如图7所示,在主板68的下表面侧的前方设有与前方框架板60a的后表面抵接的前方块80。前方块80相对于主板68被固定。在前方块80形成有卡合爪84,该卡合爪84与形成于前方框架板60a的下表面侧的卡合槽82卡合。卡合爪84形成为宽度随着朝向前端而变窄的梯形形状,卡合槽82也形成为宽度随着朝向里侧而变窄的梯形形状。由此,能够容易地进行卡合爪84向卡合槽82的卡合及从卡合槽82的脱离。当卡合爪84卡合于卡合槽82时,主板68的前方侧相对于前方框架板60a被禁止左右方向上的移动。如图7所示,卡合槽82在与晶圆工作台38所保持的晶圆片W的尺寸对应的位置形成有多个。
如图8所示,在主板68的下表面侧的后方设有与后方框架板60b的前表面抵接的后方块86及经由弹簧88而与后方块86连结的中间块90。中间块90在前方块80与后方块86之间的位置相对于主板68被固定。后方块86被支撑为能够相对于主板68沿前后方向滑动。在后方块86形成有以与后方框架板60b的下表面重叠的方式延伸的凸缘92。另外,在主板68的下表面侧的后端固定有定位销96,该定位销96与形成于后方框架板60b的外侧的定位槽94卡合。如图8所示,定位槽94在与晶圆工作台38所保持的晶圆片W的尺寸对应的位置形成有多个。在后方框架板60b形成有定位槽94的位置与在前方框架板60a形成有卡合槽82的位置相互对应。
在将夹紧机构64安装于框架60的状态下,弹簧88被压缩,且对后方块86与中间块90作用使该两者彼此远离的方向上的弹性复原力。由此,后方块86推压后方框架板60b的前表面,并且前方块80推压前方框架板60a的后表面。由此,卡合爪84可靠地卡合于卡合槽82,并且定位销96可靠地卡合于定位槽94,夹紧机构64相对于框架60被锁定。
在使夹紧机构64相对于框架60沿左右方向滑动的情况下,首先,操作员把持主板68,并将主板68相对于框架60向后方下拉。由此,弹簧88压缩,主板68整体向后方滑动,前方块80的卡合爪84从卡合槽82脱离,并且定位销96从定位槽94脱离。在维持该状态的情况下,操作员使主板68相对于框架60沿左右方向滑动。当使主板68移动至所希望的卡合槽82及定位槽94的位置且操作员减弱将主板68向后方下拉的力时,通过弹簧88的弹性复原力,前方块80的卡合爪84卡合于卡合槽82,并且定位销96卡合于定位槽94。由此,能够阶段性地变更夹紧机构64的相对于框架60的左右方向上的位置。
此外,在后方框架板60b的下表面侧设有防松动板98。防松动板98被支撑为能够相对于后方框架板60b沿左右方向略微(具体地说,在比定位槽94的宽度小的范围内)滑动。在防松动板98形成有与定位槽94的形状大致相同的引导槽100。防松动板98经由弹簧102而与固定于后方框架板60b的块104连接。弹簧102在被压缩的状态下被安装,且将防松动板98向左右方向的外侧施力。当定位销96卡合于定位槽94时,定位销96一边与引导槽100抵接一边被压入,防松动板98抵抗来自弹簧102的作用力而向左右方向的内侧滑动。在定位销96卡合于定位槽94的状态下,利用被弹簧102施力的防松动板98,定位销96相对于定位槽94向左右方向的外侧被按压。由此,防止定位销96在定位槽94内松动。
如上所述,根据本实施例,操作员能够在不使用工具的情况下变更夹紧机构的左右方向上的位置。能够极其容易地进行晶圆工作台38的尺寸变更操作。
根据本实施例,无论是何种尺寸的晶圆片W,都能够相对于晶圆工作台38以前端中央为基准进行定位。由此,无论是何种尺寸的晶圆片W,都能够将其保持在距离安装机M最近的位置。能够缩小安装机M的安装头H的移动距离。
此外,作为晶圆片W,通过将尺寸不同的晶圆安装于相同的托盘形状的晶圆保持板,也能够构成为在不变更晶圆工作台38的尺寸的情况下处理不同尺寸的晶圆。
参照附图详细地说明了本发明的代表性且非限定性的具体例。该详细的说明仅为了向本领域技术人员示出用于实施本发明的优选的例子的详情,并未限定本发明的范围。另外,为了提供进一步改善后的芯片供给装置,所公开的追加的特征及发明能够与其他的特征、发明独立地使用、或者共同使用。
另外,上述详细的说明所公开的特征、工序的组合在最广泛的含义下并不是实施本发明时所必须的,特别是仅为了说明本发明的代表性的具体例而记载的内容。而且,上述代表性的具体例的各种特征及独立和从属权利要求所记载的内容的各种特征在提供本发明的追加性并且实用的实施方式时并非一定如此处所记载的具体例那样或者如所列举的顺序那样进行组合。
本说明书及/或权利要求所记载的全部特征作为与实施例及/或权利要求所记载的特征的结构不同的、对申请最初的公开及声明的特定事项的限定,意图单独地并且相互独立地公开。另外,关于全部数值范围及组或者集团的记载作为对申请最初的公开及声明的特定事项的限定,具有公开其中间的结构的意图。
以上,详细地说明了本发明的具体例,但是上述内容仅为示例,并未限定权利要求书。在权利要求书所记载的技术中,包含对以上示例的具体例进行各种变形、变更的内容。本说明书或附图所说明的技术要素单独或通过各种组合来发挥技术实用性,而并未限定于申请时权利要求记载的组合。另外,本说明书或附图所示例的技术能够同时实现多个目的,实现其中的一个目的本身就具有技术实用性。
Claims (5)
1.一种芯片供给装置,向在基板上安装芯片的安装机供给芯片,
所述芯片供给装置具备晶圆工作台,所述晶圆工作台在安装机的作业头能够接收芯片的位置保持晶圆片,
晶圆工作台具备:
框架;
止动件,固定于框架的前部中央,并与晶圆片的前端抵接;及
一对夹紧机构,支撑于框架,用于夹紧晶圆片的两侧端,
能够多级地变更一对夹紧机构相对于框架在左右方向上的位置。
2.根据权利要求1所述的芯片供给装置,其中,
框架具备前方框架板、后方框架板及一对侧方框架板,
一对夹紧机构分别由前方框架板和后方框架板支撑,
在一对夹紧机构各自的前端附近形成有前方卡合部,在后端附近形成有后方卡合部,
在前方框架板形成有多个能够与前方卡合部卡合的前方被卡合部,
在与前方被卡合部的位置对应的位置,在后方框架板形成有多个能够与后方卡合部卡合的后方被卡合部。
3.根据权利要求2所述的芯片供给装置,其中,
一对夹紧机构分别具备:
主板;
前方块,与前方框架板的后表面抵接;
后方块,与后方框架板的前表面抵接;及
中间块,配置于前方块与后方块之间,且固定于主板,
前方块及后方块中的一方被支撑为能够相对于主板沿前后方向滑动,并经由弹性体而与中间块连接,
前方块及后方块中的另一方相对于主板被固定,
通过使主板相对于框架向压缩弹性体的方向移动,而将前方卡合部与前方被卡合部之间的卡合解除,并且将后方卡合部与后方被卡合部之间的卡合解除。
4.根据权利要求3所述的芯片供给装置,其中,
在前方被卡合部及后方被卡合部中的至少一方设有防松动板,所述防松动板经由弹性体而支撑于框架。
5.根据权利要求1~4中任一项所述的芯片供给装置,其中,
在主板的上表面设有识别标记。
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- 2012-11-07 JP JP2014545490A patent/JP5974109B2/ja active Active
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EP2919260B1 (en) | 2016-08-03 |
US9520317B2 (en) | 2016-12-13 |
JPWO2014073057A1 (ja) | 2016-09-08 |
EP2919260A4 (en) | 2015-10-28 |
WO2014073057A1 (ja) | 2014-05-15 |
JP5974109B2 (ja) | 2016-08-23 |
CN104769706A (zh) | 2015-07-08 |
US20150287627A1 (en) | 2015-10-08 |
EP2919260A1 (en) | 2015-09-16 |
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